JPWO2022210384A1 - - Google Patents

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Publication number
JPWO2022210384A1
JPWO2022210384A1 JP2022549881A JP2022549881A JPWO2022210384A1 JP WO2022210384 A1 JPWO2022210384 A1 JP WO2022210384A1 JP 2022549881 A JP2022549881 A JP 2022549881A JP 2022549881 A JP2022549881 A JP 2022549881A JP WO2022210384 A1 JPWO2022210384 A1 JP WO2022210384A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022549881A
Other versions
JPWO2022210384A5 (ja
JP7176669B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210384A1 publication Critical patent/JPWO2022210384A1/ja
Priority to JP2022179459A priority Critical patent/JP2023001288A/ja
Application granted granted Critical
Publication of JP7176669B1 publication Critical patent/JP7176669B1/ja
Publication of JPWO2022210384A5 publication Critical patent/JPWO2022210384A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022549881A 2021-03-31 2022-03-25 封止用樹脂組成物およびこれを用いた電子装置 Active JP7176669B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022179459A JP2023001288A (ja) 2021-03-31 2022-11-09 封止用樹脂組成物およびこれを用いた電子装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021060421 2021-03-31
JP2021060421 2021-03-31
PCT/JP2022/014525 WO2022210384A1 (ja) 2021-03-31 2022-03-25 封止用樹脂組成物およびこれを用いた電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022179459A Division JP2023001288A (ja) 2021-03-31 2022-11-09 封止用樹脂組成物およびこれを用いた電子装置

Publications (3)

Publication Number Publication Date
JPWO2022210384A1 true JPWO2022210384A1 (ja) 2022-10-06
JP7176669B1 JP7176669B1 (ja) 2022-11-22
JPWO2022210384A5 JPWO2022210384A5 (ja) 2023-03-01

Family

ID=83459133

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022549881A Active JP7176669B1 (ja) 2021-03-31 2022-03-25 封止用樹脂組成物およびこれを用いた電子装置
JP2022179459A Pending JP2023001288A (ja) 2021-03-31 2022-11-09 封止用樹脂組成物およびこれを用いた電子装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022179459A Pending JP2023001288A (ja) 2021-03-31 2022-11-09 封止用樹脂組成物およびこれを用いた電子装置

Country Status (5)

Country Link
EP (1) EP4317237A4 (ja)
JP (2) JP7176669B1 (ja)
KR (1) KR102669548B1 (ja)
CN (1) CN117222686B (ja)
WO (1) WO2022210384A1 (ja)

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61283615A (ja) * 1985-06-11 1986-12-13 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPH1060231A (ja) * 1996-08-26 1998-03-03 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JP4017478B2 (ja) * 2002-09-12 2007-12-05 京セラケミカル株式会社 電子部品装置
JP2005167035A (ja) 2003-12-03 2005-06-23 Kansai Electric Power Co Inc:The 炭化珪素半導体素子およびその製造方法
JP2006206827A (ja) * 2005-01-31 2006-08-10 Matsushita Electric Works Ltd 液状封止用エポキシ樹脂組成物及び半導体装置
US8048969B2 (en) * 2005-04-25 2011-11-01 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
TWI415911B (zh) * 2005-07-13 2013-11-21 Ube Industries 伸聯苯交聯酚醛清漆樹脂及其用途
US20070207322A1 (en) * 2006-03-01 2007-09-06 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP2008201905A (ja) * 2007-02-20 2008-09-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2010090216A (ja) * 2008-10-06 2010-04-22 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP5703547B2 (ja) * 2009-07-24 2015-04-22 住友ベークライト株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線および半導体装置
JP5630652B2 (ja) * 2011-01-06 2014-11-26 日立化成株式会社 封止用エポキシ樹脂成形材料および電子部品装置
JP5570449B2 (ja) * 2011-01-31 2014-08-13 新日鉄住金化学株式会社 エポキシ樹脂組成物及び硬化物
JP5573773B2 (ja) * 2011-05-23 2014-08-20 日立化成株式会社 電子部品封止用樹脂組成物およびそれを用いた電子部品装置
KR101526001B1 (ko) * 2011-12-26 2015-06-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
JP2014005383A (ja) * 2012-06-25 2014-01-16 Hokko Chem Ind Co Ltd エポキシ樹脂組成物、およびその硬化物
JP6149440B2 (ja) * 2013-03-13 2017-06-21 味の素株式会社 多層プリント配線板の製造方法およびそれに用いるキャリア金属箔付きプリプレグ含有複合材
JP6583278B2 (ja) * 2014-09-24 2019-10-02 住友ベークライト株式会社 半導体封止用樹脂組成物、半導体装置および構造体
JP6511840B2 (ja) * 2015-02-03 2019-05-15 日立化成株式会社 エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物及び電子部品装置
JP6834144B2 (ja) * 2016-02-29 2021-02-24 味の素株式会社 支持体付き樹脂シート
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
WO2018061925A1 (ja) 2016-09-30 2018-04-05 日本電気株式会社 情報処理装置、長さ測定システム、長さ測定方法およびプログラム記憶媒体
CN109111688B (zh) * 2017-06-26 2020-09-15 美的智慧家居科技有限公司 封装用塑料组合物及其应用
JP2019026715A (ja) * 2017-07-28 2019-02-21 住友ベークライト株式会社 一括封止用エポキシ樹脂組成物、電子装置およびその製造方法
US11617261B2 (en) * 2018-04-27 2023-03-28 Panasonic Intellectual Property Management Co., Ltd. Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board
US20210384573A1 (en) * 2018-11-01 2021-12-09 Sumitomo Bakelite Co., Ltd. Encapsulating resin composition for power device and power device

Also Published As

Publication number Publication date
JP7176669B1 (ja) 2022-11-22
KR20230156149A (ko) 2023-11-13
EP4317237A4 (en) 2024-08-21
JP2023001288A (ja) 2023-01-04
CN117222686B (zh) 2024-04-12
CN117222686A (zh) 2023-12-12
EP4317237A1 (en) 2024-02-07
WO2022210384A1 (ja) 2022-10-06
KR102669548B1 (ko) 2024-05-29

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