JPWO2022138847A1 - - Google Patents

Info

Publication number
JPWO2022138847A1
JPWO2022138847A1 JP2022571634A JP2022571634A JPWO2022138847A1 JP WO2022138847 A1 JPWO2022138847 A1 JP WO2022138847A1 JP 2022571634 A JP2022571634 A JP 2022571634A JP 2022571634 A JP2022571634 A JP 2022571634A JP WO2022138847 A1 JPWO2022138847 A1 JP WO2022138847A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022571634A
Other versions
JP7376733B2 (ja
JPWO2022138847A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138847A1 publication Critical patent/JPWO2022138847A1/ja
Publication of JPWO2022138847A5 publication Critical patent/JPWO2022138847A5/ja
Priority to JP2023184014A priority Critical patent/JP2024010115A/ja
Application granted granted Critical
Publication of JP7376733B2 publication Critical patent/JP7376733B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2205/00—Details of machines or methods for cleaning by the use of gas or air flow

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Epidemiology (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2022571634A 2020-12-25 2021-12-23 メンテナンス装置、真空処理システム及びメンテナンス方法 Active JP7376733B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023184014A JP2024010115A (ja) 2020-12-25 2023-10-26 メンテナンス装置、真空処理システム及びメンテナンス方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020217058 2020-12-25
JP2020217058 2020-12-25
PCT/JP2021/047965 WO2022138847A1 (ja) 2020-12-25 2021-12-23 メンテナンス装置、真空処理システム及びメンテナンス方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023184014A Division JP2024010115A (ja) 2020-12-25 2023-10-26 メンテナンス装置、真空処理システム及びメンテナンス方法

Publications (3)

Publication Number Publication Date
JPWO2022138847A1 true JPWO2022138847A1 (ja) 2022-06-30
JPWO2022138847A5 JPWO2022138847A5 (ja) 2023-07-19
JP7376733B2 JP7376733B2 (ja) 2023-11-08

Family

ID=82158751

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022571634A Active JP7376733B2 (ja) 2020-12-25 2021-12-23 メンテナンス装置、真空処理システム及びメンテナンス方法
JP2023184014A Pending JP2024010115A (ja) 2020-12-25 2023-10-26 メンテナンス装置、真空処理システム及びメンテナンス方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023184014A Pending JP2024010115A (ja) 2020-12-25 2023-10-26 メンテナンス装置、真空処理システム及びメンテナンス方法

Country Status (6)

Country Link
US (1) US20230330715A1 (ja)
JP (2) JP7376733B2 (ja)
KR (1) KR102648955B1 (ja)
CN (1) CN116711051A (ja)
TW (1) TW202234511A (ja)
WO (1) WO2022138847A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7499142B2 (ja) * 2020-10-23 2024-06-13 東京エレクトロン株式会社 処理システム及び処理方法
WO2024071073A1 (ja) * 2022-09-30 2024-04-04 東京エレクトロン株式会社 基板処理システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044177A (ja) * 1999-07-29 2001-02-16 Nec Corp 半導体製造装置およびドライエッチング時の異物検査・除去方法
JP2008053661A (ja) * 2006-08-28 2008-03-06 Tokyo Electron Ltd 洗浄装置及び洗浄方法
JP2010165726A (ja) * 2009-01-13 2010-07-29 Elpida Memory Inc 真空処理装置、及び、該真空処理装置における静電チャックのクリーニング方法
JP2017163088A (ja) * 2016-03-11 2017-09-14 東芝メモリ株式会社 基板処理装置及び基板処理装置の制御方法
JP2018133464A (ja) * 2017-02-16 2018-08-23 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
US20200013657A1 (en) * 2018-07-04 2020-01-09 Samsung Electronics Co., Ltd. Apparatus and methods for edge ring replacement, inspection and alignment using image sensors

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4320924B2 (ja) * 1999-06-15 2009-08-26 東京エレクトロン株式会社 パーティクル計測装置及び処理装置
US7515264B2 (en) * 1999-06-15 2009-04-07 Tokyo Electron Limited Particle-measuring system and particle-measuring method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044177A (ja) * 1999-07-29 2001-02-16 Nec Corp 半導体製造装置およびドライエッチング時の異物検査・除去方法
JP2008053661A (ja) * 2006-08-28 2008-03-06 Tokyo Electron Ltd 洗浄装置及び洗浄方法
JP2010165726A (ja) * 2009-01-13 2010-07-29 Elpida Memory Inc 真空処理装置、及び、該真空処理装置における静電チャックのクリーニング方法
JP2017163088A (ja) * 2016-03-11 2017-09-14 東芝メモリ株式会社 基板処理装置及び基板処理装置の制御方法
JP2018133464A (ja) * 2017-02-16 2018-08-23 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
US20200013657A1 (en) * 2018-07-04 2020-01-09 Samsung Electronics Co., Ltd. Apparatus and methods for edge ring replacement, inspection and alignment using image sensors

Also Published As

Publication number Publication date
JP2024010115A (ja) 2024-01-23
KR102648955B1 (ko) 2024-03-18
US20230330715A1 (en) 2023-10-19
JP7376733B2 (ja) 2023-11-08
KR20230118995A (ko) 2023-08-14
TW202234511A (zh) 2022-09-01
WO2022138847A1 (ja) 2022-06-30
CN116711051A (zh) 2023-09-05

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