JPWO2022210785A1 - - Google Patents

Info

Publication number
JPWO2022210785A1
JPWO2022210785A1 JP2023511425A JP2023511425A JPWO2022210785A1 JP WO2022210785 A1 JPWO2022210785 A1 JP WO2022210785A1 JP 2023511425 A JP2023511425 A JP 2023511425A JP 2023511425 A JP2023511425 A JP 2023511425A JP WO2022210785 A1 JPWO2022210785 A1 JP WO2022210785A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023511425A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210785A1 publication Critical patent/JPWO2022210785A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023511425A 2021-03-31 2022-03-29 Pending JPWO2022210785A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021059446 2021-03-31
PCT/JP2022/015693 WO2022210785A1 (ja) 2021-03-31 2022-03-29 組成物、硬化体及び有機ｅｌ表示装置

Publications (1)

Publication Number Publication Date
JPWO2022210785A1 true JPWO2022210785A1 (zh) 2022-10-06

Family

ID=83459513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511425A Pending JPWO2022210785A1 (zh) 2021-03-31 2022-03-29

Country Status (5)

Country Link
JP (1) JPWO2022210785A1 (zh)
KR (1) KR20230095934A (zh)
CN (1) CN116249722A (zh)
TW (1) TW202248353A (zh)
WO (1) WO2022210785A1 (zh)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653647B2 (ja) * 1986-04-18 1994-07-20 而至歯科工業株式会社 歯科修復用組成物
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
JP5498156B2 (ja) * 2006-03-29 2014-05-21 ヘンケル・アーゲー・アンド・カンパニー・カーゲーアーアー 放射線−または熱−硬化性バリヤシーラント
JP2015124286A (ja) * 2013-12-26 2015-07-06 株式会社ダイセル 硬化性組成物
JP5872129B1 (ja) * 2014-05-02 2016-03-01 三井化学株式会社 シール材及びその硬化物
CN115336389A (zh) * 2020-04-01 2022-11-11 电化株式会社 密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法
WO2022085599A1 (ja) * 2020-10-20 2022-04-28 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法

Also Published As

Publication number Publication date
CN116249722A (zh) 2023-06-09
WO2022210785A1 (ja) 2022-10-06
KR20230095934A (ko) 2023-06-29
TW202248353A (zh) 2022-12-16

Similar Documents

Publication Publication Date Title
BR112023012656A2 (zh)
JPWO2021201013A1 (zh)
JPWO2022230748A1 (zh)
JPWO2022085599A1 (zh)
BR102021015500A2 (zh)
BR102021007058A2 (zh)
BR102020022030A2 (zh)
BR112023016292A2 (zh)
BR112023004146A2 (zh)
BR112023006729A2 (zh)
JPWO2022059740A1 (zh)
BR102021016176A2 (zh)
BR102021015566A2 (zh)
BR102021015450A8 (zh)
BR102021015247A2 (zh)
BR102021015220A2 (zh)
BR102021014044A2 (zh)
BR102021014056A2 (zh)
BR102021013929A2 (zh)
BR112021017747A2 (zh)
BR102021012571A2 (zh)
BR102021012230A2 (zh)
BR102021012003A2 (zh)
BR102021012107A2 (zh)
BR102021010467A2 (zh)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230616