JPWO2023063016A1 - - Google Patents

Info

Publication number
JPWO2023063016A1
JPWO2023063016A1 JP2023505382A JP2023505382A JPWO2023063016A1 JP WO2023063016 A1 JPWO2023063016 A1 JP WO2023063016A1 JP 2023505382 A JP2023505382 A JP 2023505382A JP 2023505382 A JP2023505382 A JP 2023505382A JP WO2023063016 A1 JPWO2023063016 A1 JP WO2023063016A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023505382A
Other versions
JPWO2023063016A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023063016A1 publication Critical patent/JPWO2023063016A1/ja
Publication of JPWO2023063016A5 publication Critical patent/JPWO2023063016A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023505382A 2021-10-12 2022-09-15 Pending JPWO2023063016A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021167335 2021-10-12
PCT/JP2022/034525 WO2023063016A1 (ja) 2021-10-12 2022-09-15 ウエハ載置台

Publications (2)

Publication Number Publication Date
JPWO2023063016A1 true JPWO2023063016A1 (ja) 2023-04-20
JPWO2023063016A5 JPWO2023063016A5 (ja) 2023-09-21

Family

ID=85987445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505382A Pending JPWO2023063016A1 (ja) 2021-10-12 2022-09-15

Country Status (2)

Country Link
JP (1) JPWO2023063016A1 (ja)
WO (1) WO2023063016A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982683A (ja) * 1995-09-12 1997-03-28 Toshiba Corp ドライエッチング装置
JP3225850B2 (ja) * 1995-09-20 2001-11-05 株式会社日立製作所 静電吸着電極およびその製作方法
JP4514587B2 (ja) * 2004-11-29 2010-07-28 京セラ株式会社 基板保持部材
US7667944B2 (en) * 2007-06-29 2010-02-23 Praxair Technology, Inc. Polyceramic e-chuck
JP6182082B2 (ja) * 2013-03-15 2017-08-16 日本碍子株式会社 緻密質複合材料、その製法及び半導体製造装置用部材
JP6741548B2 (ja) * 2016-10-14 2020-08-19 日本碍子株式会社 半導体製造装置用部材及びその製法

Also Published As

Publication number Publication date
WO2023063016A1 (ja) 2023-04-20

Similar Documents

Publication Publication Date Title
BR112023012656A2 (ja)
BR112021014123A2 (ja)
BR112022024743A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011539A2 (ja)
BR112023011610A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)
BR102021016200A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230125

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240326

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240423