JPWO2023135959A1 - - Google Patents
Info
- Publication number
- JPWO2023135959A1 JPWO2023135959A1 JP2023573890A JP2023573890A JPWO2023135959A1 JP WO2023135959 A1 JPWO2023135959 A1 JP WO2023135959A1 JP 2023573890 A JP2023573890 A JP 2023573890A JP 2023573890 A JP2023573890 A JP 2023573890A JP WO2023135959 A1 JPWO2023135959 A1 JP WO2023135959A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/652—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/654—Top-view layouts
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022004775 | 2022-01-17 | ||
| PCT/JP2022/043889 WO2023135959A1 (ja) | 2022-01-17 | 2022-11-29 | 半導体装置、および、半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023135959A1 true JPWO2023135959A1 (https=) | 2023-07-20 |
Family
ID=87278787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023573890A Pending JPWO2023135959A1 (https=) | 2022-01-17 | 2022-11-29 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250081657A1 (https=) |
| EP (1) | EP4468333A1 (https=) |
| JP (1) | JPWO2023135959A1 (https=) |
| CN (1) | CN118525367A (https=) |
| WO (1) | WO2023135959A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332483A (ja) * | 2002-05-16 | 2003-11-21 | Hitachi Ltd | 配線基板とそれを用いた電子装置 |
| JP2005093652A (ja) * | 2003-09-17 | 2005-04-07 | Casio Comput Co Ltd | 半導体装置 |
| JP2008034472A (ja) * | 2006-07-26 | 2008-02-14 | Sony Corp | 半導体装置及びその製造方法 |
| JP2009152317A (ja) * | 2007-12-19 | 2009-07-09 | Panasonic Corp | 半導体装置およびその製造方法 |
| JP2016051834A (ja) | 2014-09-01 | 2016-04-11 | イビデン株式会社 | プリント配線基板およびその製造方法 |
| JP6793025B2 (ja) * | 2016-12-07 | 2020-12-02 | 日立オートモティブシステムズ株式会社 | 半導体装置 |
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2022
- 2022-11-29 US US18/727,179 patent/US20250081657A1/en active Pending
- 2022-11-29 JP JP2023573890A patent/JPWO2023135959A1/ja active Pending
- 2022-11-29 CN CN202280088366.1A patent/CN118525367A/zh not_active Withdrawn
- 2022-11-29 WO PCT/JP2022/043889 patent/WO2023135959A1/ja not_active Ceased
- 2022-11-29 EP EP22920479.7A patent/EP4468333A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN118525367A (zh) | 2024-08-20 |
| US20250081657A1 (en) | 2025-03-06 |
| EP4468333A1 (en) | 2024-11-27 |
| WO2023135959A1 (ja) | 2023-07-20 |