JPWO2023002966A1 - - Google Patents

Info

Publication number
JPWO2023002966A1
JPWO2023002966A1 JP2023536745A JP2023536745A JPWO2023002966A1 JP WO2023002966 A1 JPWO2023002966 A1 JP WO2023002966A1 JP 2023536745 A JP2023536745 A JP 2023536745A JP 2023536745 A JP2023536745 A JP 2023536745A JP WO2023002966 A1 JPWO2023002966 A1 JP WO2023002966A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023536745A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023002966A1 publication Critical patent/JPWO2023002966A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023536745A 2021-07-19 2022-07-19 Pending JPWO2023002966A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021118634 2021-07-19
PCT/JP2022/027972 WO2023002966A1 (ja) 2021-07-19 2022-07-19 光学用途紫外線活性型液状シリコーン組成物

Publications (1)

Publication Number Publication Date
JPWO2023002966A1 true JPWO2023002966A1 (ja) 2023-01-26

Family

ID=84979289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023536745A Pending JPWO2023002966A1 (ja) 2021-07-19 2022-07-19

Country Status (7)

Country Link
EP (1) EP4375335A1 (ja)
JP (1) JPWO2023002966A1 (ja)
KR (1) KR20240035505A (ja)
CN (1) CN117751165A (ja)
CA (1) CA3226985A1 (ja)
TW (1) TW202311436A (ja)
WO (1) WO2023002966A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206855B2 (ja) 1993-11-10 2001-09-10 セントラル硝子株式会社 ホログラフィック表示装置
JP3865638B2 (ja) 2002-01-23 2007-01-10 信越化学工業株式会社 オルガノポリシロキサンゲル組成物
CN102163394B (zh) 2006-07-14 2013-12-25 迪睿合电子材料有限公司 图像显示装置、树脂组成物及树脂固化物层
JP2013087199A (ja) 2011-10-18 2013-05-13 Shin-Etsu Chemical Co Ltd 付加硬化型オルガノポリシロキサン組成物の硬化方法
JP5811117B2 (ja) 2013-03-05 2015-11-11 信越化学工業株式会社 硬化性シリコーン組成物の硬化方法
EP3565014A4 (en) 2016-12-27 2020-08-12 Momentive Performance Materials Korea Co., Ltd. ENCAPSULATION COMPOSITION FOR ORGANIC ELECTRONIC DEVICE AND ENCLOSURE MANUFACTURED THEREOF
JP7130316B2 (ja) * 2017-07-05 2022-09-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物
JP6828661B2 (ja) * 2017-11-14 2021-02-10 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物
JP2019210351A (ja) 2018-06-01 2019-12-12 信越化学工業株式会社 画像表示装置用紫外線硬化型液状オルガノポリシロキサン組成物、その硬化方法、画像表示装置部材の貼合方法、及び画像表示装置
JP2019218495A (ja) 2018-06-21 2019-12-26 信越化学工業株式会社 紫外線硬化型シリコーンゴム組成物および硬化物
CN113015775B (zh) * 2018-11-13 2023-08-08 迈图高新材料日本合同公司 粘接性聚有机硅氧烷组合物

Also Published As

Publication number Publication date
CN117751165A (zh) 2024-03-22
TW202311436A (zh) 2023-03-16
WO2023002966A1 (ja) 2023-01-26
EP4375335A1 (en) 2024-05-29
KR20240035505A (ko) 2024-03-15
CA3226985A1 (en) 2023-01-26

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