JP7328471B1 - 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 - Google Patents

銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 Download PDF

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JP7328471B1
JP7328471B1 JP2023512030A JP2023512030A JP7328471B1 JP 7328471 B1 JP7328471 B1 JP 7328471B1 JP 2023512030 A JP2023512030 A JP 2023512030A JP 2023512030 A JP2023512030 A JP 2023512030A JP 7328471 B1 JP7328471 B1 JP 7328471B1
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copper alloy
alloy sheet
range
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JPWO2023106262A1 (https=
JPWO2023106262A5 (https=
Inventor
俊太 秋谷
雄太郎 雨宮
紳悟 川田
親人 菅原
司 高澤
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
JP2023512030A 2021-12-08 2022-12-05 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品 Active JP7328471B1 (ja)

Applications Claiming Priority (3)

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JP2021198962 2021-12-08
JP2021198962 2021-12-08
PCT/JP2022/044745 WO2023106262A1 (ja) 2021-12-08 2022-12-05 銅合金板材およびその製造方法、ならびに電子部品および絞り加工品

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JPWO2023106262A1 JPWO2023106262A1 (https=) 2023-06-15
JP7328471B1 true JP7328471B1 (ja) 2023-08-16
JPWO2023106262A5 JPWO2023106262A5 (https=) 2023-11-09

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JP (1) JP7328471B1 (https=)
KR (1) KR20240074759A (https=)
CN (1) CN118019868A (https=)
TW (1) TW202330951A (https=)
WO (1) WO2023106262A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025183120A1 (ja) * 2024-02-29 2025-09-04 古河電気工業株式会社 銅系導体、撚線導体および電線

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7809883B1 (ja) * 2024-07-31 2026-02-02 古河電気工業株式会社 電子部品用材料およびその製造方法、リードフレーム材およびその製造方法、ならびに半導体パッケージ
WO2026028551A1 (ja) * 2024-07-31 2026-02-05 古河電気工業株式会社 電子部品用材料およびその製造方法、リードフレーム材およびその製造方法、ならびに半導体パッケージ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012122114A (ja) * 2010-12-10 2012-06-28 Mitsubishi Shindoh Co Ltd 深絞り加工性及び耐疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP2012136726A (ja) * 2010-12-24 2012-07-19 Mitsubishi Shindoh Co Ltd 曲げ加工後の耐疲労特性及びばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP2015101760A (ja) * 2013-11-25 2015-06-04 Jx日鉱日石金属株式会社 導電性、耐応力緩和特性および成形加工性に優れる銅合金板
JP2016180131A (ja) * 2015-03-23 2016-10-13 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金板材およびその製造方法並びにリードフレーム
WO2017168803A1 (ja) * 2016-03-31 2017-10-05 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ｓｉ系銅合金板材および製造法
JP2018162510A (ja) * 2017-03-27 2018-10-18 Ｊｘ金属株式会社 電子材料用銅合金及び電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012160684A1 (ja) 2011-05-25 2012-11-29 三菱伸銅株式会社 深絞り加工性に優れたＣｕ－Ｎｉ－Ｓｉ系銅合金板及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012122114A (ja) * 2010-12-10 2012-06-28 Mitsubishi Shindoh Co Ltd 深絞り加工性及び耐疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP2012136726A (ja) * 2010-12-24 2012-07-19 Mitsubishi Shindoh Co Ltd 曲げ加工後の耐疲労特性及びばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP2015101760A (ja) * 2013-11-25 2015-06-04 Jx日鉱日石金属株式会社 導電性、耐応力緩和特性および成形加工性に優れる銅合金板
JP2016180131A (ja) * 2015-03-23 2016-10-13 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金板材およびその製造方法並びにリードフレーム
WO2017168803A1 (ja) * 2016-03-31 2017-10-05 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ｓｉ系銅合金板材および製造法
JP2018162510A (ja) * 2017-03-27 2018-10-18 Ｊｘ金属株式会社 電子材料用銅合金及び電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025183120A1 (ja) * 2024-02-29 2025-09-04 古河電気工業株式会社 銅系導体、撚線導体および電線

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CN118019868A (zh) 2024-05-10
KR20240074759A (ko) 2024-05-28
WO2023106262A1 (ja) 2023-06-15
JPWO2023106262A1 (https=) 2023-06-15
TW202330951A (zh) 2023-08-01

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