CN117980110A - 抛光层用热塑性聚氨酯、抛光层及抛光垫 - Google Patents

抛光层用热塑性聚氨酯、抛光层及抛光垫 Download PDF

Info

Publication number
CN117980110A
CN117980110A CN202280064671.7A CN202280064671A CN117980110A CN 117980110 A CN117980110 A CN 117980110A CN 202280064671 A CN202280064671 A CN 202280064671A CN 117980110 A CN117980110 A CN 117980110A
Authority
CN
China
Prior art keywords
polishing
polishing layer
thermoplastic polyurethane
water
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280064671.7A
Other languages
English (en)
Chinese (zh)
Inventor
砂山梓纱
合志佑有子
加藤充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Original Assignee
Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Publication of CN117980110A publication Critical patent/CN117980110A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0895—Manufacture of polymers by continuous processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3203—Polyhydroxy compounds
    • C08G18/3206—Polyhydroxy compounds aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4804—Two or more polyethers of different physical or chemical nature
    • C08G18/4808—Mixtures of two or more polyetherdiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4833—Polyethers containing oxyethylene units
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202280064671.7A 2021-09-30 2022-09-27 抛光层用热塑性聚氨酯、抛光层及抛光垫 Pending CN117980110A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021161605 2021-09-30
JP2021-161605 2021-09-30
PCT/JP2022/035870 WO2023054331A1 (ja) 2021-09-30 2022-09-27 研磨層用熱可塑性ポリウレタン、研磨層、及び研磨パッド

Publications (1)

Publication Number Publication Date
CN117980110A true CN117980110A (zh) 2024-05-03

Family

ID=85782728

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280064671.7A Pending CN117980110A (zh) 2021-09-30 2022-09-27 抛光层用热塑性聚氨酯、抛光层及抛光垫

Country Status (8)

Country Link
US (1) US20240399530A1 (https=)
EP (1) EP4410478A4 (https=)
JP (1) JPWO2023054331A1 (https=)
KR (1) KR20240087742A (https=)
CN (1) CN117980110A (https=)
IL (1) IL311635A (https=)
TW (1) TW202328258A (https=)
WO (1) WO2023054331A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI897494B (zh) * 2024-06-21 2025-09-11 中國砂輪企業股份有限公司 晶圓研磨系統及研磨盤組件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007326984A (ja) * 2006-06-09 2007-12-20 Kuraray Co Ltd 高分子材料、それから得られる発泡体およびこれらを用いた研磨パッド
CN101678527A (zh) * 2007-03-20 2010-03-24 可乐丽股份有限公司 用于抛光垫的衬垫和使用该衬垫的抛光垫
JP2011021134A (ja) * 2009-07-17 2011-02-03 Lintec Corp 共重合ポリエステルウレタン樹脂、樹脂フィルム印刷用アンカーコート剤組成物、印刷用コートフィルム及び印刷用粘着シート
JP2014079878A (ja) * 2012-09-28 2014-05-08 Fujibo Holdings Inc 研磨パッド
US20150375362A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
CN107073678A (zh) * 2014-10-31 2017-08-18 株式会社可乐丽 抛光层用非多孔性成型体、抛光垫及抛光方法
WO2020115968A1 (ja) * 2018-12-03 2020-06-11 株式会社クラレ 研磨層用ポリウレタン、研磨層及び研磨パッド

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US9321142B2 (en) 2005-09-22 2016-04-26 Kuraray Co., Ltd. Polymer material, foam obtained from same, and polishing pad using those
US8314192B2 (en) * 2006-07-28 2012-11-20 Toray Industries, Inc. Interpenetrating polymer network structure and polishing pad, and process for producing the same
US9951054B2 (en) * 2009-04-23 2018-04-24 Cabot Microelectronics Corporation CMP porous pad with particles in a polymeric matrix
EP2517828A1 (en) 2009-12-22 2012-10-31 JSR Corporation Pad for chemical mechanical polishing and method of chemical mechanical polishing using same
JP6184856B2 (ja) * 2013-12-16 2017-08-23 株式会社クラレ 研磨パッドの製造方法および該研磨パッドを用いる研磨方法
US9589786B2 (en) * 2014-04-28 2017-03-07 National Center For Advanced Packaging Co., Ltd Method for polishing a polymer surface
WO2018021428A1 (ja) * 2016-07-29 2018-02-01 株式会社クラレ 研磨パッドおよびそれを用いた研磨方法
US10106662B2 (en) 2016-08-04 2018-10-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Thermoplastic poromeric polishing pad
JP6976742B2 (ja) * 2017-06-29 2021-12-08 ブリヂストンスポーツ株式会社 ゴルフボール
KR102524174B1 (ko) 2018-08-11 2023-04-20 주식회사 쿠라레 연마층용 폴리우레탄, 연마층 및 연마 패드

