JPWO2022215680A1 - - Google Patents
Info
- Publication number
- JPWO2022215680A1 JPWO2022215680A1 JP2023513012A JP2023513012A JPWO2022215680A1 JP WO2022215680 A1 JPWO2022215680 A1 JP WO2022215680A1 JP 2023513012 A JP2023513012 A JP 2023513012A JP 2023513012 A JP2023513012 A JP 2023513012A JP WO2022215680 A1 JPWO2022215680 A1 JP WO2022215680A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Treatment Of Fiber Materials (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025080664A JP2025114799A (ja) | 2021-04-06 | 2025-05-13 | プラズマ処理装置及び基板支持体 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021064704 | 2021-04-06 | ||
| JP2021064704 | 2021-04-06 | ||
| PCT/JP2022/017038 WO2022215680A1 (ja) | 2021-04-06 | 2022-04-04 | プラズマ処理装置及び電極機構 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025080664A Division JP2025114799A (ja) | 2021-04-06 | 2025-05-13 | プラズマ処理装置及び基板支持体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022215680A1 true JPWO2022215680A1 (https=) | 2022-10-13 |
| JP7682260B2 JP7682260B2 (ja) | 2025-05-23 |
Family
ID=83546097
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023513012A Active JP7682260B2 (ja) | 2021-04-06 | 2022-04-04 | プラズマ処理装置及び電極機構 |
| JP2025080664A Pending JP2025114799A (ja) | 2021-04-06 | 2025-05-13 | プラズマ処理装置及び基板支持体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025080664A Pending JP2025114799A (ja) | 2021-04-06 | 2025-05-13 | プラズマ処理装置及び基板支持体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230402263A1 (https=) |
| JP (2) | JP7682260B2 (https=) |
| KR (1) | KR20230164658A (https=) |
| TW (1) | TW202303648A (https=) |
| WO (1) | WO2022215680A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026042624A1 (ja) * | 2024-08-22 | 2026-02-26 | 東京エレクトロン株式会社 | プラズマ処理装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014229734A (ja) * | 2013-05-22 | 2014-12-08 | 東京エレクトロン株式会社 | エッチング方法及びエッチング装置 |
| JP2017028111A (ja) * | 2015-07-23 | 2017-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP2019140155A (ja) * | 2018-02-06 | 2019-08-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| WO2020055565A1 (en) * | 2018-09-14 | 2020-03-19 | Applied Materials, Inc. | Semiconductor substrate supports with embedded rf shield |
| JP2020068247A (ja) * | 2018-10-23 | 2020-04-30 | 東京エレクトロン株式会社 | シャワーヘッドおよび基板処理装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6218650B2 (ja) | 2014-03-11 | 2017-10-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2022
- 2022-04-04 JP JP2023513012A patent/JP7682260B2/ja active Active
- 2022-04-04 WO PCT/JP2022/017038 patent/WO2022215680A1/ja not_active Ceased
- 2022-04-04 KR KR1020237030767A patent/KR20230164658A/ko active Pending
- 2022-04-06 TW TW111112999A patent/TW202303648A/zh unknown
-
2023
- 2023-08-28 US US18/239,006 patent/US20230402263A1/en active Pending
-
2025
- 2025-05-13 JP JP2025080664A patent/JP2025114799A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014229734A (ja) * | 2013-05-22 | 2014-12-08 | 東京エレクトロン株式会社 | エッチング方法及びエッチング装置 |
| JP2017028111A (ja) * | 2015-07-23 | 2017-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP2019140155A (ja) * | 2018-02-06 | 2019-08-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| WO2020055565A1 (en) * | 2018-09-14 | 2020-03-19 | Applied Materials, Inc. | Semiconductor substrate supports with embedded rf shield |
| JP2020068247A (ja) * | 2018-10-23 | 2020-04-30 | 東京エレクトロン株式会社 | シャワーヘッドおよび基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202303648A (zh) | 2023-01-16 |
| US20230402263A1 (en) | 2023-12-14 |
| JP7682260B2 (ja) | 2025-05-23 |
| JP2025114799A (ja) | 2025-08-05 |
| WO2022215680A1 (ja) | 2022-10-13 |
| KR20230164658A (ko) | 2023-12-04 |
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