JPWO2022210785A1 - - Google Patents

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Publication number
JPWO2022210785A1
JPWO2022210785A1 JP2023511425A JP2023511425A JPWO2022210785A1 JP WO2022210785 A1 JPWO2022210785 A1 JP WO2022210785A1 JP 2023511425 A JP2023511425 A JP 2023511425A JP 2023511425 A JP2023511425 A JP 2023511425A JP WO2022210785 A1 JPWO2022210785 A1 JP WO2022210785A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511425A
Other languages
Japanese (ja)
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JP7671842B2 (ja
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Publication date
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Publication of JPWO2022210785A1 publication Critical patent/JPWO2022210785A1/ja
Application granted granted Critical
Publication of JP7671842B2 publication Critical patent/JP7671842B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023511425A 2021-03-31 2022-03-29 組成物、硬化体及び有機el表示装置 Active JP7671842B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021059446 2021-03-31
JP2021059446 2021-03-31
PCT/JP2022/015693 WO2022210785A1 (ja) 2021-03-31 2022-03-29 組成物、硬化体及び有機el表示装置

Publications (2)

Publication Number Publication Date
JPWO2022210785A1 true JPWO2022210785A1 (enrdf_load_stackoverflow) 2022-10-06
JP7671842B2 JP7671842B2 (ja) 2025-05-02

Family

ID=83459513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511425A Active JP7671842B2 (ja) 2021-03-31 2022-03-29 組成物、硬化体及び有機el表示装置

Country Status (5)

Country Link
JP (1) JP7671842B2 (enrdf_load_stackoverflow)
KR (1) KR20230095934A (enrdf_load_stackoverflow)
CN (1) CN116249722A (enrdf_load_stackoverflow)
TW (1) TW202248353A (enrdf_load_stackoverflow)
WO (1) WO2022210785A1 (enrdf_load_stackoverflow)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62246514A (ja) * 1986-04-18 1987-10-27 G C Dental Ind Corp 歯科修復用組成物
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
JP2009531515A (ja) * 2006-03-29 2009-09-03 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 放射線−または熱−硬化性バリヤシーラント
JP2015124286A (ja) * 2013-12-26 2015-07-06 株式会社ダイセル 硬化性組成物
WO2015166657A1 (ja) * 2014-05-02 2015-11-05 三井化学株式会社 シール材及びその硬化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
CN103772649B (zh) * 2006-03-29 2018-09-21 汉高股份两合公司 辐射或热可固化的防渗密封胶
WO2015111525A1 (ja) * 2014-01-23 2015-07-30 株式会社ダイセル 封止用組成物
CN115336389A (zh) * 2020-04-01 2022-11-11 电化株式会社 密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法
KR20230090319A (ko) * 2020-10-20 2023-06-21 덴카 주식회사 밀봉제, 경화체, 유기 전계발광 표시장치 및 유기 전계발광 표시장치의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62246514A (ja) * 1986-04-18 1987-10-27 G C Dental Ind Corp 歯科修復用組成物
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
JP2009531515A (ja) * 2006-03-29 2009-09-03 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 放射線−または熱−硬化性バリヤシーラント
JP2015124286A (ja) * 2013-12-26 2015-07-06 株式会社ダイセル 硬化性組成物
WO2015166657A1 (ja) * 2014-05-02 2015-11-05 三井化学株式会社 シール材及びその硬化物

Also Published As

Publication number Publication date
JP7671842B2 (ja) 2025-05-02
WO2022210785A1 (ja) 2022-10-06
KR20230095934A (ko) 2023-06-29
TW202248353A (zh) 2022-12-16
CN116249722A (zh) 2023-06-09

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