JPWO2022220191A1 - - Google Patents
Info
- Publication number
- JPWO2022220191A1 JPWO2022220191A1 JP2023514629A JP2023514629A JPWO2022220191A1 JP WO2022220191 A1 JPWO2022220191 A1 JP WO2022220191A1 JP 2023514629 A JP2023514629 A JP 2023514629A JP 2023514629 A JP2023514629 A JP 2023514629A JP WO2022220191 A1 JPWO2022220191 A1 JP WO2022220191A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021068280 | 2021-04-14 | ||
| JP2021068280 | 2021-04-14 | ||
| PCT/JP2022/017272 WO2022220191A1 (ja) | 2021-04-14 | 2022-04-07 | 基板の製造方法、電力用半導体装置の製造方法、および基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022220191A1 true JPWO2022220191A1 (https=) | 2022-10-20 |
| JPWO2022220191A5 JPWO2022220191A5 (https=) | 2023-08-10 |
| JP7520215B2 JP7520215B2 (ja) | 2024-07-22 |
Family
ID=83640037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023514629A Active JP7520215B2 (ja) | 2021-04-14 | 2022-04-07 | 基板の製造方法、電力用半導体装置の製造方法、および基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7520215B2 (https=) |
| WO (1) | WO2022220191A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214284A (ja) * | 2002-12-27 | 2004-07-29 | Dowa Mining Co Ltd | 金属−セラミックス接合基板およびその製造方法 |
| JP2006332084A (ja) * | 2005-05-23 | 2006-12-07 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法、および半導体装置 |
| JP2007273661A (ja) * | 2006-03-31 | 2007-10-18 | Neomax Material:Kk | 半導体装置 |
| JP2014187088A (ja) * | 2013-03-22 | 2014-10-02 | Toshiba Corp | パワー半導体装置の製造方法、パワー半導体装置 |
| WO2021048937A1 (ja) * | 2019-09-11 | 2021-03-18 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
-
2022
- 2022-04-07 JP JP2023514629A patent/JP7520215B2/ja active Active
- 2022-04-07 WO PCT/JP2022/017272 patent/WO2022220191A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214284A (ja) * | 2002-12-27 | 2004-07-29 | Dowa Mining Co Ltd | 金属−セラミックス接合基板およびその製造方法 |
| JP2006332084A (ja) * | 2005-05-23 | 2006-12-07 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法、および半導体装置 |
| JP2007273661A (ja) * | 2006-03-31 | 2007-10-18 | Neomax Material:Kk | 半導体装置 |
| JP2014187088A (ja) * | 2013-03-22 | 2014-10-02 | Toshiba Corp | パワー半導体装置の製造方法、パワー半導体装置 |
| WO2021048937A1 (ja) * | 2019-09-11 | 2021-03-18 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022220191A1 (ja) | 2022-10-20 |
| JP7520215B2 (ja) | 2024-07-22 |
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