JPWO2023248657A5 - - Google Patents
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- Publication number
- JPWO2023248657A5 JPWO2023248657A5 JP2024528398A JP2024528398A JPWO2023248657A5 JP WO2023248657 A5 JPWO2023248657 A5 JP WO2023248657A5 JP 2024528398 A JP2024528398 A JP 2024528398A JP 2024528398 A JP2024528398 A JP 2024528398A JP WO2023248657 A5 JPWO2023248657 A5 JP WO2023248657A5
- Authority
- JP
- Japan
- Prior art keywords
- interlayer connection
- connection conductors
- region
- multilayer substrate
- axis direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 74
- 239000011229 interlayer Substances 0.000 claims description 48
- 239000010410 layer Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 24
- 239000012212 insulator Substances 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022101858 | 2022-06-24 | ||
| JP2022101858 | 2022-06-24 | ||
| PCT/JP2023/018517 WO2023248657A1 (ja) | 2022-06-24 | 2023-05-18 | 多層基板、多層基板モジュール及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248657A1 JPWO2023248657A1 (https=) | 2023-12-28 |
| JP7601288B2 JP7601288B2 (ja) | 2024-12-17 |
| JPWO2023248657A5 true JPWO2023248657A5 (https=) | 2024-12-19 |
Family
ID=89379697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528398A Active JP7601288B2 (ja) | 2022-06-24 | 2023-05-18 | 多層基板、多層基板モジュール及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250048533A1 (https=) |
| JP (1) | JP7601288B2 (https=) |
| CN (1) | CN119487983A (https=) |
| WO (1) | WO2023248657A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010123830A (ja) | 2008-11-21 | 2010-06-03 | Panasonic Corp | プリント配線板とその製造方法 |
| WO2016080333A1 (ja) * | 2014-11-21 | 2016-05-26 | 株式会社村田製作所 | モジュール |
| JP6665864B2 (ja) | 2015-11-17 | 2020-03-13 | 株式会社村田製作所 | 多層基板及び電子機器 |
-
2023
- 2023-05-18 JP JP2024528398A patent/JP7601288B2/ja active Active
- 2023-05-18 WO PCT/JP2023/018517 patent/WO2023248657A1/ja not_active Ceased
- 2023-05-18 CN CN202380049456.4A patent/CN119487983A/zh active Pending
-
2024
- 2024-10-24 US US18/925,492 patent/US20250048533A1/en active Pending
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