JPWO2023286484A5 - - Google Patents

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Publication number
JPWO2023286484A5
JPWO2023286484A5 JP2023535175A JP2023535175A JPWO2023286484A5 JP WO2023286484 A5 JPWO2023286484 A5 JP WO2023286484A5 JP 2023535175 A JP2023535175 A JP 2023535175A JP 2023535175 A JP2023535175 A JP 2023535175A JP WO2023286484 A5 JPWO2023286484 A5 JP WO2023286484A5
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JP
Japan
Prior art keywords
hole conductor
capacitor
hole
porous layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023535175A
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English (en)
Japanese (ja)
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JP7563605B2 (ja
JPWO2023286484A1 (https=
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Publication date
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Priority claimed from PCT/JP2022/022439 external-priority patent/WO2023286484A1/ja
Publication of JPWO2023286484A1 publication Critical patent/JPWO2023286484A1/ja
Publication of JPWO2023286484A5 publication Critical patent/JPWO2023286484A5/ja
Application granted granted Critical
Publication of JP7563605B2 publication Critical patent/JP7563605B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023535175A 2021-07-16 2022-06-02 コンデンサ Active JP7563605B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021117803 2021-07-16
JP2021117803 2021-07-16
PCT/JP2022/022439 WO2023286484A1 (ja) 2021-07-16 2022-06-02 コンデンサ

Publications (3)

Publication Number Publication Date
JPWO2023286484A1 JPWO2023286484A1 (https=) 2023-01-19
JPWO2023286484A5 true JPWO2023286484A5 (https=) 2024-03-04
JP7563605B2 JP7563605B2 (ja) 2024-10-08

Family

ID=84919999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535175A Active JP7563605B2 (ja) 2021-07-16 2022-06-02 コンデンサ

Country Status (5)

Country Link
US (1) US12603233B2 (https=)
JP (1) JP7563605B2 (https=)
CN (1) CN117642833A (https=)
TW (1) TWI831226B (https=)
WO (1) WO2023286484A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI885959B (zh) * 2023-07-28 2025-06-01 日商村田製作所股份有限公司 內建電容器之基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08321666A (ja) 1995-05-26 1996-12-03 Matsushita Electric Works Ltd プリント配線板、及び、その製造方法
JP5011624B2 (ja) 2001-08-30 2012-08-29 日本ケミコン株式会社 固体電解コンデンサ及びその製造方法
JP4839824B2 (ja) * 2005-12-21 2011-12-21 パナソニック株式会社 コンデンサ内蔵基板およびその製造方法
JP2007251101A (ja) * 2006-03-20 2007-09-27 Matsushita Electric Ind Co Ltd 固体電解コンデンサ内蔵回路基板およびそれを用いたインターポーザおよびパッケージ
JP5374814B2 (ja) * 2006-09-20 2013-12-25 富士通株式会社 キャパシタ内蔵型配線基板およびその製造方法
JP4899775B2 (ja) * 2006-10-13 2012-03-21 パナソニック株式会社 固体電解コンデンサの製造方法と固体電解コンデンサ内蔵基板の製造方法
JP2008130722A (ja) * 2006-11-20 2008-06-05 Matsushita Electric Ind Co Ltd 固体電解コンデンサ内蔵回路基板とその製造方法
KR100861619B1 (ko) 2007-05-07 2008-10-07 삼성전기주식회사 방열 인쇄회로기판 및 그 제조방법
TWI373118B (en) * 2007-12-21 2012-09-21 Ind Tech Res Inst Through hole capacitor and method of manufacturing the same
JP5585426B2 (ja) 2010-12-07 2014-09-10 Ｔｄｋ株式会社 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法
JP2012128242A (ja) 2010-12-16 2012-07-05 Kaneka Corp アクティブマトリクス型表示装置用基板
TWI483352B (zh) * 2012-03-12 2015-05-01 Ind Tech Res Inst 固態電解電容基板模組及包括該固態電解電容基板模組的電路板
WO2019221046A1 (ja) * 2018-05-16 2019-11-21 株式会社村田製作所 固体電解コンデンサ
JP2020053588A (ja) 2018-09-27 2020-04-02 株式会社村田製作所 固体電解コンデンサ
JP7180561B2 (ja) * 2019-03-29 2022-11-30 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品

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