JPWO2023190471A5 - - Google Patents
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- Publication number
- JPWO2023190471A5 JPWO2023190471A5 JP2023547056A JP2023547056A JPWO2023190471A5 JP WO2023190471 A5 JPWO2023190471 A5 JP WO2023190471A5 JP 2023547056 A JP2023547056 A JP 2023547056A JP 2023547056 A JP2023547056 A JP 2023547056A JP WO2023190471 A5 JPWO2023190471 A5 JP WO2023190471A5
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- metal fine
- dispersion liquid
- dispersion
- stabilizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006185 dispersion Substances 0.000 claims description 11
- 230000000845 anti-microbial effect Effects 0.000 claims description 2
- 239000004599 antimicrobial Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000007788 liquid Substances 0.000 claims 6
- 239000003381 stabilizer Substances 0.000 claims 4
- 230000002378 acidificating effect Effects 0.000 claims 3
- 239000011230 binding agent Substances 0.000 claims 3
- 125000000524 functional group Chemical group 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims 2
- 239000002270 dispersing agent Substances 0.000 claims 2
- 239000000194 fatty acid Substances 0.000 claims 2
- 229930195729 fatty acid Natural products 0.000 claims 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000005749 Copper compound Substances 0.000 claims 1
- 150000000996 L-ascorbic acids Chemical class 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229960005070 ascorbic acid Drugs 0.000 claims 1
- 235000010323 ascorbic acid Nutrition 0.000 claims 1
- 239000011668 ascorbic acid Substances 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000012461 cellulose resin Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 150000001880 copper compounds Chemical class 0.000 claims 1
- -1 fatty acid ester Chemical class 0.000 claims 1
- 150000004665 fatty acids Chemical class 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 229920001225 polyester resin Polymers 0.000 claims 1
- 239000004645 polyester resin Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229940100890 silver compound Drugs 0.000 claims 1
- 150000003379 silver compounds Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022059323 | 2022-03-31 | ||
| JP2022059323 | 2022-03-31 | ||
| PCT/JP2023/012418 WO2023190471A1 (fr) | 2022-03-31 | 2023-03-28 | Dispersion contenant des microparticules métalliques présentant une propriété antimicrobienne avec une excellente stabilité à long terme |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190471A1 JPWO2023190471A1 (fr) | 2023-10-05 |
| JP7392905B1 JP7392905B1 (ja) | 2023-12-06 |
| JPWO2023190471A5 true JPWO2023190471A5 (fr) | 2024-03-08 |
Family
ID=88202499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023547056A Active JP7392905B1 (ja) | 2022-03-31 | 2023-03-28 | 経時安定性に優れた抗微生物性を有する金属微粒子含有分散液 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7392905B1 (fr) |
| WO (1) | WO2023190471A1 (fr) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5139848B2 (ja) * | 2008-03-14 | 2013-02-06 | Ｄｏｗａエレクトロニクス株式会社 | 没食子酸の誘導体に被覆された銀ナノ粒子 |
| JP5927745B2 (ja) * | 2012-06-27 | 2016-06-01 | 三菱マテリアル株式会社 | ＳｎＡｇＣｕ系はんだ粉末及びこの粉末を用いたはんだ用ペースト |
| JP6103126B1 (ja) * | 2016-01-29 | 2017-03-29 | 東洋インキＳｃホールディングス株式会社 | 導電性組成物、その製造方法、および導電性材料 |
| JP7361464B2 (ja) * | 2018-10-18 | 2023-10-16 | 株式会社ノリタケカンパニーリミテド | ＡｇＰｄコアシェル粒子およびその利用 |
| JP2020147840A (ja) * | 2019-03-16 | 2020-09-17 | 学校法人智香寺学園埼玉工業大学 | ナノコロイド充填防錆金属材料、ナノコロイド混合防錆塗料及びナノコロイド粒子を用いた防錆方法 |
| JP2020169387A (ja) * | 2019-04-03 | 2020-10-15 | 東洋製罐グループホールディングス株式会社 | 金属銅微粒子粉末及びその製造方法 |
| JP7465747B2 (ja) * | 2020-07-31 | 2024-04-11 | 京セラ株式会社 | 被覆銅粒子、被覆銅粒子の製造方法、銅ペースト、銅ペーストの製造方法、及び半導体装置 |
-
2023
- 2023-03-28 JP JP2023547056A patent/JP7392905B1/ja active Active
- 2023-03-28 WO PCT/JP2023/012418 patent/WO2023190471A1/fr active Application Filing
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