JPWO2022209064A1 - - Google Patents

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Publication number
JPWO2022209064A1
JPWO2022209064A1 JP2022520675A JP2022520675A JPWO2022209064A1 JP WO2022209064 A1 JPWO2022209064 A1 JP WO2022209064A1 JP 2022520675 A JP2022520675 A JP 2022520675A JP 2022520675 A JP2022520675 A JP 2022520675A JP WO2022209064 A1 JPWO2022209064 A1 JP WO2022209064A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022520675A
Other languages
Japanese (ja)
Other versions
JP7722985B2 (ja
JPWO2022209064A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2022209064A1 publication Critical patent/JPWO2022209064A1/ja
Publication of JPWO2022209064A5 publication Critical patent/JPWO2022209064A5/ja
Priority to JP2023086048A priority Critical patent/JP7766060B2/ja
Priority to JP2025038360A priority patent/JP2025078860A/ja
Application granted granted Critical
Publication of JP7722985B2 publication Critical patent/JP7722985B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Silicon Polymers (AREA)
JP2022520675A 2021-03-30 2021-12-21 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法 Active JP7722985B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023086048A JP7766060B2 (ja) 2021-03-30 2023-05-25 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
JP2025038360A JP2025078860A (ja) 2021-03-30 2025-03-11 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021056736 2021-03-30
JP2021056736 2021-03-30
PCT/JP2021/047322 WO2022209064A1 (ja) 2021-03-30 2021-12-21 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2023086048A Division JP7766060B2 (ja) 2021-03-30 2023-05-25 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
JP2025038360A Division JP2025078860A (ja) 2021-03-30 2025-03-11 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022209064A1 true JPWO2022209064A1 (https=) 2022-10-06
JPWO2022209064A5 JPWO2022209064A5 (https=) 2023-02-28
JP7722985B2 JP7722985B2 (ja) 2025-08-13

Family

ID=83455825

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022520675A Active JP7722985B2 (ja) 2021-03-30 2021-12-21 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
JP2023086048A Active JP7766060B2 (ja) 2021-03-30 2023-05-25 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
JP2025038360A Pending JP2025078860A (ja) 2021-03-30 2025-03-11 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023086048A Active JP7766060B2 (ja) 2021-03-30 2023-05-25 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
JP2025038360A Pending JP2025078860A (ja) 2021-03-30 2025-03-11 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Country Status (4)

Country Link
JP (3) JP7722985B2 (https=)
CN (1) CN116981751A (https=)
TW (1) TWI908960B (https=)
WO (1) WO2022209064A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026070861A1 (ja) * 2024-09-27 2026-04-02 リンテック株式会社 熱硬化性組成物
WO2026070860A1 (ja) * 2024-09-27 2026-04-02 リンテック株式会社 熱硬化性組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155482A1 (ja) * 2010-06-08 2011-12-15 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
WO2016031731A1 (ja) * 2014-08-26 2016-03-03 リンテック株式会社 硬化性組成物、硬化物、硬化性組成物の使用方法、及び光デバイス
JP2018100401A (ja) * 2016-12-20 2018-06-28 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ 接着剤組成物及びエレクトロニクスにおけるその使用
JP2020176212A (ja) * 2019-04-18 2020-10-29 リンテック株式会社 ダイボンド材、発光装置、及び、発光装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044330B2 (en) 2008-01-17 2011-10-25 E.I. Du Pont De Nemours And Company Electrically conductive adhesive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155482A1 (ja) * 2010-06-08 2011-12-15 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
WO2016031731A1 (ja) * 2014-08-26 2016-03-03 リンテック株式会社 硬化性組成物、硬化物、硬化性組成物の使用方法、及び光デバイス
JP2018100401A (ja) * 2016-12-20 2018-06-28 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ 接着剤組成物及びエレクトロニクスにおけるその使用
JP2020176212A (ja) * 2019-04-18 2020-10-29 リンテック株式会社 ダイボンド材、発光装置、及び、発光装置の製造方法

Also Published As

Publication number Publication date
JP7722985B2 (ja) 2025-08-13
TW202237790A (zh) 2022-10-01
JP2023105012A (ja) 2023-07-28
CN116981751A (zh) 2023-10-31
JP7766060B2 (ja) 2025-11-07
TWI908960B (zh) 2025-12-21
JP2025078860A (ja) 2025-05-20
WO2022209064A1 (ja) 2022-10-06

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