JPWO2023132002A1 - - Google Patents
Info
- Publication number
- JPWO2023132002A1 JPWO2023132002A1 JP2023572272A JP2023572272A JPWO2023132002A1 JP WO2023132002 A1 JPWO2023132002 A1 JP WO2023132002A1 JP 2023572272 A JP2023572272 A JP 2023572272A JP 2023572272 A JP2023572272 A JP 2023572272A JP WO2023132002 A1 JPWO2023132002 A1 JP WO2023132002A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
- G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/000070 WO2023132002A1 (ja) | 2022-01-05 | 2022-01-05 | 光電変換装置、光電変換システム、移動体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023132002A1 true JPWO2023132002A1 (enExample) | 2023-07-13 |
Family
ID=87073563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023572272A Pending JPWO2023132002A1 (enExample) | 2022-01-05 | 2022-01-05 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240357258A1 (enExample) |
| JP (1) | JPWO2023132002A1 (enExample) |
| WO (1) | WO2023132002A1 (enExample) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002165126A (ja) * | 2000-11-28 | 2002-06-07 | Canon Inc | 撮像装置及び撮像システム、並びに撮像方法 |
| JP2015216334A (ja) * | 2014-04-21 | 2015-12-03 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
| JP2018182038A (ja) * | 2017-04-12 | 2018-11-15 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子 |
| JP2020025263A (ja) * | 2018-07-31 | 2020-02-13 | ソニーセミコンダクタソリューションズ株式会社 | 積層型受光センサ及び電子機器 |
| JP2020098968A (ja) * | 2018-12-17 | 2020-06-25 | オリンパス株式会社 | 撮像素子、撮像装置、および撮像方法 |
| WO2021060098A1 (ja) * | 2019-09-27 | 2021-04-01 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子 |
| JP2021057825A (ja) * | 2019-09-30 | 2021-04-08 | キヤノン株式会社 | 信号処理装置及び方法、及び撮像装置 |
| CN112786631A (zh) * | 2019-11-05 | 2021-05-11 | 三星电子株式会社 | 图像传感器 |
| WO2021161712A1 (ja) * | 2020-02-14 | 2021-08-19 | ソニーグループ株式会社 | 撮像装置及び車両制御システム |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6341675B2 (ja) * | 2014-01-29 | 2018-06-13 | キヤノン株式会社 | 固体撮像装置及びその駆動方法並びにそれを用いた撮像システム |
| JP6704944B2 (ja) * | 2018-02-09 | 2020-06-03 | キヤノン株式会社 | 撮像装置、撮像システム、移動体 |
| US11941519B2 (en) * | 2019-12-02 | 2024-03-26 | Waymo Llc | Machine learning training platform |
| JP7646380B2 (ja) * | 2021-02-04 | 2025-03-17 | キヤノン株式会社 | 光電変換装置、光電変換システム、移動体 |
-
2022
- 2022-01-05 JP JP2023572272A patent/JPWO2023132002A1/ja active Pending
- 2022-01-05 WO PCT/JP2022/000070 patent/WO2023132002A1/ja not_active Ceased
-
2024
- 2024-06-28 US US18/759,615 patent/US20240357258A1/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002165126A (ja) * | 2000-11-28 | 2002-06-07 | Canon Inc | 撮像装置及び撮像システム、並びに撮像方法 |
| JP2015216334A (ja) * | 2014-04-21 | 2015-12-03 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
| JP2018182038A (ja) * | 2017-04-12 | 2018-11-15 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子 |
| JP2020025263A (ja) * | 2018-07-31 | 2020-02-13 | ソニーセミコンダクタソリューションズ株式会社 | 積層型受光センサ及び電子機器 |
| JP2020098968A (ja) * | 2018-12-17 | 2020-06-25 | オリンパス株式会社 | 撮像素子、撮像装置、および撮像方法 |
| WO2021060098A1 (ja) * | 2019-09-27 | 2021-04-01 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子 |
| JP2021057825A (ja) * | 2019-09-30 | 2021-04-08 | キヤノン株式会社 | 信号処理装置及び方法、及び撮像装置 |
| CN112786631A (zh) * | 2019-11-05 | 2021-05-11 | 三星电子株式会社 | 图像传感器 |
| WO2021161712A1 (ja) * | 2020-02-14 | 2021-08-19 | ソニーグループ株式会社 | 撮像装置及び車両制御システム |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023132002A1 (ja) | 2023-07-13 |
| US20240357258A1 (en) | 2024-10-24 |
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