JPWO2023068137A5 - - Google Patents

Info

Publication number
JPWO2023068137A5
JPWO2023068137A5 JP2023554575A JP2023554575A JPWO2023068137A5 JP WO2023068137 A5 JPWO2023068137 A5 JP WO2023068137A5 JP 2023554575 A JP2023554575 A JP 2023554575A JP 2023554575 A JP2023554575 A JP 2023554575A JP WO2023068137 A5 JPWO2023068137 A5 JP WO2023068137A5
Authority
JP
Japan
Prior art keywords
device tray
linear
image
closing
tray according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023554575A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023068137A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/038042 external-priority patent/WO2023068137A1/ja
Publication of JPWO2023068137A1 publication Critical patent/JPWO2023068137A1/ja
Publication of JPWO2023068137A5 publication Critical patent/JPWO2023068137A5/ja
Pending legal-status Critical Current

Links

JP2023554575A 2021-10-18 2022-10-12 Pending JPWO2023068137A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021170345 2021-10-18
PCT/JP2022/038042 WO2023068137A1 (ja) 2021-10-18 2022-10-12 デバイストレイ

Publications (2)

Publication Number Publication Date
JPWO2023068137A1 JPWO2023068137A1 (https=) 2023-04-27
JPWO2023068137A5 true JPWO2023068137A5 (https=) 2025-09-26

Family

ID=86059172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023554575A Pending JPWO2023068137A1 (https=) 2021-10-18 2022-10-12

Country Status (3)

Country Link
JP (1) JPWO2023068137A1 (https=)
CN (1) CN219928232U (https=)
WO (1) WO2023068137A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183443U (ja) * 1984-05-16 1985-12-05 三菱電機株式会社 不使用パツド判別マ−ク付半導体チツプ
JP4540308B2 (ja) * 2003-06-13 2010-09-08 ルネサスエレクトロニクス株式会社 半導体装置の搬送方法
JP7304709B2 (ja) * 2019-02-19 2023-07-07 株式会社ディスコ 被加工物の加工方法
JP2021089920A (ja) * 2019-12-03 2021-06-10 株式会社村田製作所 チップ状電子部品用ジグ

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