WO2023106262A1 - 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 - Google Patents

銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 Download PDF

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WO2023106262A1
WO2023106262A1 PCT/JP2022/044745 JP2022044745W WO2023106262A1 WO 2023106262 A1 WO2023106262 A1 WO 2023106262A1 JP 2022044745 W JP2022044745 W JP 2022044745W WO 2023106262 A1 WO2023106262 A1 WO 2023106262A1
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copper alloy
range
alloy sheet
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sheet material
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French (fr)
Japanese (ja)
Inventor
俊太 秋谷
雄太郎 雨宮
紳悟 川田
親人 菅原
司 高澤
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to KR1020247008520A priority Critical patent/KR20240074759A/ko
Priority to JP2023512030A priority patent/JP7328471B1/ja
Priority to CN202280065056.8A priority patent/CN118019868A/zh
Publication of WO2023106262A1 publication Critical patent/WO2023106262A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a copper alloy sheet material and its manufacturing method, as well as an electronic component and a drawn product.
  • Copper alloy sheet materials are used, for example, in connectors for electrical and electronic parts, lead frames, relays, switches, sockets, shield cases, shield cans, camera module cases, heat dissipation parts for liquid crystal and organic EL displays, reinforcing plates, chassis, and automobiles. It is used for connectors, shield cases, shield cans, etc., and is often subjected to press working such as punching, bending, drawing, and bulging.
  • the "difficult-to-process shape” here means, for example, a shape that is formed when a jig such as a punch is used to manufacture a drawn product, in which the radius of curvature of corners and edges is smaller than usual.
  • a "drawn product” means a product formed by drawing, and is characterized by having no seams in the formed product.
  • drawing is a type of metal plate forming method, typically in which a punch is pressed into a thin metal plate to form bottomed containers of various shapes such as cylinders, square tubes and cones. means a processing method to form
  • the "drawn product” also includes a processed product that is formed by using drawing in combination with other processing methods such as bending, crushing, and twisting, which are different from drawing.
  • Patent Document 2 contains 1.0 to 3.0% by mass of Ni, contains Si at a concentration of 1/6 to 1/4 with respect to the mass% concentration of Ni, and the balance is Cu and Consists of unavoidable impurities, the surface has an arithmetic mean roughness (Ra) of 0.02 to 0.2 ⁇ m, and the absolute value of each peak and valley when the surface roughness average line is used as a reference The standard deviation is 0.1 ⁇ m or less, the average value of the aspect ratio of the crystal grains in the alloy structure (the minor axis of the crystal grain/the major axis of the crystal grain) is 0.4 to 0.6, and the backscattered electron diffraction image GOS when the orientation of all pixels in the measurement area range is measured by the EBSD method using a scanning electron microscope with a system, and the boundary where the orientation difference between adjacent pixels is 5° or more is regarded as a grain boundary.
  • Ra arithmetic mean roughness
  • the average value of all grains is 1.2 to 1.5 °, and the ratio (L ⁇ / L) of the total special grain boundary length L ⁇ of the special grain boundary to the total grain boundary length L of the grain boundary is 60 ⁇ 70% and a spring limit value of 450-600 N/mm 2 .
  • the deep drawability can be improved by setting the ratio of L ⁇ /L to 60 to 70%.
  • Patent Document 1 does not discuss drawability at all, much less does it disclose how to achieve both high tensile strength and excellent drawability in a well-balanced manner, and the evaluation results of these characteristics. is also not shown.
  • the present invention has been made in view of the above problems, and provides a copper alloy sheet material having high tensile strength and capable of stably obtaining excellent drawability, and a method for producing the same. intended to
  • the present inventors contain one or both of Ni and Co in the range of 1.00% by mass or more and 5.00% by mass or less, Si in the range of 0.20% by mass or more and 1.50% by mass or less, and the balance is A copper alloy sheet material having an alloy composition consisting of Cu and unavoidable impurities, with a tensile strength of 550 MPa or more, and a GAM value obtained from crystal orientation analysis data by the SEM-EBSD method of 0.1 ° or more and 0.8 ° or less.
  • the area ratio of the crystal grains in the range of 30% to 90%, the tensile strength of the copper alloy sheet material is increased, and the drawing workability, especially the shape uniformity of the drawn product is improved.
  • the present inventors have found that it is possible to complete the present invention.
