JPWO2023276940A1 - - Google Patents

Info

Publication number
JPWO2023276940A1
JPWO2023276940A1 JP2023531929A JP2023531929A JPWO2023276940A1 JP WO2023276940 A1 JPWO2023276940 A1 JP WO2023276940A1 JP 2023531929 A JP2023531929 A JP 2023531929A JP 2023531929 A JP2023531929 A JP 2023531929A JP WO2023276940 A1 JPWO2023276940 A1 JP WO2023276940A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531929A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276940A1 publication Critical patent/JPWO2023276940A1/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023531929A 2021-06-30 2022-06-27 Pending JPWO2023276940A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021108779 2021-06-30
PCT/JP2022/025545 WO2023276940A1 (ja) 2021-06-30 2022-06-27 熱デバイス冷却用ヒートシンク

Publications (1)

Publication Number Publication Date
JPWO2023276940A1 true JPWO2023276940A1 (ja) 2023-01-05

Family

ID=84691421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531929A Pending JPWO2023276940A1 (ja) 2021-06-30 2022-06-27

Country Status (3)

Country Link
JP (1) JPWO2023276940A1 (ja)
TW (1) TW202303071A (ja)
WO (1) WO2023276940A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536897U (ja) * 1991-10-11 1993-05-18 古河電気工業株式会社 ヒートパイプ式放熱装置
JPH08105698A (ja) * 1994-10-03 1996-04-23 Mitsubishi Cable Ind Ltd ヒ−トパイプ冷却器及び筐体
JP5227672B2 (ja) * 2008-06-17 2013-07-03 古河電気工業株式会社 ヒートパイプの固定方法およびヒートシンク
JP2010267435A (ja) * 2009-05-13 2010-11-25 Fujine Sangyo:Kk Ｌｅｄ放熱装置およびｌｅｄ照明装置
US20150219400A1 (en) * 2012-12-06 2015-08-06 Furukawa Electric Co., Ltd. Heat sink
JP6697112B1 (ja) * 2019-05-10 2020-05-20 古河電気工業株式会社 ヒートシンク

Also Published As

Publication number Publication date
WO2023276940A1 (ja) 2023-01-05
TW202303071A (zh) 2023-01-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231012