JPWO2023053875A1 - - Google Patents

Info

Publication number
JPWO2023053875A1
JPWO2023053875A1 JP2023550504A JP2023550504A JPWO2023053875A1 JP WO2023053875 A1 JPWO2023053875 A1 JP WO2023053875A1 JP 2023550504 A JP2023550504 A JP 2023550504A JP 2023550504 A JP2023550504 A JP 2023550504A JP WO2023053875 A1 JPWO2023053875 A1 JP WO2023053875A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023550504A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023053875A1 publication Critical patent/JPWO2023053875A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2023550504A 2021-09-29 2022-09-07 Pending JPWO2023053875A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159024 2021-09-29
PCT/JP2022/033568 WO2023053875A1 (fr) 2021-09-29 2022-09-07 Résine époxy modifiée, composition de résine, objet durci, stratifié pour circuit électrique/électronique, et procédé de production de résine époxy modifiée

Publications (1)

Publication Number Publication Date
JPWO2023053875A1 true JPWO2023053875A1 (fr) 2023-04-06

Family

ID=85782392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023550504A Pending JPWO2023053875A1 (fr) 2021-09-29 2022-09-07

Country Status (3)

Country Link
JP (1) JPWO2023053875A1 (fr)
TW (1) TW202313753A (fr)
WO (1) WO2023053875A1 (fr)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3642353B2 (ja) * 1995-06-07 2005-04-27 大日本インキ化学工業株式会社 エポキシ樹脂組成物及びエポキシ樹脂の製造法
JPH10168287A (ja) * 1996-12-06 1998-06-23 Dainippon Ink & Chem Inc エポキシ樹脂組成物
JP6672699B2 (ja) * 2014-10-29 2020-03-25 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP6686666B2 (ja) * 2016-04-21 2020-04-22 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP7069613B2 (ja) * 2017-09-19 2022-05-18 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板
JP2019059867A (ja) * 2017-09-27 2019-04-18 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
WO2020145262A1 (fr) * 2019-01-10 2020-07-16 三菱ケミカル株式会社 Résine époxy modifiée, composition de résine époxy, produit durci, et plaque stratifiée pour circuits électriques et électroniques
TW202142585A (zh) * 2020-03-19 2021-11-16 日商日鐵化學材料股份有限公司 苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及苯氧基樹脂的製造方法

Also Published As

Publication number Publication date
TW202313753A (zh) 2023-04-01
WO2023053875A1 (fr) 2023-04-06

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