  • the average crystal grain size of the crystal grains obtained from the crystal orientation analysis data of the SEM-EBSD method is in the range of 4 ⁇ m or more and 25 ⁇ m or less, and the standard deviation of the average crystal grain size is 6 ⁇ m or less.
  • the alloy composition contains at least one optional additive component selected from the group consisting of Zn, Sn, Mg, Cr and Fe in a total range of 0.10% by mass or more and 1.00% by mass or less.
  • the copper alloy sheet material according to any one of (1) to (3) above, further comprising:
  • the holding time is in the range of 5 seconds or more and 30 seconds or less
  • the working rate [%] per pass
  • the product of the rolling roll diameter [mm] is set to 2000 [% mm] or less
  • the total reduction rate is set in the range of 1% to 10%
  • the fourth In the annealing step [step 10] the ultimate temperature (T) is in the range of 400° C. or higher and 600° C. or lower, and the relationship with the ultimate temperature (T (° C.)) is defined by the inequality shown in formula (I).
  • the present invention it is possible to provide a copper alloy sheet material that has high tensile strength and is capable of stably obtaining excellent drawability, and a method for manufacturing the same.
  • the copper alloy sheet material according to the present invention contains one or both of Ni and Co in the range of 1.00% by mass to 5.00% by mass and Si in the range of 0.20% by mass to 1.50% by mass, It has an alloy composition in which the balance is Cu and inevitable impurities, has a tensile strength of 550 MPa or more, and has a GAM value of 0.1° or more and 0.8 obtained from the crystal orientation analysis data of the SEM-EBSD method.
  • the area ratio of the crystal grains with a range of ° or less is in the range of 30% or more and 90% or less.
  • alloy composition of the copper alloy sheet material of the present invention contains, as essential ingredients, one or both of Ni and Co at 1.00% by mass or more and 5.00% by mass or less, and Si at 0%. .20% by mass or more and 1.50% by mass or less. Reasons for limiting the alloy composition of the copper alloy sheet will be described below.
  • Ni and Co 1.00% by mass or more and 5.00% by mass or less in total
  • Ni (nickel) and Co (cobalt) are important components that act to increase the tensile strength of the copper alloy sheet material. From the viewpoint of exhibiting such an effect, it is necessary to add one or both of Ni and Co, and to contain them in the range of 1.00% by mass or more and 5.00% by mass or less in total.
  • the total amount of Ni and Co exceeds 5.00% by mass, the Si compound remains in the first annealing step [step 5] described later, and the variation in crystal grain size tends to increase. Therefore, the total amount of Ni and Co is preferably in the range of 1.50% by mass or more and 4.00% by mass or less.
  • Si 0.20% by mass or more and 1.50% by mass or less
  • Si silicon
  • Si is an important component that acts to increase the tensile strength of a copper alloy sheet. From the viewpoint of exhibiting such effects, it is necessary to set the Si content to 0.20% by mass or more. On the other hand, when the Si content exceeds 1.50% by mass, the electrical conductivity decreases significantly and the variation in crystal grain size increases, so the upper limit of the Si content is set to 1.50% by mass. It is necessary to.
  • Zn 0.10% by mass or more and 0.50% by mass or less
  • Zn (zinc) is a component that acts to improve the adhesion and migration properties of Sn plating.
  • the Zn content is preferably 0.10% by mass or more.
  • the Zn content is preferably in the range of 0.10% by mass or more and 0.50% by mass or less.
  • Sn (tin) is a component that acts to improve stress relaxation resistance.
  • the Sn content is preferably 0.10% by mass or more.
  • the Sn content is preferably in the range of 0.10% by mass or more and 0.30% by mass or less.
  • Mg 0.10% by mass or more and 0.30% by mass or less
  • Mg magnesium
  • Mg is a component that acts to improve stress relaxation resistance. In order to exhibit such an effect, it is preferable to set the Mg content to 0.10% by mass or more. On the other hand, when the Mg content exceeds 0.30% by mass, the electrical conductivity tends to decrease. Therefore, the Mg content is preferably in the range of 0.10% by mass or more and 0.30% by mass or less.
