JPWO2022230806A1 - - Google Patents
Info
- Publication number
- JPWO2022230806A1 JPWO2022230806A1 JP2023517507A JP2023517507A JPWO2022230806A1 JP WO2022230806 A1 JPWO2022230806 A1 JP WO2022230806A1 JP 2023517507 A JP2023517507 A JP 2023517507A JP 2023517507 A JP2023517507 A JP 2023517507A JP WO2022230806 A1 JPWO2022230806 A1 JP WO2022230806A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021077596 | 2021-04-30 | ||
| JP2021077623 | 2021-04-30 | ||
| PCT/JP2022/018722 WO2022230806A1 (ja) | 2021-04-30 | 2022-04-25 | 半導体モジュールおよび半導体モジュールの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230806A1 true JPWO2022230806A1 (https=) | 2022-11-03 |
| JPWO2022230806A5 JPWO2022230806A5 (https=) | 2024-02-06 |
Family
ID=83847316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517507A Pending JPWO2022230806A1 (https=) | 2021-04-30 | 2022-04-25 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240213207A1 (https=) |
| EP (1) | EP4333029A4 (https=) |
| JP (1) | JPWO2022230806A1 (https=) |
| WO (1) | WO2022230806A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018195724A (ja) * | 2017-05-18 | 2018-12-06 | 三菱電機株式会社 | パワーモジュールおよびその製造方法ならびに電力変換装置 |
| WO2019087920A1 (ja) * | 2017-10-30 | 2019-05-09 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| JP2019186457A (ja) * | 2018-04-13 | 2019-10-24 | 三菱電機株式会社 | パワーモジュール及びその製造方法 |
| JP2020044480A (ja) * | 2018-09-18 | 2020-03-26 | 日立化成株式会社 | 部材接続方法及び接続体 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101204187B1 (ko) * | 2010-11-02 | 2012-11-23 | 삼성전기주식회사 | 소성 접합을 이용한 파워 모듈 및 그 제조 방법 |
| US11469205B2 (en) * | 2013-03-09 | 2022-10-11 | Adventive International Ltd. | Universal surface-mount semiconductor package |
| JP2014207389A (ja) * | 2013-04-15 | 2014-10-30 | 株式会社東芝 | 半導体パッケージ |
| JP6072667B2 (ja) * | 2013-11-12 | 2017-02-01 | 三菱電機株式会社 | 半導体モジュールとその製造方法 |
| US10894302B2 (en) * | 2014-06-23 | 2021-01-19 | Alpha Assembly Solutions Inc. | Multilayered metal nano and micron particles |
| JP6272512B2 (ja) * | 2015-01-26 | 2018-01-31 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6794987B2 (ja) * | 2015-09-07 | 2020-12-02 | 昭和電工マテリアルズ株式会社 | 接合用銅ペースト、接合体の製造方法及び半導体装置の製造方法 |
| DE112016006332B4 (de) * | 2016-01-28 | 2021-02-04 | Mitsubishi Electric Corporation | Leistungsmodul |
| KR102687424B1 (ko) * | 2017-01-11 | 2024-07-22 | 가부시끼가이샤 레조낙 | 무가압 접합용 구리 페이스트, 접합체 및 반도체 장치 |
| JP2018182198A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社東芝 | 半導体装置 |
| JP6945418B2 (ja) * | 2017-10-24 | 2021-10-06 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US10861775B2 (en) * | 2018-09-28 | 2020-12-08 | Semiconductor Components Industries, Llc | Connecting clip design for pressure sintering |
| CN110762431A (zh) | 2019-11-08 | 2020-02-07 | 廖建波 | 一种组合型led路灯 |
| JP2021077596A (ja) | 2019-11-13 | 2021-05-20 | 株式会社豊田自動織機 | リチウムイオン二次電池の充電方法 |
-
2022
- 2022-04-25 JP JP2023517507A patent/JPWO2022230806A1/ja active Pending
- 2022-04-25 US US18/555,670 patent/US20240213207A1/en active Pending
- 2022-04-25 WO PCT/JP2022/018722 patent/WO2022230806A1/ja not_active Ceased
- 2022-04-25 EP EP22795719.8A patent/EP4333029A4/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018195724A (ja) * | 2017-05-18 | 2018-12-06 | 三菱電機株式会社 | パワーモジュールおよびその製造方法ならびに電力変換装置 |
| WO2019087920A1 (ja) * | 2017-10-30 | 2019-05-09 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| JP2019186457A (ja) * | 2018-04-13 | 2019-10-24 | 三菱電機株式会社 | パワーモジュール及びその製造方法 |
| JP2020044480A (ja) * | 2018-09-18 | 2020-03-26 | 日立化成株式会社 | 部材接続方法及び接続体 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4333029A4 (en) | 2024-11-20 |
| WO2022230806A1 (ja) | 2022-11-03 |
| US20240213207A1 (en) | 2024-06-27 |
| EP4333029A1 (en) | 2024-03-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230710 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250205 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251223 |