JPWO2023248634A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023248634A5 JPWO2023248634A5 JP2024528377A JP2024528377A JPWO2023248634A5 JP WO2023248634 A5 JPWO2023248634 A5 JP WO2023248634A5 JP 2024528377 A JP2024528377 A JP 2024528377A JP 2024528377 A JP2024528377 A JP 2024528377A JP WO2023248634 A5 JPWO2023248634 A5 JP WO2023248634A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- floating
- radiating
- viewed
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 142
- 239000010410 layer Substances 0.000 claims description 108
- 230000005855 radiation Effects 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims 2
- 239000010432 diamond Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022100859 | 2022-06-23 | ||
| JP2022100859 | 2022-06-23 | ||
| PCT/JP2023/017489 WO2023248634A1 (ja) | 2022-06-23 | 2023-05-09 | 電子機器及び多層基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248634A1 JPWO2023248634A1 (https=) | 2023-12-28 |
| JPWO2023248634A5 true JPWO2023248634A5 (https=) | 2024-12-13 |
| JP7613641B2 JP7613641B2 (ja) | 2025-01-15 |
Family
ID=89379552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528377A Active JP7613641B2 (ja) | 2022-06-23 | 2023-05-09 | 電子機器及び多層基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250118897A1 (https=) |
| JP (1) | JP7613641B2 (https=) |
| CN (1) | CN119366064A (https=) |
| WO (1) | WO2023248634A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026006855A (ja) * | 2024-07-01 | 2026-01-16 | 株式会社日立製作所 | 多層プリント配線基板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2884885B2 (ja) * | 1992-02-27 | 1999-04-19 | 三菱電機株式会社 | マイクロストリップアンテナ |
| CN113728515A (zh) * | 2019-04-24 | 2021-11-30 | 株式会社村田制作所 | 天线模块和搭载有该天线模块的通信装置 |
| WO2021059738A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社村田製作所 | アンテナモジュールおよびその製造方法、ならびに、集合基板 |
| US11545761B2 (en) * | 2020-05-22 | 2023-01-03 | Mobix Labs, Inc. | Dual-band cross-polarized 5G mm-wave phased array antenna |
| CN220672856U (zh) * | 2020-09-24 | 2024-03-26 | 株式会社村田制作所 | 天线元件 |
-
2023
- 2023-05-09 CN CN202380047452.2A patent/CN119366064A/zh active Pending
- 2023-05-09 WO PCT/JP2023/017489 patent/WO2023248634A1/ja not_active Ceased
- 2023-05-09 JP JP2024528377A patent/JP7613641B2/ja active Active
-
2024
- 2024-12-18 US US18/985,110 patent/US20250118897A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102530828B1 (ko) | 칩 안테나 및 이를 포함하는 칩 안테나 모듈 | |
| KR102470355B1 (ko) | 칩 안테나 모듈 | |
| KR102257930B1 (ko) | 칩 안테나 | |
| CN107068657B (zh) | 包含天线层的半导体封装件及其制造方法 | |
| EP3621154A1 (en) | Integrated antenna package structure, and terminal | |
| KR102211746B1 (ko) | 칩 안테나 | |
| TW201842712A (zh) | 高頻模組 | |
| KR20210043145A (ko) | 칩 안테나 | |
| KR20210015500A (ko) | 칩 안테나 | |
| KR20200026234A (ko) | 안테나 장치 및 안테나 모듈 | |
| CN110050386B (zh) | 天线基板 | |
| JPWO2023248634A5 (https=) | ||
| TW202531628A (zh) | 電子裝置 | |
| KR102163419B1 (ko) | 칩 안테나 모듈 | |
| JP7613641B2 (ja) | 電子機器及び多層基板 | |
| JP3878795B2 (ja) | 多層配線基板 | |
| JP6547833B2 (ja) | 多層基板、電子機器および多層基板の製造方法 | |
| JP7736179B2 (ja) | 多層基板 | |
| US20230230951A1 (en) | Circuit module | |
| CN110444529A (zh) | 天线以及半导体装置 | |
| JP7355283B2 (ja) | アンテナ素子 | |
| US20220077556A1 (en) | Transmission line and electronic device | |
| US8520354B2 (en) | Multilayered board semiconductor device with BGA package | |
| US20250048533A1 (en) | Multilayer board, multilayer board module, and electronic device | |
| JP7803439B2 (ja) | 多層基板 |