  • Cr 0.05% by mass or more and 0.30% by mass or less
  • Cr chromium
  • Cr is a component that has the effect of suppressing coarsening of crystal grains in solution heat treatment. In order to exhibit this effect, it is preferable to set the Cr content to 0.05% by mass or more. Further, when the Cr content exceeds 0.30% by mass, coarse crystallized substances containing Cr are likely to be formed during casting, and crack starting points are likely to be formed. Therefore, the Cr content is preferably in the range of 0.05% by mass or more and 0.30% by mass or less.
  • Fe Fe (iron) is a component that has the effect of suppressing coarsening of crystal grains in solution heat treatment. In order to exhibit this effect, it is preferable to set the Fe content to 0.05% by mass or more. On the other hand, when the Fe content exceeds 0.30% by mass, coarse crystallized substances containing Fe are likely to be formed during casting, and crack starting points are likely to be formed. Therefore, the Fe content is preferably in the range of 0.05% by mass or more and 0.30% by mass or less.
  • Total content of optional additive components 0.10% by mass or more and 1.00% by mass or less
  • the total content of these optional additive components is preferably 0.10% by mass or more.
  • the total amount is preferably 1.00% by mass or less.
  • the copper alloy sheet material of the present invention needs to have a tensile strength of 550 MPa or more when pulled in a direction parallel to the rolling direction. As a result, the desired tensile strength can be obtained even when the copper alloy sheet material is used for small or thin parts such as electrical/electronic parts and parts for automobiles.
  • a plate material can be preferably used.
  • the tensile strength was measured using two test pieces of No. 13B specified in JIS Z2241 cut so that the direction parallel to the rolling direction was the longitudinal direction. Let the average value of the obtained tensile strength be the measured value of tensile strength.
  • GAM value of copper alloy sheet material and its area ratio GAM (grain average misorientation) value is a value obtained from crystal orientation analysis data by the SEM-EBSD method, and is a large-angle grain boundary having a misorientation of 15 ° or more.
  • the distance between measurement points hereinafter also referred to as step size
  • step size is measured at 0.5 ⁇ m to calculate the misorientation for each adjacent measurement point, and the calculated misorientation is the same. It is a value calculated as an average value within a crystal grain.
  • the GAM value When the GAM value is small, the average orientation difference in one crystal grain is small, so uniform crystal grains with little strain are generated, or the crystal grains have a continuous orientation gradient. On the other hand, when the GAM value is large, the average misorientation within the crystal grain increases, so the local strain within one crystal grain increases.
  • the area ratio of crystal grains having a GAM value in the range of 0.1 ° or more and 0.8 ° or less is 30%. It is in the range of 90% or less.
  • the tensile strength of the copper alloy sheet material can be enhanced, and the shape uniformity of the drawn product can be enhanced.
  • this area ratio by setting this area ratio to 30% or more, the ratio of crystal grains with a small orientation difference in the crystal grains to the crystal grains of the copper alloy sheet increases, so that the crystal grain orientation of the copper alloy sheet is changed. Since it becomes stable, it is possible to improve the drawability of the copper alloy sheet material, particularly the uniformity of the shape of the drawn product.
  • the area ratio to 90% or less, it is possible to suppress a decrease in the tensile strength of the copper alloy sheet material.
  • the GAM value is obtained from crystal orientation data continuously measured using an EBSD detector attached to a high-resolution scanning analytical electron microscope (manufactured by JEOL Ltd., JSM-7001FA) and analysis software (manufactured by TSL, It can be obtained from crystal orientation analysis data calculated using OIM Analysis).
  • EBSD is an abbreviation for Electron Backscatter Diffraction, a crystal orientation analysis technology that uses backscattered electron Kikuchi line diffraction that occurs when a copper plate material, which is a sample, is irradiated with an electron beam in a scanning electron microscope (SEM). It's about.
  • SEM scanning electron microscope
  • Measurements are made with a step size of 0.5 ⁇ m in a field of view of approximately 400 ⁇ m ⁇ 800 ⁇ m. Measurement can be performed on a cross section along the rolling direction, which is finished by embedding a copper alloy sheet material in resin and mechanically polishing and buffing (colloidal silica). Alternatively, the measurement may be performed on the surface of the copper alloy plate that has been electropolished. The measurement area in these cross sections and surfaces is approximately 400 ⁇ m ⁇ 800 ⁇ m. If the sample size does not yield the above field size for both cross-sectional and surface measurements, multiple fields of measurement and an average value may be used. In the analysis of the GAM value, the grain boundary is defined as having a misorientation of 15° or more, and the measurement point included in the grain boundary and having a reliability index CI value of 0.1 or more is the object of analysis. .