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007326984A (ja) * 2006-06-09 2007-12-20 Kuraray Co Ltd 高分子材料、それから得られる発泡体およびこれらを用いた研磨パッド
CN101678527A (zh) * 2007-03-20 2010-03-24 可乐丽股份有限公司 用于抛光垫的衬垫和使用该衬垫的抛光垫
JP2011021134A (ja) * 2009-07-17 2011-02-03 Lintec Corp 共重合ポリエステルウレタン樹脂、樹脂フィルム印刷用アンカーコート剤組成物、印刷用コートフィルム及び印刷用粘着シート
JP2014079878A (ja) * 2012-09-28 2014-05-08 Fujibo Holdings Inc 研磨パッド
US20150375362A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
CN105313003A (zh) * 2014-06-25 2016-02-10 罗门哈斯电子材料Cmp控股股份有限公司 具有调整耐受性的化学机械抛光层调配物
CN107073678A (zh) * 2014-10-31 2017-08-18 株式会社可乐丽 抛光层用非多孔性成型体、抛光垫及抛光方法
US20170291275A1 (en) * 2014-10-31 2017-10-12 Kurray Co., Ltd. Non-porous molded article for polishing layer, polishing pad, and polishing method
WO2020115968A1 (ja) * 2018-12-03 2020-06-11 株式会社クラレ 研磨層用ポリウレタン、研磨層及び研磨パッド
CN113039041A (zh) * 2018-12-03 2021-06-25 株式会社可乐丽 抛光层用聚氨酯、抛光层及抛光垫

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI897494B (zh) * 2024-06-21 2025-09-11 中國砂輪企業股份有限公司 晶圓研磨系統及研磨盤組件

Also Published As

Publication number Publication date
KR20240087742A (ko) 2024-06-19
EP4410478A4 (en) 2025-10-01
IL311635A (en) 2024-05-01
TW202328258A (zh) 2023-07-16
JPWO2023054331A1 (https=) 2023-04-06
EP4410478A1 (en) 2024-08-07
US20240399530A1 (en) 2024-12-05
WO2023054331A1 (ja) 2023-04-06

Similar Documents

Publication Publication Date Title
EP3493244B1 (en) Polishing pad and polishing method using same
US10625391B2 (en) Non-porous molded article for polishing layer, polishing pad, and polishing method
KR102398128B1 (ko) 연마층용 성형체 및 연마 패드
CN112839985B (zh) 抛光层用聚氨酯、抛光层、抛光垫及抛光层的改性方法
TW202128807A (zh) 聚胺基甲酸酯、研磨層、研磨墊及研磨方法
KR102489189B1 (ko) 폴리우레탄의 개질 방법, 폴리우레탄, 연마 패드 및 연마 패드의 개질 방법
CN117980110A (zh) 抛光层用热塑性聚氨酯、抛光层及抛光垫
US20240383097A1 (en) Polishing pad
US20250153304A1 (en) Polishing layer, polishing pad, method for manufacturing polishing pad, and polishing method
JP7611411B2 (ja) 研磨パッド
HK1237715A1 (en) Nonporous molded article for polishing layer, polishing pad, and polishing method
HK1237715B (zh) 抛光层用非多孔性成型体、抛光垫及抛光方法
HK40001109B (en) Polishing pad and polishing method using same
HK1236889A1 (en) Polishing-layer molded body, and polishing pad

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination