JPWO2023248860A1 - - Google Patents

Info

Publication number
JPWO2023248860A1
JPWO2023248860A1 JP2024528869A JP2024528869A JPWO2023248860A1 JP WO2023248860 A1 JPWO2023248860 A1 JP WO2023248860A1 JP 2024528869 A JP2024528869 A JP 2024528869A JP 2024528869 A JP2024528869 A JP 2024528869A JP WO2023248860 A1 JPWO2023248860 A1 JP WO2023248860A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528869A
Other languages
Japanese (ja)
Other versions
JPWO2023248860A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023248860A1 publication Critical patent/JPWO2023248860A1/ja
Publication of JPWO2023248860A5 publication Critical patent/JPWO2023248860A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2024528869A 2022-06-24 2023-06-13 Pending JPWO2023248860A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022101701 2022-06-24
PCT/JP2023/021837 WO2023248860A1 (ja) 2022-06-24 2023-06-13 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2023248860A1 true JPWO2023248860A1 (enrdf_load_stackoverflow) 2023-12-28
JPWO2023248860A5 JPWO2023248860A5 (enrdf_load_stackoverflow) 2025-02-28

Family

ID=89379764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528869A Pending JPWO2023248860A1 (enrdf_load_stackoverflow) 2022-06-24 2023-06-13

Country Status (3)

Country Link
JP (1) JPWO2023248860A1 (enrdf_load_stackoverflow)
TW (1) TW202419208A (enrdf_load_stackoverflow)
WO (1) WO2023248860A1 (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030021183A (ko) * 2000-06-30 2003-03-12 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 실리콘 웨이퍼 에칭 공정
JP4656923B2 (ja) * 2004-12-01 2011-03-23 シャープ株式会社 シリコン結晶基板の製造方法と製造装置
KR20080022917A (ko) * 2006-09-08 2008-03-12 삼성전자주식회사 식각액 공급장치, 식각장치 및 식각방법
JP4995237B2 (ja) * 2009-06-22 2012-08-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2013065614A (ja) * 2011-09-15 2013-04-11 Pre-Tech At:Kk シリコンウェーハのウェットエッチング方法及びウェットエッチング装置
JP2018147908A (ja) * 2015-07-27 2018-09-20 東京エレクトロン株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
WO2023248860A1 (ja) 2023-12-28
TW202419208A (zh) 2024-05-16

Similar Documents

Publication Publication Date Title
BR102022025291A2 (enrdf_load_stackoverflow)
BR102023010976A2 (enrdf_load_stackoverflow)
BR102023009641A2 (enrdf_load_stackoverflow)
BR102023008688A2 (enrdf_load_stackoverflow)
BR102023007252A2 (enrdf_load_stackoverflow)
BR102023005164A2 (enrdf_load_stackoverflow)
BR102023001987A2 (enrdf_load_stackoverflow)
BR102023001877A2 (enrdf_load_stackoverflow)
BR102023000289A2 (enrdf_load_stackoverflow)
BR102022026909A2 (enrdf_load_stackoverflow)
BR202022009269U2 (enrdf_load_stackoverflow)
BR202022005961U2 (enrdf_load_stackoverflow)
BR202022001779U2 (enrdf_load_stackoverflow)
BY13146U (enrdf_load_stackoverflow)
BY13154U (enrdf_load_stackoverflow)
CN307048727S (enrdf_load_stackoverflow)
BY13137U (enrdf_load_stackoverflow)
BY13138U (enrdf_load_stackoverflow)
BY13139U (enrdf_load_stackoverflow)
BY13140U (enrdf_load_stackoverflow)
BY13142U (enrdf_load_stackoverflow)
BY13143U (enrdf_load_stackoverflow)
BY13144U (enrdf_load_stackoverflow)
BY13145U (enrdf_load_stackoverflow)
CN307048614S (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241210