  • the average crystal grain size of the crystal grains of the copper alloy sheet material and its standard deviation has an average crystal grain size of 4 ⁇ m or more and 25 ⁇ m obtained from the crystal orientation analysis data of the SEM-EBSD method. It is preferable that the range is as follows and the standard deviation of the average crystal grain size is 6 ⁇ m or less. In the analysis of the average grain size, grain boundaries are defined as those having a misorientation of 15° or more, and grains having a size of 2 pixels or more are analyzed.
  • the copper alloy sheet material of the present invention preferably has a work hardening index (n value) in the range of 0.10 or more and 0.20 or less. By setting the work hardening index within this range, the copper alloy sheet material can have a higher tensile strength without impairing the drawability of the copper alloy sheet material. On the other hand, if the work hardening index is lower than 0.10, the drawability of the copper alloy sheet tends to deteriorate.
  • the work hardening index (n value) can be obtained by the test method specified in JIS Z2253;2011.
  • the work hardening index (n value) can be calculated from data in which the true strain is in the range of 2% or more and 8% or less.
  • the copper alloy sheet material described above can be realized by controlling a combination of the alloy composition and the manufacturing process, and the manufacturing process is not particularly limited. Among them, the following method can be mentioned as an example of a manufacturing process capable of obtaining such high tensile strength and stably excellent drawability.
  • An example of the method for producing a copper alloy sheet material of the present invention is to apply at least a copper alloy material having an alloy composition equivalent to that of the copper alloy sheet material described above to a melting and casting step [step 1] and a reheating step [step 2].
  • hot rolling process [process 3] first cold rolling process [process 4], first annealing process [process 5], second cold rolling process [process 6], second annealing process [process 7],
  • the third annealing step [step 8], the third cold rolling step [step 9] and the fourth annealing step [step 10] are performed in sequence.
  • the ultimate temperature is in the range of 800° C. or more and 1000° C.
  • (i) Melting and casting process [process 1]
  • a copper alloy material having an alloy composition equivalent to the alloy composition described above is melted and cast to obtain a predetermined shape (for example, a thickness of 30 mm, a width of 100 mm, and a length of 150 mm). An ingot is produced.
  • a high-frequency melting furnace is preferably used to melt and cast the copper alloy material in the air, in an inert gas atmosphere, or in a vacuum.
  • the alloy composition of the copper alloy material may not always match perfectly with the alloy composition of the copper alloy sheet material manufactured by adhering or volatilizing in the melting furnace depending on the additive components in each manufacturing process. However, it has substantially the same alloy composition as that of the copper alloy sheet material.
  • the reheating step [step 2] is a step of heat-treating the ingot after the casting step [step 1].
  • the conditions for the heat treatment in the reheating step [step 2] are not particularly limited as long as they are the conditions that are commonly used.
  • An example of the conditions for the heat treatment here is that the temperature reached is in the range of 850° C. or more and 1000° C. or less, and the holding time at the reached temperature is in the range of 1 hour or more and 5 hours or less.
  • the surface of the hot-rolled material after cooling may be chamfered.
  • Chamfering can remove surface oxide films and defects generated in the hot working step [step 3].
  • the conditions for facing are not particularly limited as long as they are the conditions that are commonly used.
  • the amount to be removed from the surface of the hot-rolled material by chamfering can be appropriately adjusted based on the conditions of the hot working step [Step 3]. For example, it can be about 0.5 mm to 4 mm from the surface of the hot-rolled material. can.
  • First cold rolling step [step 4] is a step of cold rolling the hot-rolled material after the hot working step [step 3].
  • the rolling in the first cold rolling step [step 4] can be performed at any rolling reduction in accordance with the thickness of the product.
  • the first annealing step [step 5] is a step of heat-treating the cold-rolled material after the first cold-rolling step [step 4] according to the alloy composition.
  • the annealing conditions in the first annealing step [step 5] are such that the attained temperature is in the range of 800° C. or more and 1000° C. or less and the holding time is in the range of 5 seconds or more and 30 seconds or less, so that the Si compound can be dissolved.
  • the distribution of undissolved Si compounds becomes uniform, and the uniformity of crystal grains during recrystallization increases.
