JPWO2022230293A1 - - Google Patents

Info

Publication number
JPWO2022230293A1
JPWO2022230293A1 JP2023517066A JP2023517066A JPWO2022230293A1 JP WO2022230293 A1 JPWO2022230293 A1 JP WO2022230293A1 JP 2023517066 A JP2023517066 A JP 2023517066A JP 2023517066 A JP2023517066 A JP 2023517066A JP WO2022230293 A1 JPWO2022230293 A1 JP WO2022230293A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023517066A
Other languages
Japanese (ja)
Other versions
JP7846096B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022230293A1 publication Critical patent/JPWO2022230293A1/ja
Application granted granted Critical
Publication of JP7846096B2 publication Critical patent/JP7846096B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/015Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/061Manufacture or treatment of FETs having Schottky gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/80FETs having rectifying junction gate electrodes
    • H10D30/87FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10D62/299Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
JP2023517066A 2021-04-30 2022-02-08 半導体装置 Active JP7846096B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021077976 2021-04-30
JP2021077976 2021-04-30
PCT/JP2022/004902 WO2022230293A1 (ja) 2021-04-30 2022-02-08 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022230293A1 true JPWO2022230293A1 (https=) 2022-11-03
JP7846096B2 JP7846096B2 (ja) 2026-04-14

Family

ID=83848278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517066A Active JP7846096B2 (ja) 2021-04-30 2022-02-08 半導体装置

Country Status (4)

Country Link
US (1) US20240204093A1 (https=)
JP (1) JP7846096B2 (https=)
CN (1) CN117203776A (https=)
WO (1) WO2022230293A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025501019A (ja) * 2021-12-20 2025-01-15 モンデ ワイヤレス インコーポレイテッド Rf集積回路用半導体デバイス
CN118630046A (zh) * 2023-03-09 2024-09-10 苏州晶湛半导体有限公司 一种半导体结构及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134478A (ja) * 1982-02-04 1983-08-10 Sanyo Electric Co Ltd 化合物半導体fetの製造方法
JPS61260679A (ja) * 1985-05-15 1986-11-18 Fujitsu Ltd 電界効果トランジスタ
JPH03191534A (ja) * 1989-12-21 1991-08-21 Nec Corp 電界効果トランジスタおよびその製造方法
JPH05114615A (ja) * 1991-10-21 1993-05-07 Rohm Co Ltd 化合物半導体装置及びその製造方法
JPH05275453A (ja) * 1992-01-16 1993-10-22 Samsung Electron Co Ltd 接合fet及びその製造方法
JPH08111519A (ja) * 1994-08-19 1996-04-30 Fujitsu Ltd 半導体装置
JP2001093914A (ja) * 1999-09-20 2001-04-06 Toshiba Corp 半導体能動素子及び半導体集積回路
JP2013182993A (ja) * 2012-03-01 2013-09-12 Toshiba Corp 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176195A (ja) * 2010-02-25 2011-09-08 Toshiba Corp 窒化物半導体装置
JP6341679B2 (ja) * 2014-02-06 2018-06-13 ルネサスエレクトロニクス株式会社 半導体装置
TWI736600B (zh) * 2017-03-31 2021-08-21 聯穎光電股份有限公司 高電子遷移率電晶體

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134478A (ja) * 1982-02-04 1983-08-10 Sanyo Electric Co Ltd 化合物半導体fetの製造方法
JPS61260679A (ja) * 1985-05-15 1986-11-18 Fujitsu Ltd 電界効果トランジスタ
JPH03191534A (ja) * 1989-12-21 1991-08-21 Nec Corp 電界効果トランジスタおよびその製造方法
JPH05114615A (ja) * 1991-10-21 1993-05-07 Rohm Co Ltd 化合物半導体装置及びその製造方法
JPH05275453A (ja) * 1992-01-16 1993-10-22 Samsung Electron Co Ltd 接合fet及びその製造方法
JPH08111519A (ja) * 1994-08-19 1996-04-30 Fujitsu Ltd 半導体装置
JP2001093914A (ja) * 1999-09-20 2001-04-06 Toshiba Corp 半導体能動素子及び半導体集積回路
JP2013182993A (ja) * 2012-03-01 2013-09-12 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
US20240204093A1 (en) 2024-06-20
CN117203776A (zh) 2023-12-08
JP7846096B2 (ja) 2026-04-14
WO2022230293A1 (ja) 2022-11-03

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
CL2025003627A1 (es) Almacenamiento criogénico aislado al vacío a gran escala
BR112022024743A2 (https=)
JPWO2022230293A1 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260123

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260402

R150 Certificate of patent or registration of utility model

Ref document number: 7846096

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150