JPWO2022176588A1 - - Google Patents
Info
- Publication number
- JPWO2022176588A1 JPWO2022176588A1 JP2023500692A JP2023500692A JPWO2022176588A1 JP WO2022176588 A1 JPWO2022176588 A1 JP WO2022176588A1 JP 2023500692 A JP2023500692 A JP 2023500692A JP 2023500692 A JP2023500692 A JP 2023500692A JP WO2022176588 A1 JPWO2022176588 A1 JP WO2022176588A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
- G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021023571 | 2021-02-17 | ||
| JP2021023571 | 2021-02-17 | ||
| PCT/JP2022/003600 WO2022176588A1 (ja) | 2021-02-17 | 2022-01-31 | 荷重センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022176588A1 true JPWO2022176588A1 (https=) | 2022-08-25 |
| JPWO2022176588A5 JPWO2022176588A5 (https=) | 2024-11-15 |
| JP7706093B2 JP7706093B2 (ja) | 2025-07-11 |
Family
ID=82931997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023500692A Active JP7706093B2 (ja) | 2021-02-17 | 2022-01-31 | 荷重センサ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12422315B2 (https=) |
| JP (1) | JP7706093B2 (https=) |
| CN (1) | CN116917706A (https=) |
| WO (1) | WO2022176588A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022250939A1 (en) * | 2021-05-27 | 2022-12-01 | The University Of Chicago | Strain-insensitive soft pressure sensor and method of measuring pressure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005003531A (ja) * | 2003-06-12 | 2005-01-06 | Nitta Ind Corp | 静電容量型センサ |
| US20060016275A1 (en) * | 2002-12-12 | 2006-01-26 | Danfoss A/S | Tactile sensor element and sensor array |
| US20130047747A1 (en) * | 2011-08-25 | 2013-02-28 | Samsung Electro-Mechanics Co., Ltd. | Capacitive pressure sensor and input device including the same |
| JP2015187561A (ja) * | 2014-03-26 | 2015-10-29 | 株式会社日本自動車部品総合研究所 | 圧力センサ |
| WO2018096901A1 (ja) * | 2016-11-25 | 2018-05-31 | パナソニックIpマネジメント株式会社 | 感圧素子および操舵装置 |
| US20210041310A1 (en) * | 2018-03-01 | 2021-02-11 | Universitat Basel Vizerektorat Forschung | Dielectric elastomer transducer and corresponding fabrication process |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8815246U1 (de) * | 1988-12-07 | 1990-04-05 | Brunner, Wolfgang, Dipl.-Ing. (FH), 88167 Maierhöfen | Meßanordnung, vorzugsweise in Form einer Meßplattform |
| JP4429478B2 (ja) | 2000-05-19 | 2010-03-10 | ニッタ株式会社 | 力検出装置 |
| JP2005233877A (ja) * | 2004-02-23 | 2005-09-02 | Alps Electric Co Ltd | 圧力センサ |
| JP5821328B2 (ja) * | 2010-07-26 | 2015-11-24 | セイコーエプソン株式会社 | 電子機器装置、ロボットハンド及びロボット |
| JP2012108021A (ja) * | 2010-11-18 | 2012-06-07 | Seiko Epson Corp | 検出装置、電子機器及びロボット |
| EP2824549B1 (en) * | 2012-03-09 | 2019-08-07 | Sony Corporation | Sensor device, input device, and electronic apparatus |
| DE102014201434B4 (de) * | 2014-01-27 | 2016-10-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Volumenkompressible kapazitive flächige flexible Sensormatte zur Messung von Druck oder Druckverteilungen und/oder zur Messung oder Detektion von Deformationen |
| CN105716748B (zh) * | 2014-12-22 | 2020-08-21 | 松下知识产权经营株式会社 | 感压元件 |
| JP6643647B2 (ja) * | 2015-03-19 | 2020-02-12 | パナソニックIpマネジメント株式会社 | 感圧素子 |
| WO2018144772A1 (en) * | 2017-02-03 | 2018-08-09 | The Regents Of The University Of California | Enhanced pressure sensing performance for pressure sensors |
| CN110446912B (zh) * | 2017-03-23 | 2021-07-20 | 松下知识产权经营株式会社 | 触觉传感器以及构成该触觉传感器的触觉传感器单元 |
| CN207976237U (zh) * | 2018-04-10 | 2018-10-16 | 太原工业学院 | 基于锯齿结构的柔性压力传感器 |
| WO2020003688A1 (ja) * | 2018-06-28 | 2020-01-02 | 株式会社ワコム | 圧力検出素子 |
-
2022
- 2022-01-31 JP JP2023500692A patent/JP7706093B2/ja active Active
- 2022-01-31 WO PCT/JP2022/003600 patent/WO2022176588A1/ja not_active Ceased
- 2022-01-31 CN CN202280015411.0A patent/CN116917706A/zh active Pending
-
2023
- 2023-08-14 US US18/233,638 patent/US12422315B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060016275A1 (en) * | 2002-12-12 | 2006-01-26 | Danfoss A/S | Tactile sensor element and sensor array |
| JP2005003531A (ja) * | 2003-06-12 | 2005-01-06 | Nitta Ind Corp | 静電容量型センサ |
| US20130047747A1 (en) * | 2011-08-25 | 2013-02-28 | Samsung Electro-Mechanics Co., Ltd. | Capacitive pressure sensor and input device including the same |
| JP2015187561A (ja) * | 2014-03-26 | 2015-10-29 | 株式会社日本自動車部品総合研究所 | 圧力センサ |
| WO2018096901A1 (ja) * | 2016-11-25 | 2018-05-31 | パナソニックIpマネジメント株式会社 | 感圧素子および操舵装置 |
| US20210041310A1 (en) * | 2018-03-01 | 2021-02-11 | Universitat Basel Vizerektorat Forschung | Dielectric elastomer transducer and corresponding fabrication process |
Also Published As
| Publication number | Publication date |
|---|---|
| US12422315B2 (en) | 2025-09-23 |
| CN116917706A (zh) | 2023-10-20 |
| WO2022176588A1 (ja) | 2022-08-25 |
| JP7706093B2 (ja) | 2025-07-11 |
| US20230384174A1 (en) | 2023-11-30 |
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