  • the reaching temperature exceeds 1000° C. or the holding time exceeds 30 seconds, the problem of variation in properties due to coarsening of crystal grains and abnormal grain growth occurs, which is not preferable.
  • Second cold rolling step [step 6] is a step of further cold rolling the cold-rolled material after the first annealing step [step 5] using rolling work rolls.
  • the product of the working rate [%] per pass and the diameter of the rolling work roll (rolling roll diameter) [mm] shall be 2000 [% ⁇ mm] or less. If this product is greater than 2000 [% mm], shear deformation is likely to occur only on the surface of the copper alloy sheet material, causing a difference in the amount of deformation and crystal orientation between the inside of the sheet material and the inside of the sheet material. The homogeneity of the crystal grain size is reduced when the crystal is recrystallized by heat treatment. Therefore, in the second cold rolling step [step 6], the product of the working rate [%] per pass and the rolling roll diameter [mm] is preferably 1600 [% mm] or less, more preferably 1000 [% ⁇ mm] or less.
  • the diameter of the rolling work rolls used in the second cold rolling step [step 6] may be in the range of 60 mm or more and 400 mm or less.
  • the working ratio per pass in the second cold rolling step [step 6] may be in the range of 5% or more and 50% or less.
  • the total working ratio in the second cold rolling step [Step 6] may be in the range of 5% or more and 70% or less.
  • the second annealing step [step 7] is an annealing step in which the cold-rolled material after the second cold rolling step [step 6] is subjected to heat treatment to recrystallize.
  • the conditions for the heat treatment in the second annealing step [step 7] are, for example, a reaching temperature range of 800° C. or higher and 1000° C. or lower, and a holding time at the reaching temperature range of 5 seconds or higher and 30 seconds or lower. can do.
  • the reaching temperature exceeds 1000° C. or when the holding time exceeds 30 seconds, the crystal grains tend to coarsen.
  • the holding time exceeds 30 seconds
  • the crystal grain size tends to vary, and the standard deviation of the average crystal grain size increases. easy to invite
  • the temperature reached is less than 800° C. or when the holding time is less than 5 seconds, the amount of solid solution decreases and the amount of precipitation strengthening decreases.
  • the cold-rolled material after the second annealing step [step 7] is preferably cooled immediately.
  • the means for cooling the hot-rolled material is not particularly limited, but from the viewpoint of making it difficult for the tensile strength to decrease due to coarsening of crystal grains, for example, it is preferable to use a means for increasing the cooling rate as much as possible. It is preferable to set the cooling rate to 50° C./second or more by means of, for example, water cooling.
  • the third cold rolling step [step 9] is a step of further cold rolling the cold-rolled material after the third annealing step [step 8].
  • the total working ratio in the third cold rolling step [step 9] is in the range of 1% or more and 10% or less.
  • the total working ratio is less than 1%, the effect of improving the tensile strength of the copper alloy sheet becomes small. Further, when the total working ratio is more than 10%, the drawing workability of the copper alloy sheet is deteriorated.
  • the fourth annealing step [step 10] the cold-rolled material after the third cold rolling step [step 9] is subjected to heat treatment to adjust the mechanical properties of the plate material by immobilizing and recovering dislocations. It is the process of annealing that performs quality.
  • the conditions for the heat treatment in the fourth annealing step [step 10] are such that the ultimate temperature (T) is in the range of 400° C. or more and 600° C. or less, and the relationship with the ultimate temperature (T (° C.)) is expressed by the formula ( Annealing is performed while applying a tension (F (kgf/mm 2 )) that satisfies the inequality shown in I).
  • the holding time at the reached temperature (T) is preferably in the range of 5 seconds or more and 30 seconds or less.
  • tension (F) By applying tension (F) to the cold-rolled material so as to satisfy such an inequality relationship, it is possible to improve the balance of tensile strength, electrical conductivity, and drawability of the obtained copper alloy sheet material.
  • annealing while applying tension (F) to the cold-rolled material makes it easier to reduce the strain remaining in the copper alloy sheet even with a small tension, so the drawability of the copper alloy sheet can be improved.
  • tension, heat treatment temperature, or time are insufficient, the amount of residual strain in the copper alloy sheet increases, and the variation in the orientation of the crystal grains contained in the copper alloy sheet increases. The GAM value increases, resulting in a decrease in drawability.
