JPWO2023106262A1 - - Google Patents
Info
- Publication number
- JPWO2023106262A1 JPWO2023106262A1 JP2023512030A JP2023512030A JPWO2023106262A1 JP WO2023106262 A1 JPWO2023106262 A1 JP WO2023106262A1 JP 2023512030 A JP2023512030 A JP 2023512030A JP 2023512030 A JP2023512030 A JP 2023512030A JP WO2023106262 A1 JPWO2023106262 A1 JP WO2023106262A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021198962 | 2021-12-08 | ||
| JP2021198962 | 2021-12-08 | ||
| PCT/JP2022/044745 WO2023106262A1 (ja) | 2021-12-08 | 2022-12-05 | 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023106262A1 true JPWO2023106262A1 (https=) | 2023-06-15 |
| JP7328471B1 JP7328471B1 (ja) | 2023-08-16 |
| JPWO2023106262A5 JPWO2023106262A5 (https=) | 2023-11-09 |
Family
ID=86730367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023512030A Active JP7328471B1 (ja) | 2021-12-08 | 2022-12-05 | 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7328471B1 (https=) |
| KR (1) | KR20240074759A (https=) |
| CN (1) | CN118019868A (https=) |
| TW (1) | TW202330951A (https=) |
| WO (1) | WO2023106262A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025183120A1 (ja) * | 2024-02-29 | 2025-09-04 | 古河電気工業株式会社 | 銅系導体、撚線導体および電線 |
| JP7809883B1 (ja) * | 2024-07-31 | 2026-02-02 | 古河電気工業株式会社 | 電子部品用材料およびその製造方法、リードフレーム材およびその製造方法、ならびに半導体パッケージ |
| WO2026028551A1 (ja) * | 2024-07-31 | 2026-02-05 | 古河電気工業株式会社 | 電子部品用材料およびその製造方法、リードフレーム材およびその製造方法、ならびに半導体パッケージ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5192536B2 (ja) * | 2010-12-10 | 2013-05-08 | 三菱伸銅株式会社 | 深絞り加工性及び耐疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法 |
| JP5180283B2 (ja) * | 2010-12-24 | 2013-04-10 | 三菱伸銅株式会社 | 曲げ加工後の耐疲労特性及びばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法 |
| WO2012160684A1 (ja) | 2011-05-25 | 2012-11-29 | 三菱伸銅株式会社 | 深絞り加工性に優れたＣｕ－Ｎｉ－Ｓｉ系銅合金板及びその製造方法 |
| JP6113061B2 (ja) * | 2013-11-25 | 2017-04-12 | Ｊｘ金属株式会社 | 導電性、耐応力緩和特性および成形加工性に優れる銅合金板 |
| JP6533402B2 (ja) * | 2015-03-23 | 2019-06-19 | Ｄｏｗａメタルテック株式会社 | Ｃｕ−Ｎｉ−Ｓｉ系銅合金板材およびその製造方法並びにリードフレーム |
| CN109072341B (zh) * | 2016-03-31 | 2021-07-27 | 同和金属技术有限公司 | Cu-Ni-Si系铜合金板材和制造法 |
| JP6494681B2 (ja) * | 2017-03-27 | 2019-04-03 | Ｊｘ金属株式会社 | 電子材料用銅合金及び電子部品 |
-
2022
- 2022-12-05 WO PCT/JP2022/044745 patent/WO2023106262A1/ja not_active Ceased
- 2022-12-05 CN CN202280065056.8A patent/CN118019868A/zh active Pending
- 2022-12-05 KR KR1020247008520A patent/KR20240074759A/ko active Pending
- 2022-12-05 JP JP2023512030A patent/JP7328471B1/ja active Active
- 2022-12-08 TW TW111147110A patent/TW202330951A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN118019868A (zh) | 2024-05-10 |
| KR20240074759A (ko) | 2024-05-28 |
| WO2023106262A1 (ja) | 2023-06-15 |
| JP7328471B1 (ja) | 2023-08-16 |
| TW202330951A (zh) | 2023-08-01 |
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