JPWO2022255122A5 - - Google Patents

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Publication number
JPWO2022255122A5
JPWO2022255122A5 JP2023525725A JP2023525725A JPWO2022255122A5 JP WO2022255122 A5 JPWO2022255122 A5 JP WO2022255122A5 JP 2023525725 A JP2023525725 A JP 2023525725A JP 2023525725 A JP2023525725 A JP 2023525725A JP WO2022255122 A5 JPWO2022255122 A5 JP WO2022255122A5
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JP
Japan
Prior art keywords
group
hydrogen atom
benzyl
phenyl
methyl
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JP2023525725A
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English (en)
Japanese (ja)
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JP7733730B2 (ja
JPWO2022255122A1 (cg-RX-API-DMAC7.html
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Priority claimed from PCT/JP2022/020887 external-priority patent/WO2022255122A1/ja
Publication of JPWO2022255122A1 publication Critical patent/JPWO2022255122A1/ja
Publication of JPWO2022255122A5 publication Critical patent/JPWO2022255122A5/ja
Application granted granted Critical
Publication of JP7733730B2 publication Critical patent/JP7733730B2/ja
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JP2023525725A 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法 Active JP7733730B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021094424 2021-06-04
JP2021094424 2021-06-04
PCT/JP2022/020887 WO2022255122A1 (ja) 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022255122A1 JPWO2022255122A1 (cg-RX-API-DMAC7.html) 2022-12-08
JPWO2022255122A5 true JPWO2022255122A5 (cg-RX-API-DMAC7.html) 2024-02-01
JP7733730B2 JP7733730B2 (ja) 2025-09-03

Family

ID=84323263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525725A Active JP7733730B2 (ja) 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法

Country Status (3)

Country Link
JP (1) JP7733730B2 (cg-RX-API-DMAC7.html)
TW (1) TW202248266A (cg-RX-API-DMAC7.html)
WO (1) WO2022255122A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023042650A1 (ja) * 2021-09-14 2023-03-23 日鉄ケミカル＆マテリアル株式会社 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3268498B2 (ja) * 1990-05-01 2002-03-25 東都化成株式会社 リン含有難燃性エポキシ樹脂
JPH10168287A (ja) * 1996-12-06 1998-06-23 Dainippon Ink & Chem Inc エポキシ樹脂組成物
TW202142584A (zh) * 2020-03-27 2021-11-16 日商日鐵化學材料股份有限公司 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法

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