JPWO2023228473A1 - - Google Patents

Info

Publication number
JPWO2023228473A1
JPWO2023228473A1 JP2024522905A JP2024522905A JPWO2023228473A1 JP WO2023228473 A1 JPWO2023228473 A1 JP WO2023228473A1 JP 2024522905 A JP2024522905 A JP 2024522905A JP 2024522905 A JP2024522905 A JP 2024522905A JP WO2023228473 A1 JPWO2023228473 A1 JP WO2023228473A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024522905A
Other languages
Japanese (ja)
Other versions
JPWO2023228473A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023228473A1 publication Critical patent/JPWO2023228473A1/ja
Publication of JPWO2023228473A5 publication Critical patent/JPWO2023228473A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H10D30/0297Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the gate electrodes, e.g. to form trench gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107Buried supplementary regions, e.g. buried guard rings 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/158Dispositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
JP2024522905A 2022-05-25 2023-01-25 Pending JPWO2023228473A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022085313 2022-05-25
PCT/JP2023/002283 WO2023228473A1 (ja) 2022-05-25 2023-01-25 炭化珪素半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023228473A1 true JPWO2023228473A1 (https=) 2023-11-30
JPWO2023228473A5 JPWO2023228473A5 (https=) 2025-02-04

Family

ID=88918893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024522905A Pending JPWO2023228473A1 (https=) 2022-05-25 2023-01-25

Country Status (4)

Country Link
JP (1) JPWO2023228473A1 (https=)
CN (1) CN118974943A (https=)
DE (1) DE112023002435T5 (https=)
WO (1) WO2023228473A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9825166B2 (en) 2013-01-23 2017-11-21 Hitachi, Ltd. Silicon carbide semiconductor device and method for producing same
JP6453188B2 (ja) 2015-09-04 2019-01-16 株式会社豊田中央研究所 炭化珪素半導体装置
CN111670502A (zh) * 2018-02-06 2020-09-15 住友电气工业株式会社 碳化硅半导体器件
WO2020031446A1 (ja) * 2018-08-09 2020-02-13 住友電気工業株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
JP7279394B2 (ja) * 2019-02-15 2023-05-23 富士電機株式会社 半導体装置および半導体装置の製造方法
JP7319617B2 (ja) * 2020-05-21 2023-08-02 株式会社東芝 半導体装置
JP7188790B2 (ja) 2020-11-27 2022-12-13 Necプラットフォームズ株式会社 情報処理装置、無線通信システム、算出方法及びプログラム

Also Published As

Publication number Publication date
CN118974943A (zh) 2024-11-15
DE112023002435T5 (de) 2025-03-20
WO2023228473A1 (ja) 2023-11-30

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