JPWO2023248860A5 - - Google Patents

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Publication number
JPWO2023248860A5
JPWO2023248860A5 JP2024528869A JP2024528869A JPWO2023248860A5 JP WO2023248860 A5 JPWO2023248860 A5 JP WO2023248860A5 JP 2024528869 A JP2024528869 A JP 2024528869A JP 2024528869 A JP2024528869 A JP 2024528869A JP WO2023248860 A5 JPWO2023248860 A5 JP WO2023248860A5
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JP
Japan
Prior art keywords
flow
valve
controls
supply line
etching liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528869A
Other languages
English (en)
Japanese (ja)
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JPWO2023248860A1 (enrdf_load_stackoverflow
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/021837 external-priority patent/WO2023248860A1/ja
Publication of JPWO2023248860A1 publication Critical patent/JPWO2023248860A1/ja
Publication of JPWO2023248860A5 publication Critical patent/JPWO2023248860A5/ja
Pending legal-status Critical Current

Links

JP2024528869A 2022-06-24 2023-06-13 Pending JPWO2023248860A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022101701 2022-06-24
PCT/JP2023/021837 WO2023248860A1 (ja) 2022-06-24 2023-06-13 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2023248860A1 JPWO2023248860A1 (enrdf_load_stackoverflow) 2023-12-28
JPWO2023248860A5 true JPWO2023248860A5 (enrdf_load_stackoverflow) 2025-02-28

Family

ID=89379764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528869A Pending JPWO2023248860A1 (enrdf_load_stackoverflow) 2022-06-24 2023-06-13

Country Status (3)

Country Link
JP (1) JPWO2023248860A1 (enrdf_load_stackoverflow)
TW (1) TW202419208A (enrdf_load_stackoverflow)
WO (1) WO2023248860A1 (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030021183A (ko) * 2000-06-30 2003-03-12 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 실리콘 웨이퍼 에칭 공정
JP4656923B2 (ja) * 2004-12-01 2011-03-23 シャープ株式会社 シリコン結晶基板の製造方法と製造装置
KR20080022917A (ko) * 2006-09-08 2008-03-12 삼성전자주식회사 식각액 공급장치, 식각장치 및 식각방법
JP4995237B2 (ja) * 2009-06-22 2012-08-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2013065614A (ja) * 2011-09-15 2013-04-11 Pre-Tech At:Kk シリコンウェーハのウェットエッチング方法及びウェットエッチング装置
JP2018147908A (ja) * 2015-07-27 2018-09-20 東京エレクトロン株式会社 基板処理方法および基板処理装置

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