TWI841051B - 基板接合構造 - Google Patents

基板接合構造 Download PDF

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Publication number
TWI841051B
TWI841051B TW111143340A TW111143340A TWI841051B TW I841051 B TWI841051 B TW I841051B TW 111143340 A TW111143340 A TW 111143340A TW 111143340 A TW111143340 A TW 111143340A TW I841051 B TWI841051 B TW I841051B
Authority
TW
Taiwan
Prior art keywords
flexible substrate
substrate
conductive pattern
pattern
hole
Prior art date
Application number
TW111143340A
Other languages
English (en)
Chinese (zh)
Other versions
TW202327414A (zh
Inventor
板本裕光
Original Assignee
日商三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱電機股份有限公司 filed Critical 日商三菱電機股份有限公司
Publication of TW202327414A publication Critical patent/TW202327414A/zh
Application granted granted Critical
Publication of TWI841051B publication Critical patent/TWI841051B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW111143340A 2021-12-20 2022-11-14 基板接合構造 TWI841051B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2021/047007 2021-12-20
PCT/JP2021/047007 WO2023119357A1 (ja) 2021-12-20 2021-12-20 基板接合構造

Publications (2)

Publication Number Publication Date
TW202327414A TW202327414A (zh) 2023-07-01
TWI841051B true TWI841051B (zh) 2024-05-01

Family

ID=84271365

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111143340A TWI841051B (zh) 2021-12-20 2022-11-14 基板接合構造

Country Status (7)

Country Link
US (1) US12507351B2 (https=)
JP (1) JP7180816B1 (https=)
KR (1) KR102893924B1 (https=)
CN (1) CN118355736A (https=)
DE (1) DE112021008535T5 (https=)
TW (1) TWI841051B (https=)
WO (1) WO2023119357A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941894A (ja) * 1982-09-01 1984-03-08 ソニー株式会社 フレキシブルプリント基板の半田付け装置
TW200819002A (en) * 2006-08-07 2008-04-16 Nippon Avionics Co Ltd Method and apparatus for connecting printed wiring boards
WO2016203774A1 (ja) * 2015-06-19 2016-12-22 日本電信電話株式会社 フレキシブルプリント配線板のはんだ接合構造
JP2017003655A (ja) * 2015-06-05 2017-01-05 富士通オプティカルコンポーネンツ株式会社 光モジュール及び光送受信装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3623051B2 (ja) 1996-08-26 2005-02-23 ホシデン株式会社 フレキシブル基板の半田付け接続構造
JP5011531B2 (ja) 2007-01-17 2012-08-29 国立大学法人長岡技術科学大学 深絞り加工装置
JP5707879B2 (ja) * 2010-11-10 2015-04-30 富士通オプティカルコンポーネンツ株式会社 光送信器及び中継基板
CN109804720A (zh) * 2016-12-28 2019-05-24 株式会社藤仓 布线体组件、布线基板以及接触式传感器
WO2019043933A1 (ja) * 2017-09-04 2019-03-07 三菱電機株式会社 フレキシブル基板および光モジュール
CN115475268B (zh) * 2021-05-30 2024-11-12 宝洁公司 清新组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941894A (ja) * 1982-09-01 1984-03-08 ソニー株式会社 フレキシブルプリント基板の半田付け装置
TW200819002A (en) * 2006-08-07 2008-04-16 Nippon Avionics Co Ltd Method and apparatus for connecting printed wiring boards
JP2017003655A (ja) * 2015-06-05 2017-01-05 富士通オプティカルコンポーネンツ株式会社 光モジュール及び光送受信装置
WO2016203774A1 (ja) * 2015-06-19 2016-12-22 日本電信電話株式会社 フレキシブルプリント配線板のはんだ接合構造

Also Published As

Publication number Publication date
KR102893924B1 (ko) 2025-12-01
CN118355736A (zh) 2024-07-16
TW202327414A (zh) 2023-07-01
JPWO2023119357A1 (https=) 2023-06-29
JP7180816B1 (ja) 2022-11-30
US20240314943A1 (en) 2024-09-19
KR20240042003A (ko) 2024-04-01
US12507351B2 (en) 2025-12-23
WO2023119357A1 (ja) 2023-06-29
DE112021008535T5 (de) 2024-10-10

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