JPWO2023119357A1 - - Google Patents

Info

Publication number
JPWO2023119357A1
JPWO2023119357A1 JP2022523323A JP2022523323A JPWO2023119357A1 JP WO2023119357 A1 JPWO2023119357 A1 JP WO2023119357A1 JP 2022523323 A JP2022523323 A JP 2022523323A JP 2022523323 A JP2022523323 A JP 2022523323A JP WO2023119357 A1 JPWO2023119357 A1 JP WO2023119357A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022523323A
Other languages
Japanese (ja)
Other versions
JP7180816B1 (ja
JPWO2023119357A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7180816B1 publication Critical patent/JP7180816B1/ja
Publication of JPWO2023119357A1 publication Critical patent/JPWO2023119357A1/ja
Publication of JPWO2023119357A5 publication Critical patent/JPWO2023119357A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2022523323A 2021-12-20 2021-12-20 基板接合構造 Active JP7180816B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/047007 WO2023119357A1 (ja) 2021-12-20 2021-12-20 基板接合構造

Publications (3)

Publication Number Publication Date
JP7180816B1 JP7180816B1 (ja) 2022-11-30
JPWO2023119357A1 true JPWO2023119357A1 (https=) 2023-06-29
JPWO2023119357A5 JPWO2023119357A5 (https=) 2023-11-21

Family

ID=84271365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022523323A Active JP7180816B1 (ja) 2021-12-20 2021-12-20 基板接合構造

Country Status (7)

Country Link
US (1) US12507351B2 (https=)
JP (1) JP7180816B1 (https=)
KR (1) KR102893924B1 (https=)
CN (1) CN118355736A (https=)
DE (1) DE112021008535T5 (https=)
TW (1) TWI841051B (https=)
WO (1) WO2023119357A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941894A (ja) * 1982-09-01 1984-03-08 ソニー株式会社 フレキシブルプリント基板の半田付け装置
JP3623051B2 (ja) 1996-08-26 2005-02-23 ホシデン株式会社 フレキシブル基板の半田付け接続構造
KR100905404B1 (ko) * 2006-08-07 2009-06-30 닛뽕 아비오닉스 가부시끼가이샤 프린트 배선판의 접속 방법 및 접속 장치
JP5011531B2 (ja) 2007-01-17 2012-08-29 国立大学法人長岡技術科学大学 深絞り加工装置
JP5707879B2 (ja) * 2010-11-10 2015-04-30 富士通オプティカルコンポーネンツ株式会社 光送信器及び中継基板
JP6237706B2 (ja) 2015-06-05 2017-11-29 富士通オプティカルコンポーネンツ株式会社 光モジュール及び光送受信装置
US10165690B2 (en) 2015-06-19 2018-12-25 Nippon Telegraph And Telephone Corporation Solder joint structure of flexible printed circuit board
CN109804720A (zh) * 2016-12-28 2019-05-24 株式会社藤仓 布线体组件、布线基板以及接触式传感器
WO2019043933A1 (ja) * 2017-09-04 2019-03-07 三菱電機株式会社 フレキシブル基板および光モジュール
CN115475268B (zh) * 2021-05-30 2024-11-12 宝洁公司 清新组合物

Also Published As

Publication number Publication date
KR102893924B1 (ko) 2025-12-01
CN118355736A (zh) 2024-07-16
TW202327414A (zh) 2023-07-01
JP7180816B1 (ja) 2022-11-30
US20240314943A1 (en) 2024-09-19
KR20240042003A (ko) 2024-04-01
TWI841051B (zh) 2024-05-01
US12507351B2 (en) 2025-12-23
WO2023119357A1 (ja) 2023-06-29
DE112021008535T5 (de) 2024-10-10

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