JPWO2023007629A1 - - Google Patents
Info
- Publication number
- JPWO2023007629A1 JPWO2023007629A1 JP2023537828A JP2023537828A JPWO2023007629A1 JP WO2023007629 A1 JPWO2023007629 A1 JP WO2023007629A1 JP 2023537828 A JP2023537828 A JP 2023537828A JP 2023537828 A JP2023537828 A JP 2023537828A JP WO2023007629 A1 JPWO2023007629 A1 JP WO2023007629A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/027958 WO2023007629A1 (ja) | 2021-07-28 | 2021-07-28 | 半導体装置の製造方法、及び、半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023007629A1 true JPWO2023007629A1 (ja) | 2023-02-02 |
Family
ID=85087674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023537828A Pending JPWO2023007629A1 (ja) | 2021-07-28 | 2021-07-28 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023007629A1 (ja) |
| TW (1) | TW202320291A (ja) |
| WO (1) | WO2023007629A1 (ja) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8138014B2 (en) * | 2010-01-29 | 2012-03-20 | Stats Chippac, Ltd. | Method of forming thin profile WLCSP with vertical interconnect over package footprint |
| JPWO2014196105A1 (ja) * | 2013-06-03 | 2017-02-23 | パナソニックＩｐマネジメント株式会社 | 半導体装置及びその製造方法 |
| JP2016058655A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社ジェイデバイス | 半導体装置の製造方法 |
| JP6981537B2 (ja) * | 2018-03-20 | 2021-12-15 | 株式会社村田製作所 | 高周波モジュール |
| US10867879B2 (en) * | 2018-09-28 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package and method |
| US11387222B2 (en) * | 2019-10-18 | 2022-07-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit package and method |
-
2021
- 2021-07-28 WO PCT/JP2021/027958 patent/WO2023007629A1/ja active Application Filing
- 2021-07-28 JP JP2023537828A patent/JPWO2023007629A1/ja active Pending
-
2022
- 2022-07-27 TW TW111128091A patent/TW202320291A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023007629A1 (ja) | 2023-02-02 |
| TW202320291A (zh) | 2023-05-16 |