JPWO2022201882A1 - - Google Patents

Info

Publication number
JPWO2022201882A1
JPWO2022201882A1 JP2023508738A JP2023508738A JPWO2022201882A1 JP WO2022201882 A1 JPWO2022201882 A1 JP WO2022201882A1 JP 2023508738 A JP2023508738 A JP 2023508738A JP 2023508738 A JP2023508738 A JP 2023508738A JP WO2022201882 A1 JPWO2022201882 A1 JP WO2022201882A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023508738A
Other languages
Japanese (ja)
Other versions
JPWO2022201882A5 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022201882A1 publication Critical patent/JPWO2022201882A1/ja
Publication of JPWO2022201882A5 publication Critical patent/JPWO2022201882A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/53—Constructional details of electronic viewfinders, e.g. rotatable or detachable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Studio Devices (AREA)
JP2023508738A 2021-03-25 2022-02-01 Pending JPWO2022201882A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021051661 2021-03-25
PCT/JP2022/003878 WO2022201882A1 (ja) 2021-03-25 2022-02-01 冷却装置、および電子機器システム

Publications (2)

Publication Number Publication Date
JPWO2022201882A1 true JPWO2022201882A1 (cg-RX-API-DMAC7.html) 2022-09-29
JPWO2022201882A5 JPWO2022201882A5 (cg-RX-API-DMAC7.html) 2023-12-21

Family

ID=83396816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508738A Pending JPWO2022201882A1 (cg-RX-API-DMAC7.html) 2021-03-25 2022-02-01

Country Status (3)

Country Link
US (2) US12619132B2 (cg-RX-API-DMAC7.html)
JP (1) JPWO2022201882A1 (cg-RX-API-DMAC7.html)
WO (1) WO2022201882A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022021539A (ja) * 2020-07-22 2022-02-03 キヤノン株式会社 電子機器および電子機器システム
JP7657645B2 (ja) * 2021-04-16 2025-04-07 キヤノン株式会社 電子機器
TWI916213B (zh) 2025-03-11 2026-02-21 神準科技股份有限公司 降溫模組

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422417U (cg-RX-API-DMAC7.html) * 1977-07-15 1979-02-14
JP2007180706A (ja) * 2005-12-27 2007-07-12 Sony Corp 撮像装置
JP2008277355A (ja) * 2007-04-25 2008-11-13 Toshiba Corp 冷却装置および電子機器
JP2012173591A (ja) * 2011-02-23 2012-09-10 Nikon Corp 電子機器
JP2017169357A (ja) * 2016-03-16 2017-09-21 京セラ株式会社 電力変換装置
CN210605624U (zh) * 2019-11-26 2020-05-22 叶映溪 一种成果信息交互设备
JP2020096145A (ja) * 2018-12-14 2020-06-18 新電元工業株式会社 電子機器装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422417A (en) 1977-07-20 1979-02-20 Sumitomo Electric Industries Ceramic sintered body and method of making same
JP3108585B2 (ja) 1993-07-28 2000-11-13 日本電信電話株式会社 ビデオ画像プリントアクセス方法およびシステム
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
WO2008044485A1 (fr) * 2006-10-06 2008-04-17 Kabushiki Kaisha Yaskawa Denki Structure de montage pour module d'alimentation et dispositif de contrôle du moteur la comportant
CN101212880B (zh) * 2006-12-29 2010-04-14 富准精密工业(深圳)有限公司 散热装置
US9432561B2 (en) * 2013-08-13 2016-08-30 Gopro, Inc. Camera heat sink
TWI573522B (zh) * 2015-03-02 2017-03-01 泰碩電子股份有限公司 Temperature plate cooling module
JP6400635B2 (ja) * 2016-06-30 2018-10-03 ファナック株式会社 電子機器用冷却構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422417U (cg-RX-API-DMAC7.html) * 1977-07-15 1979-02-14
JP2007180706A (ja) * 2005-12-27 2007-07-12 Sony Corp 撮像装置
JP2008277355A (ja) * 2007-04-25 2008-11-13 Toshiba Corp 冷却装置および電子機器
JP2012173591A (ja) * 2011-02-23 2012-09-10 Nikon Corp 電子機器
JP2017169357A (ja) * 2016-03-16 2017-09-21 京セラ株式会社 電力変換装置
JP2020096145A (ja) * 2018-12-14 2020-06-18 新電元工業株式会社 電子機器装置
CN210605624U (zh) * 2019-11-26 2020-05-22 叶映溪 一种成果信息交互设备

Also Published As

Publication number Publication date
WO2022201882A1 (ja) 2022-09-29
US12619132B2 (en) 2026-05-05
US20260227680A1 (en) 2026-08-06
US20230418136A1 (en) 2023-12-28

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