JPWO2022149257A1 - - Google Patents

Info

Publication number
JPWO2022149257A1
JPWO2022149257A1 JP2022516184A JP2022516184A JPWO2022149257A1 JP WO2022149257 A1 JPWO2022149257 A1 JP WO2022149257A1 JP 2022516184 A JP2022516184 A JP 2022516184A JP 2022516184 A JP2022516184 A JP 2022516184A JP WO2022149257 A1 JPWO2022149257 A1 JP WO2022149257A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022516184A
Other versions
JP7097522B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2022102564A priority Critical patent/JP7373615B2/ja
Application granted granted Critical
Publication of JP7097522B1 publication Critical patent/JP7097522B1/ja
Publication of JPWO2022149257A1 publication Critical patent/JPWO2022149257A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2022516184A 2021-01-08 2021-01-08 基板ホルダ、めっき装置、めっき方法、及び記憶媒体 Active JP7097522B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022102564A JP7373615B2 (ja) 2021-01-08 2022-06-27 基板ホルダ、めっき装置、めっき方法、及び記憶媒体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/000460 WO2022149257A1 (ja) 2021-01-08 2021-01-08 基板ホルダ、めっき装置、めっき方法、及び記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022102564A Division JP7373615B2 (ja) 2021-01-08 2022-06-27 基板ホルダ、めっき装置、めっき方法、及び記憶媒体

Publications (2)

Publication Number Publication Date
JP7097522B1 JP7097522B1 (ja) 2022-07-07
JPWO2022149257A1 true JPWO2022149257A1 (ja) 2022-07-14

Family

ID=82320470

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022516184A Active JP7097522B1 (ja) 2021-01-08 2021-01-08 基板ホルダ、めっき装置、めっき方法、及び記憶媒体
JP2022102564A Active JP7373615B2 (ja) 2021-01-08 2022-06-27 基板ホルダ、めっき装置、めっき方法、及び記憶媒体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022102564A Active JP7373615B2 (ja) 2021-01-08 2022-06-27 基板ホルダ、めっき装置、めっき方法、及び記憶媒体

Country Status (5)

Country Link
US (1) US20240035190A1 (ja)
JP (2) JP7097522B1 (ja)
KR (1) KR20230027215A (ja)
CN (1) CN115997049A (ja)
WO (1) WO2022149257A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240035190A1 (en) * 2021-01-08 2024-02-01 Ebara Corporation Substrate holder, apparatus for plating, method of plating and storage medium

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3112700B2 (ja) * 1991-05-08 2000-11-27 啓一郎 菅沼 半導体製造方法並びにその装置
JP3909786B2 (ja) 1998-06-26 2007-04-25 株式会社エフオーアイ 電解鍍金装置およびその接触子
JP3642748B2 (ja) 2001-07-10 2005-04-27 株式会社荏原製作所 めっき装置
JP3778281B2 (ja) * 2002-03-26 2006-05-24 株式会社荏原製作所 基板ホルダ及びめっき装置
US7727366B2 (en) 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
JP6596372B2 (ja) * 2016-03-22 2019-10-23 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6893142B2 (ja) * 2017-07-25 2021-06-23 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7059172B2 (ja) 2018-12-21 2022-04-25 株式会社荏原製作所 基板ホルダのシールから液体を除去するための方法
JP7132136B2 (ja) 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132134B2 (ja) 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132135B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
US20240035190A1 (en) 2021-01-08 2024-02-01 Ebara Corporation Substrate holder, apparatus for plating, method of plating and storage medium

Also Published As

Publication number Publication date
WO2022149257A1 (ja) 2022-07-14
JP2022118256A (ja) 2022-08-12
JP7373615B2 (ja) 2023-11-02
CN115997049A (zh) 2023-04-21
KR20230027215A (ko) 2023-02-27
US20240035190A1 (en) 2024-02-01
JP7097522B1 (ja) 2022-07-07

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