JPWO2023073752A1 - - Google Patents

Info

Publication number
JPWO2023073752A1
JPWO2023073752A1 JP2023555883A JP2023555883A JPWO2023073752A1 JP WO2023073752 A1 JPWO2023073752 A1 JP WO2023073752A1 JP 2023555883 A JP2023555883 A JP 2023555883A JP 2023555883 A JP2023555883 A JP 2023555883A JP WO2023073752 A1 JPWO2023073752 A1 JP WO2023073752A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023555883A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023073752A1 publication Critical patent/JPWO2023073752A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023555883A 2021-10-25 2021-10-25 Pending JPWO2023073752A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/039233 WO2023073752A1 (ja) 2021-10-25 2021-10-25 半導体装置、電力変換装置、および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2023073752A1 true JPWO2023073752A1 (ja) 2023-05-04

Family

ID=86157488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023555883A Pending JPWO2023073752A1 (ja) 2021-10-25 2021-10-25

Country Status (4)

Country Link
JP (1) JPWO2023073752A1 (ja)
CN (1) CN118120051A (ja)
DE (1) DE112021008403T5 (ja)
WO (1) WO2023073752A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041363A (ja) * 2004-07-29 2006-02-09 Hitachi Ltd 樹脂封止型半導体装置
JP6041795B2 (ja) 2013-12-10 2016-12-14 三菱電機株式会社 半導体装置
JP6299407B2 (ja) * 2014-05-14 2018-03-28 日産自動車株式会社 パワー半導体モジュール及びその製造方法
US10510640B2 (en) * 2015-01-26 2019-12-17 Miitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device
JP6665664B2 (ja) * 2016-04-27 2020-03-13 富士電機株式会社 半導体装置及びその製造方法
JP2019207897A (ja) * 2016-09-29 2019-12-05 三菱電機株式会社 パワーモジュール、その製造方法および電力変換装置

Also Published As

Publication number Publication date
DE112021008403T5 (de) 2024-08-08
WO2023073752A1 (ja) 2023-05-04
CN118120051A (zh) 2024-05-31

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231004

A01 Written decision to grant a patent or to grant a registration (utility model)

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Effective date: 20240827