CN119487627A - 输送装置、输送方法和半导体装置的制造方法 - Google Patents

输送装置、输送方法和半导体装置的制造方法 Download PDF

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Publication number
CN119487627A
CN119487627A CN202280097863.8A CN202280097863A CN119487627A CN 119487627 A CN119487627 A CN 119487627A CN 202280097863 A CN202280097863 A CN 202280097863A CN 119487627 A CN119487627 A CN 119487627A
Authority
CN
China
Prior art keywords
substrate
levitation unit
holding mechanism
unit
designed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280097863.8A
Other languages
English (en)
Chinese (zh)
Inventor
清水良
藤贵洋
山口芳广
小田岛保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jsw Acdina System Co ltd
Original Assignee
Jsw Acdina System Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsw Acdina System Co ltd filed Critical Jsw Acdina System Co ltd
Publication of CN119487627A publication Critical patent/CN119487627A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Recrystallisation Techniques (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280097863.8A 2022-07-07 2022-07-07 输送装置、输送方法和半导体装置的制造方法 Pending CN119487627A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/027014 WO2024009470A1 (ja) 2022-07-07 2022-07-07 搬送装置、搬送方法、及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN119487627A true CN119487627A (zh) 2025-02-18

Family

ID=89453101

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280097863.8A Pending CN119487627A (zh) 2022-07-07 2022-07-07 输送装置、输送方法和半导体装置的制造方法

Country Status (4)

Country Link
US (1) US20250379094A1 (https=)
JP (1) JPWO2024009470A1 (https=)
CN (1) CN119487627A (https=)
WO (1) WO2024009470A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3528577B2 (ja) * 1998-03-04 2004-05-17 セイコーエプソン株式会社 半導体装置の製造方法及びアニール装置
JP4845280B2 (ja) * 2001-03-21 2011-12-28 株式会社半導体エネルギー研究所 レーザアニール装置
JP4610178B2 (ja) * 2002-11-15 2011-01-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4426276B2 (ja) * 2003-10-06 2010-03-03 住友重機械工業株式会社 搬送装置、塗布システム、及び検査システム
JP5078460B2 (ja) * 2007-06-28 2012-11-21 住友重機械工業株式会社 レーザ加工装置、及び、レーザ加工方法
JP2009147240A (ja) * 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP5918518B2 (ja) * 2011-11-30 2016-05-18 川崎重工業株式会社 搬送ワークのヨーイング補正機構とその補正方法
JP6887234B2 (ja) * 2016-09-21 2021-06-16 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
JP6917691B2 (ja) * 2016-10-04 2021-08-11 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法

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Publication number Publication date
JPWO2024009470A1 (https=) 2024-01-11
US20250379094A1 (en) 2025-12-11
WO2024009470A1 (ja) 2024-01-11

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