JPWO2023054331A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023054331A5 JPWO2023054331A5 JP2023551511A JP2023551511A JPWO2023054331A5 JP WO2023054331 A5 JPWO2023054331 A5 JP WO2023054331A5 JP 2023551511 A JP2023551511 A JP 2023551511A JP 2023551511 A JP2023551511 A JP 2023551511A JP WO2023054331 A5 JPWO2023054331 A5 JP WO2023054331A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic polyurethane
- polishing layer
- layer according
- sheet
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021161605 | 2021-09-30 | ||
| PCT/JP2022/035870 WO2023054331A1 (ja) | 2021-09-30 | 2022-09-27 | 研磨層用熱可塑性ポリウレタン、研磨層、及び研磨パッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054331A1 JPWO2023054331A1 (https=) | 2023-04-06 |
| JPWO2023054331A5 true JPWO2023054331A5 (https=) | 2024-06-21 |
Family
ID=85782728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551511A Pending JPWO2023054331A1 (https=) | 2021-09-30 | 2022-09-27 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20240399530A1 (https=) |
| EP (1) | EP4410478A4 (https=) |
| JP (1) | JPWO2023054331A1 (https=) |
| KR (1) | KR20240087742A (https=) |
| CN (1) | CN117980110A (https=) |
| IL (1) | IL311635A (https=) |
| TW (1) | TW202328258A (https=) |
| WO (1) | WO2023054331A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI897494B (zh) * | 2024-06-21 | 2025-09-11 | 中國砂輪企業股份有限公司 | 晶圓研磨系統及研磨盤組件 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US9321142B2 (en) | 2005-09-22 | 2016-04-26 | Kuraray Co., Ltd. | Polymer material, foam obtained from same, and polishing pad using those |
| JP4950564B2 (ja) * | 2006-06-09 | 2012-06-13 | 株式会社クラレ | 高分子材料、それから得られる発泡体およびこれらを用いた研磨パッド |
| US8314192B2 (en) * | 2006-07-28 | 2012-11-20 | Toray Industries, Inc. | Interpenetrating polymer network structure and polishing pad, and process for producing the same |
| TWI349596B (en) * | 2007-03-20 | 2011-10-01 | Kuraray Co | Cushion for polishing pad and polishing pad using the same |
| US9951054B2 (en) * | 2009-04-23 | 2018-04-24 | Cabot Microelectronics Corporation | CMP porous pad with particles in a polymeric matrix |
| JP2011021134A (ja) * | 2009-07-17 | 2011-02-03 | Lintec Corp | 共重合ポリエステルウレタン樹脂、樹脂フィルム印刷用アンカーコート剤組成物、印刷用コートフィルム及び印刷用粘着シート |
| EP2517828A1 (en) | 2009-12-22 | 2012-10-31 | JSR Corporation | Pad for chemical mechanical polishing and method of chemical mechanical polishing using same |
| JP6178191B2 (ja) * | 2012-09-28 | 2017-08-09 | 富士紡ホールディングス株式会社 | 研磨パッド |
| JP6184856B2 (ja) * | 2013-12-16 | 2017-08-23 | 株式会社クラレ | 研磨パッドの製造方法および該研磨パッドを用いる研磨方法 |
| US9589786B2 (en) * | 2014-04-28 | 2017-03-07 | National Center For Advanced Packaging Co., Ltd | Method for polishing a polymer surface |
| US9259821B2 (en) * | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
| US10625391B2 (en) * | 2014-10-31 | 2020-04-21 | Kuraray Co., Ltd. | Non-porous molded article for polishing layer, polishing pad, and polishing method |
| WO2018021428A1 (ja) * | 2016-07-29 | 2018-02-01 | 株式会社クラレ | 研磨パッドおよびそれを用いた研磨方法 |
| US10106662B2 (en) | 2016-08-04 | 2018-10-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Thermoplastic poromeric polishing pad |
| JP6976742B2 (ja) * | 2017-06-29 | 2021-12-08 | ブリヂストンスポーツ株式会社 | ゴルフボール |
| KR102524174B1 (ko) | 2018-08-11 | 2023-04-20 | 주식회사 쿠라레 | 연마층용 폴리우레탄, 연마층 및 연마 패드 |
| WO2020115968A1 (ja) * | 2018-12-03 | 2020-06-11 | 株式会社クラレ | 研磨層用ポリウレタン、研磨層及び研磨パッド |
-
2022
- 2022-09-27 US US18/695,389 patent/US20240399530A1/en active Pending
- 2022-09-27 EP EP22876197.9A patent/EP4410478A4/en active Pending
- 2022-09-27 IL IL311635A patent/IL311635A/en unknown
- 2022-09-27 KR KR1020247009870A patent/KR20240087742A/ko active Pending
- 2022-09-27 CN CN202280064671.7A patent/CN117980110A/zh active Pending
- 2022-09-27 JP JP2023551511A patent/JPWO2023054331A1/ja active Pending
- 2022-09-27 WO PCT/JP2022/035870 patent/WO2023054331A1/ja not_active Ceased
- 2022-09-30 TW TW111137193A patent/TW202328258A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101939483B (zh) | 造纸用的靴形压榨带 | |
| EP2814860B1 (en) | Elastomers for paper mill equipment | |
| JP2007313640A5 (https=) | ||
| CN101959699B (zh) | 由低游离二苯基甲烷二异氰酸酯预聚物得到的聚氨酯弹性体制品 | |
| JP2018527604A5 (https=) | ||
| JP2014097567A5 (https=) | ||
| TW200920548A (en) | Cushion for polishing pad and polishing pad using the same | |
| JP2009185427A5 (https=) | ||
| KR102489678B1 (ko) | 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법 | |
| JPWO2023054331A5 (https=) | ||
| WO2004067598A1 (ja) | 熱可塑性ポリウレタンおよびその使用 | |
| JP2015047692A5 (https=) | ||
| JPWO2022260180A5 (https=) | ||
| JP2005136400A5 (https=) | ||
| JP2008111220A (ja) | 製紙用シュープレスベルト | |
| EP3013878B1 (en) | Curative agent for coatings on industrial rollers | |
| JP5707522B1 (ja) | 籾摺りロール | |
| JP2665626B2 (ja) | 透湿性ポリウレタン樹脂 | |
| JP2022533156A5 (https=) | ||
| TW201936837A (zh) | 熱熔聚胺基甲酸酯接著劑薄膜及積層纖維結構體 | |
| JP4220632B2 (ja) | フローリング材用接着剤組成物 | |
| CN118434934A (zh) | 具有改进断裂和撕裂特性的用于靴式压机的压套或传送带 | |
| MX2008001424A (es) | Materiales repelentes. | |
| JP4522313B2 (ja) | 合成皮革用の積層体 | |
| JP2008513202A5 (https=) |