JPWO2023176893A5 - - Google Patents
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- Publication number
- JPWO2023176893A5 JPWO2023176893A5 JP2024508227A JP2024508227A JPWO2023176893A5 JP WO2023176893 A5 JPWO2023176893 A5 JP WO2023176893A5 JP 2024508227 A JP2024508227 A JP 2024508227A JP 2024508227 A JP2024508227 A JP 2024508227A JP WO2023176893 A5 JPWO2023176893 A5 JP WO2023176893A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- less
- silicon nitride
- oxygen content
- nitride powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022044684 | 2022-03-18 | ||
| PCT/JP2023/010125 WO2023176893A1 (ja) | 2022-03-18 | 2023-03-15 | 窒化ケイ素粉末、および窒化ケイ素質焼結体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023176893A1 JPWO2023176893A1 (https=) | 2023-09-21 |
| JPWO2023176893A5 true JPWO2023176893A5 (https=) | 2026-03-23 |
Family
ID=88023924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024508227A Pending JPWO2023176893A1 (https=) | 2022-03-18 | 2023-03-15 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4495065A4 (https=) |
| JP (1) | JPWO2023176893A1 (https=) |
| WO (1) | WO2023176893A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120835866A (zh) * | 2023-03-22 | 2025-10-24 | 电化株式会社 | 氮化硅预烧体以及其制造方法、氮化硅粉末的制造方法 |
| WO2025089218A1 (ja) * | 2023-10-23 | 2025-05-01 | 株式会社トクヤマ | 窒化ケイ素焼結体基板 |
| WO2025234337A1 (ja) * | 2024-05-10 | 2025-11-13 | Dic株式会社 | 多孔質シリコンナイトライド複合材料、燃料電池用電極及び多孔質シリコンナイトライド複合材料の製造方法 |
| WO2025258653A1 (ja) * | 2024-06-13 | 2025-12-18 | Ｕｂｅ株式会社 | 結晶質窒化ケイ素粉末、該粉末を含む窒化ケイ素焼結体、窒化ケイ素焼結体の製造方法、該焼結体を含む物品、および車両 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH087441B2 (ja) | 1986-12-29 | 1996-01-29 | 凸版印刷株式会社 | ポジ型高感度放射線感応性レジスト |
| JP2872528B2 (ja) | 1993-05-25 | 1999-03-17 | 宇部興産株式会社 | 窒化珪素粉末 |
| JP3438928B2 (ja) | 1994-01-12 | 2003-08-18 | 電気化学工業株式会社 | 窒化珪素粉末の製造方法 |
| JPH0812306A (ja) * | 1994-07-01 | 1996-01-16 | Ube Ind Ltd | 窒化ケイ素粉末 |
| JP3322033B2 (ja) * | 1994-10-14 | 2002-09-09 | 宇部興産株式会社 | 結晶質窒化珪素粉末 |
| JP5176627B2 (ja) | 2008-03-19 | 2013-04-03 | 三菱マテリアル株式会社 | パワーモジュール用基板のセラミックス基板、パワーモジュール用基板のセラミックス基板の製造方法及びパワーモジュール用基板の製造方法 |
| WO2013146713A1 (ja) | 2012-03-28 | 2013-10-03 | 宇部興産株式会社 | 窒化ケイ素粉末の製造方法及び窒化ケイ素粉末、ならびに窒化ケイ素焼結体及びそれを用いた回路基板 |
| SG11201510759WA (en) * | 2013-07-11 | 2016-02-26 | Ube Industries | Silicon nitride powder for mold release agent of casting mold for casting polycrystalline silicon ingot and method for manufacturing said silicon nitride powder, slurry containing said silicon nitride powder, casting mold for casting polycrystalline silicon ingot and method for manufacturing same, and method for manufacturing polycrystalline silicon ingot using said casting mold |
| WO2021200830A1 (ja) | 2020-03-30 | 2021-10-07 | デンカ株式会社 | 窒化ケイ素粉末、及び窒化ケイ素焼結体の製造方法 |
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2023
- 2023-03-15 WO PCT/JP2023/010125 patent/WO2023176893A1/ja not_active Ceased
- 2023-03-15 EP EP23770846.6A patent/EP4495065A4/en active Pending
- 2023-03-15 JP JP2024508227A patent/JPWO2023176893A1/ja active Pending