JPWO2023032721A1 - - Google Patents

Info

Publication number
JPWO2023032721A1
JPWO2023032721A1 JP2023545456A JP2023545456A JPWO2023032721A1 JP WO2023032721 A1 JPWO2023032721 A1 JP WO2023032721A1 JP 2023545456 A JP2023545456 A JP 2023545456A JP 2023545456 A JP2023545456 A JP 2023545456A JP WO2023032721 A1 JPWO2023032721 A1 JP WO2023032721A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023545456A
Other languages
Japanese (ja)
Other versions
JP7513215B2 (ja
JPWO2023032721A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032721A1 publication Critical patent/JPWO2023032721A1/ja
Publication of JPWO2023032721A5 publication Critical patent/JPWO2023032721A5/ja
Application granted granted Critical
Publication of JP7513215B2 publication Critical patent/JP7513215B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023545456A 2021-08-30 2022-08-19 基板保持装置、及び導電膜付き基板の製造方法 Active JP7513215B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021139521 2021-08-30
JP2021139521 2021-08-30
PCT/JP2022/031468 WO2023032721A1 (ja) 2021-08-30 2022-08-19 基板保持装置、及び導電膜付き基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023032721A1 true JPWO2023032721A1 (https=) 2023-03-09
JPWO2023032721A5 JPWO2023032721A5 (https=) 2023-12-04
JP7513215B2 JP7513215B2 (ja) 2024-07-09

Family

ID=85412512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545456A Active JP7513215B2 (ja) 2021-08-30 2022-08-19 基板保持装置、及び導電膜付き基板の製造方法

Country Status (2)

Country Link
JP (1) JP7513215B2 (https=)
WO (1) WO2023032721A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08313856A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板搬送装置
JP2006328518A (ja) * 2005-05-30 2006-12-07 Optrex Corp スパッタ成膜装置
JP2008235294A (ja) * 2007-03-16 2008-10-02 Shinon Denki Sangyo Kk 半導体集積回路用トレー
JP2011214034A (ja) * 2010-03-31 2011-10-27 Seiko Epson Corp スパッタ装置
JP2015175865A (ja) * 2014-03-13 2015-10-05 セイコーエプソン株式会社 光学部品、光学部品の製造方法、電子機器、および移動体
JP2016092025A (ja) * 2014-10-29 2016-05-23 東レエンジニアリング株式会社 基板保持装置および方法ならびに基板検査装置
JP2016519778A (ja) * 2013-03-12 2016-07-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 極端紫外線リソグラフィマスクブランク製造システムとそのための操作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4601932B2 (ja) * 2003-09-16 2010-12-22 大日本印刷株式会社 基板収納ケース

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08313856A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板搬送装置
JP2006328518A (ja) * 2005-05-30 2006-12-07 Optrex Corp スパッタ成膜装置
JP2008235294A (ja) * 2007-03-16 2008-10-02 Shinon Denki Sangyo Kk 半導体集積回路用トレー
JP2011214034A (ja) * 2010-03-31 2011-10-27 Seiko Epson Corp スパッタ装置
JP2016519778A (ja) * 2013-03-12 2016-07-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 極端紫外線リソグラフィマスクブランク製造システムとそのための操作方法
JP2015175865A (ja) * 2014-03-13 2015-10-05 セイコーエプソン株式会社 光学部品、光学部品の製造方法、電子機器、および移動体
JP2016092025A (ja) * 2014-10-29 2016-05-23 東レエンジニアリング株式会社 基板保持装置および方法ならびに基板検査装置

Also Published As

Publication number Publication date
WO2023032721A1 (ja) 2023-03-09
JP7513215B2 (ja) 2024-07-09

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
JPWO2023032721A1 (https=)
BR112023016292A2 (https=)
BR112023011610A2 (https=)
BR112023011539A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)
BR102021016375A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231002

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231002

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20231002

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240528

R150 Certificate of patent or registration of utility model

Ref document number: 7513215

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150