DE112021008535T5 - Substratverbindungsanordnung - Google Patents

Substratverbindungsanordnung Download PDF

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Publication number
DE112021008535T5
DE112021008535T5 DE112021008535.2T DE112021008535T DE112021008535T5 DE 112021008535 T5 DE112021008535 T5 DE 112021008535T5 DE 112021008535 T DE112021008535 T DE 112021008535T DE 112021008535 T5 DE112021008535 T5 DE 112021008535T5
Authority
DE
Germany
Prior art keywords
flexible substrate
substrate
solder
gnd
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112021008535.2T
Other languages
German (de)
English (en)
Inventor
Hiromitsu Itamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021008535T5 publication Critical patent/DE112021008535T5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE112021008535.2T 2021-12-20 2021-12-20 Substratverbindungsanordnung Withdrawn DE112021008535T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/047007 WO2023119357A1 (ja) 2021-12-20 2021-12-20 基板接合構造

Publications (1)

Publication Number Publication Date
DE112021008535T5 true DE112021008535T5 (de) 2024-10-10

Family

ID=84271365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021008535.2T Withdrawn DE112021008535T5 (de) 2021-12-20 2021-12-20 Substratverbindungsanordnung

Country Status (7)

Country Link
US (1) US12507351B2 (https=)
JP (1) JP7180816B1 (https=)
KR (1) KR102893924B1 (https=)
CN (1) CN118355736A (https=)
DE (1) DE112021008535T5 (https=)
TW (1) TWI841051B (https=)
WO (1) WO2023119357A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008173655A (ja) 2007-01-17 2008-07-31 Nagaoka Univ Of Technology 深絞り加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941894A (ja) * 1982-09-01 1984-03-08 ソニー株式会社 フレキシブルプリント基板の半田付け装置
JP3623051B2 (ja) 1996-08-26 2005-02-23 ホシデン株式会社 フレキシブル基板の半田付け接続構造
KR100905404B1 (ko) * 2006-08-07 2009-06-30 닛뽕 아비오닉스 가부시끼가이샤 프린트 배선판의 접속 방법 및 접속 장치
JP5707879B2 (ja) * 2010-11-10 2015-04-30 富士通オプティカルコンポーネンツ株式会社 光送信器及び中継基板
JP6237706B2 (ja) 2015-06-05 2017-11-29 富士通オプティカルコンポーネンツ株式会社 光モジュール及び光送受信装置
US10165690B2 (en) 2015-06-19 2018-12-25 Nippon Telegraph And Telephone Corporation Solder joint structure of flexible printed circuit board
CN109804720A (zh) * 2016-12-28 2019-05-24 株式会社藤仓 布线体组件、布线基板以及接触式传感器
WO2019043933A1 (ja) * 2017-09-04 2019-03-07 三菱電機株式会社 フレキシブル基板および光モジュール
CN115475268B (zh) * 2021-05-30 2024-11-12 宝洁公司 清新组合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008173655A (ja) 2007-01-17 2008-07-31 Nagaoka Univ Of Technology 深絞り加工装置

Also Published As

Publication number Publication date
KR102893924B1 (ko) 2025-12-01
CN118355736A (zh) 2024-07-16
TW202327414A (zh) 2023-07-01
JPWO2023119357A1 (https=) 2023-06-29
JP7180816B1 (ja) 2022-11-30
US20240314943A1 (en) 2024-09-19
KR20240042003A (ko) 2024-04-01
TWI841051B (zh) 2024-05-01
US12507351B2 (en) 2025-12-23
WO2023119357A1 (ja) 2023-06-29

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R084 Declaration of willingness to licence
R120 Application withdrawn or ip right abandoned