CN116981751A - 粘接糊料、粘接糊料的使用方法和半导体装置的制造方法 - Google Patents

粘接糊料、粘接糊料的使用方法和半导体装置的制造方法 Download PDF

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Publication number
CN116981751A
CN116981751A CN202180095979.3A CN202180095979A CN116981751A CN 116981751 A CN116981751 A CN 116981751A CN 202180095979 A CN202180095979 A CN 202180095979A CN 116981751 A CN116981751 A CN 116981751A
Authority
CN
China
Prior art keywords
adhesive paste
adhesive
semiconductor element
component
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180095979.3A
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English (en)
Chinese (zh)
Inventor
宫胁学
三浦迪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN116981751A publication Critical patent/CN116981751A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Silicon Polymers (AREA)
CN202180095979.3A 2021-03-30 2021-12-21 粘接糊料、粘接糊料的使用方法和半导体装置的制造方法 Pending CN116981751A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-056736 2021-03-30
JP2021056736 2021-03-30
PCT/JP2021/047322 WO2022209064A1 (ja) 2021-03-30 2021-12-21 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN116981751A true CN116981751A (zh) 2023-10-31

Family

ID=83455825

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180095979.3A Pending CN116981751A (zh) 2021-03-30 2021-12-21 粘接糊料、粘接糊料的使用方法和半导体装置的制造方法

Country Status (4)

Country Link
JP (3) JP7722985B2 (https=)
CN (1) CN116981751A (https=)
TW (1) TWI908960B (https=)
WO (1) WO2022209064A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026070861A1 (ja) * 2024-09-27 2026-04-02 リンテック株式会社 熱硬化性組成物
WO2026070860A1 (ja) * 2024-09-27 2026-04-02 リンテック株式会社 熱硬化性組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044330B2 (en) 2008-01-17 2011-10-25 E.I. Du Pont De Nemours And Company Electrically conductive adhesive
JP4911806B2 (ja) * 2010-06-08 2012-04-04 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
TWI696662B (zh) * 2014-08-26 2020-06-21 日商琳得科股份有限公司 硬化性組合物、硬化物、硬化性組合物之使用方法以及光裝置
FR3060601B1 (fr) * 2016-12-20 2018-12-07 Commissariat A L'energie Atomique Et Aux Energies Alternatives Composition adhesive et son utilisation dans l'electronique
JP7246238B2 (ja) * 2019-04-18 2023-03-27 リンテック株式会社 ダイボンド材、発光装置、及び、発光装置の製造方法

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Publication number Publication date
JP7722985B2 (ja) 2025-08-13
TW202237790A (zh) 2022-10-01
JP2023105012A (ja) 2023-07-28
JP7766060B2 (ja) 2025-11-07
TWI908960B (zh) 2025-12-21
JP2025078860A (ja) 2025-05-20
WO2022209064A1 (ja) 2022-10-06
JPWO2022209064A1 (https=) 2022-10-06

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