  • the hot-rolled material is chamfered to remove the oxide film on the surface by shaving about 1 mm to 4 mm from both the front and back surfaces, and then the total processing rate is in the range of 80% or more and 99% or less.
  • a first cold rolling step [step 4] was performed in which the hot rolled material was rolled so that its longitudinal direction was the rolling direction.
  • the rolled material after the third cold rolling step [step 9] is subjected to a holding time in the range of 5 seconds or more and 30 seconds or less while applying tension (F) at the reached temperature described in Table 2.
  • a fourth annealing step [Step 10] was performed to heat-treat at , thereby producing a copper alloy sheet material of the present invention.
  • the tension (F) applied to the rolled material was set within the range of the inequality shown in formula (I).
  • Measurement of tensile strength of copper alloy sheet The measurement of tensile strength is performed by cutting out the test material so that the direction parallel to the rolling direction is the longitudinal direction, No. 13B specified in JIS Z2241. The average value of the tensile strength obtained from the two test pieces was used as the measured value. In addition, in this example, the tensile strength of 550 MPa or more was regarded as a passing level. Table 3 shows the results.
  • the thickness of the test plate material W is 0.15 mm
  • the diameter of the test plate material W is 61 mm
  • the diameter of the punch 14 is 33 mm
  • the radius of curvature R of the corner portion of the tip of the punch 14 is 0.30 mm, 0.50 mm, 0 .75 mm, 0.90 mm, and 1.00 mm
  • the clearance between the punch 14 and the die 12 is 0.35 mm
  • the radius of curvature of the shoulder of the die 12 is 1.0 mm
  • the surface of the test plate material W on the punch 14 side was coated with lubricating oil (trade name: Preton R-303P, manufactured by Sugimura Chemical Industry Co., Ltd.). Table 3 shows the results.
  • the copper alloy sheet materials of Examples 1 to 32 of the present invention have an alloy composition within the appropriate range of the present invention, a tensile strength of 550 MPa or more, and a SEM-EBSD method.
  • the area ratio of the crystal grains having a GAM value in the range of 0.1° or more and 0.8° or less obtained from the crystal orientation analysis data is in the range of 30% or more and 90% or less. were also evaluated as “ ⁇ ” or “ ⁇ ”.
  • the copper alloy sheet materials of Examples 1 to 32 of the present invention had high tensile strength and were able to stably obtain excellent drawability.
  • the copper alloy sheet material of Example 9 of the present invention had a small total working ratio in the third cold rolling step [step 9], or a small tension applied to the cold-rolled material in the fourth annealing step [step 10]. Therefore, it is considered that the balance between tensile strength and drawability is excellent.
  • the copper alloy sheet materials of Examples 13 to 15 of the present invention have a large total amount of Ni and Co, and the total reduction rate in the third cold rolling step [step 9] is small, or the fourth annealing step [step 10]. It is considered that the tension applied to the cold-rolled material in 1 was small, and the balance between tensile strength and drawability was excellent.
  • the copper alloy sheet material of Inventive Example 16 had a small total working ratio in the third cold rolling step [step 9], or a small tension applied to the cold-rolled material in the fourth annealing step [step 10]. Therefore, it is considered that the balance between tensile strength and drawability is excellent. Furthermore, the copper alloy sheet material of Example 16 of the present invention had a small product of the reduction ratio per pass in the second cold rolling step [step 6] and the diameter of the rolling roll, so that the evaluation of the drawability was obtained. It is considered that the fluctuation of the twist is reduced.
  • the copper alloy sheet material of Example 18 of the present invention has a small product of the reduction rate per pass in the second cold rolling step [step 6] and the diameter of the rolling roll, or in the fourth annealing step [step 10]
  • the small tension applied to the cold-rolled material is considered to be the reason why the evaluation results of the drawability and the unevenness of waviness are excellent.
  • the alloy composition, tensile strength, and GAM value are in the range of 0.1° or more and 0.8° or less. At least one of them was out of the proper range of the present invention, so the tensile strength did not reach the acceptable level, or the comprehensive evaluation of drawability was evaluated as "x".

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PCT/JP2022/044745 2021-12-08 2022-12-05 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 Ceased WO2023106262A1 (ja)

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WO2026028551A1 (ja) * 2024-07-31 2026-02-05 古河電気工業株式会社 電子部品用材料およびその製造方法、リードフレーム材およびその製造方法、ならびに半導体パッケージ

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