JPWO2023189610A5 - - Google Patents
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- Publication number
- JPWO2023189610A5 JPWO2023189610A5 JP2024511761A JP2024511761A JPWO2023189610A5 JP WO2023189610 A5 JPWO2023189610 A5 JP WO2023189610A5 JP 2024511761 A JP2024511761 A JP 2024511761A JP 2024511761 A JP2024511761 A JP 2024511761A JP WO2023189610 A5 JPWO2023189610 A5 JP WO2023189610A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- metal layer
- resin
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 229910001410 inorganic ion Inorganic materials 0.000 claims 6
- 239000002516 radical scavenger Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 5
- 229920001577 copolymer Polymers 0.000 claims 5
- 239000000178 monomer Substances 0.000 claims 5
- 239000011256 inorganic filler Substances 0.000 claims 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- 238000002441 X-ray diffraction Methods 0.000 claims 1
- 125000000129 anionic group Chemical group 0.000 claims 1
- 150000001450 anions Chemical class 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- 150000001768 cations Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022060343 | 2022-03-31 | ||
| PCT/JP2023/010135 WO2023189610A1 (ja) | 2022-03-31 | 2023-03-15 | 樹脂組成物、絶縁性樹脂硬化体、積層体、及び回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189610A1 JPWO2023189610A1 (https=) | 2023-10-05 |
| JPWO2023189610A5 true JPWO2023189610A5 (https=) | 2024-10-25 |
Family
ID=88201623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511761A Pending JPWO2023189610A1 (https=) | 2022-03-31 | 2023-03-15 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4497788A1 (https=) |
| JP (1) | JPWO2023189610A1 (https=) |
| KR (1) | KR20240162144A (https=) |
| CN (1) | CN118900897A (https=) |
| WO (1) | WO2023189610A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026061773A (ja) * | 2024-09-30 | 2026-04-09 | デンカ株式会社 | 積層体及び回路基板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266533A (ja) | 2007-04-25 | 2008-11-06 | Jfe Steel Kk | コークス炉の建設方法及びコークス炉建設用仮上屋 |
| US8138580B2 (en) * | 2007-09-19 | 2012-03-20 | Toray Industries, Inc. | Adhesive composition for electronic components, and adhesive sheet for electronic components using the same |
| WO2012039324A1 (ja) * | 2010-09-22 | 2012-03-29 | 日立化成工業株式会社 | 熱伝導性樹脂組成物、樹脂シート、樹脂付金属箔、樹脂シート硬化物及び放熱部材 |
| WO2013030998A1 (ja) * | 2011-08-31 | 2013-03-07 | 日立化成工業株式会社 | 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス |
| JP2016155985A (ja) * | 2015-02-26 | 2016-09-01 | 日立化成株式会社 | エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、及びそれらを用いた樹脂シート、プリプレグ、積層板、金属基板、配線板、パワー半導体装置 |
| JP2017041633A (ja) * | 2015-08-17 | 2017-02-23 | 積水化学工業株式会社 | 半導体装置及び半導体素子保護用材料 |
| JP6686394B2 (ja) * | 2015-12-01 | 2020-04-22 | 味の素株式会社 | 半導体チップパッケージの製造方法 |
-
2023
- 2023-03-15 CN CN202380029190.7A patent/CN118900897A/zh active Pending
- 2023-03-15 EP EP23779628.9A patent/EP4497788A1/en not_active Withdrawn
- 2023-03-15 WO PCT/JP2023/010135 patent/WO2023189610A1/ja not_active Ceased
- 2023-03-15 KR KR1020247035293A patent/KR20240162144A/ko not_active Withdrawn
- 2023-03-15 JP JP2024511761A patent/JPWO2023189610A1/ja active Pending
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