JPWO2023286681A5 - - Google Patents

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Publication number
JPWO2023286681A5
JPWO2023286681A5 JP2023534751A JP2023534751A JPWO2023286681A5 JP WO2023286681 A5 JPWO2023286681 A5 JP WO2023286681A5 JP 2023534751 A JP2023534751 A JP 2023534751A JP 2023534751 A JP2023534751 A JP 2023534751A JP WO2023286681 A5 JPWO2023286681 A5 JP WO2023286681A5
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JP
Japan
Prior art keywords
adhesive layer
pressure
sensitive adhesive
main surface
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023534751A
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English (en)
Japanese (ja)
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JP7750960B2 (ja
JPWO2023286681A1 (https=
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Priority claimed from PCT/JP2022/026903 external-priority patent/WO2023286681A1/ja
Publication of JPWO2023286681A1 publication Critical patent/JPWO2023286681A1/ja
Publication of JPWO2023286681A5 publication Critical patent/JPWO2023286681A5/ja
Application granted granted Critical
Publication of JP7750960B2 publication Critical patent/JP7750960B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023534751A 2021-07-12 2022-07-07 テープ積層体、マイクロ流路チップ、及びマイクロ流体デバイス Active JP7750960B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021115189 2021-07-12
JP2021115189 2021-07-12
PCT/JP2022/026903 WO2023286681A1 (ja) 2021-07-12 2022-07-07 テープ積層体、マイクロ流路チップ、及びマイクロ流体デバイス

Publications (3)

Publication Number Publication Date
JPWO2023286681A1 JPWO2023286681A1 (https=) 2023-01-19
JPWO2023286681A5 true JPWO2023286681A5 (https=) 2024-10-17
JP7750960B2 JP7750960B2 (ja) 2025-10-07

Family

ID=84920260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023534751A Active JP7750960B2 (ja) 2021-07-12 2022-07-07 テープ積層体、マイクロ流路チップ、及びマイクロ流体デバイス

Country Status (5)

Country Link
US (1) US20240207848A1 (https=)
EP (1) EP4372063A4 (https=)
JP (1) JP7750960B2 (https=)
CN (1) CN117616094A (https=)
WO (1) WO2023286681A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4220185A4 (en) * 2020-09-28 2024-10-23 Sekisui Chemical Co., Ltd. Inspection chip

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4540962B2 (ja) * 2003-10-10 2010-09-08 リンテック株式会社 粘着シートおよびその製造方法
JP4704828B2 (ja) * 2004-09-29 2011-06-22 積水化学工業株式会社 ウエハ貼着用粘着シート及びダイ接着用接着剤層付きｉｃチップの製造方法
US20090092819A1 (en) * 2007-10-09 2009-04-09 Adhesives Research, Inc. Porous pressure sensitive adhesive and tapes
CN102741559B (zh) * 2008-03-11 2014-12-10 积水化学工业株式会社 微流体设备
JP2010202833A (ja) * 2009-03-05 2010-09-16 Sekisui Chem Co Ltd 電子部品加工用粘着テープ
JP5438408B2 (ja) * 2009-07-15 2014-03-12 リンテック株式会社 粘着シートの製造方法
EP2328056B1 (en) * 2009-11-26 2014-09-10 Dialog Semiconductor GmbH Low-dropout linear regulator (LDO), method for providing an LDO and method for operating an LDO
JP2012072007A (ja) * 2010-09-28 2012-04-12 Sekisui Chem Co Ltd ガス発生剤及びマイクロポンプ
JP7088736B2 (ja) * 2017-10-06 2022-06-21 積水化学工業株式会社 表面保護フィルム
JP7144140B2 (ja) 2017-12-15 2022-09-29 積水化学工業株式会社 ガス発生材、ガス発生材の製造方法及びマイクロポンプ
WO2021125153A1 (ja) * 2019-12-19 2021-06-24 昭和電工株式会社 粘着シート

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