JPWO2022138662A1 - - Google Patents

Info

Publication number
JPWO2022138662A1
JPWO2022138662A1 JP2022571515A JP2022571515A JPWO2022138662A1 JP WO2022138662 A1 JPWO2022138662 A1 JP WO2022138662A1 JP 2022571515 A JP2022571515 A JP 2022571515A JP 2022571515 A JP2022571515 A JP 2022571515A JP WO2022138662 A1 JPWO2022138662 A1 JP WO2022138662A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022571515A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138662A1 publication Critical patent/JPWO2022138662A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2022571515A 2020-12-23 2021-12-21 Pending JPWO2022138662A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020213106 2020-12-23
PCT/JP2021/047386 WO2022138662A1 (ja) 2020-12-23 2021-12-21 クランプ用治具、クランプ用治具の製造方法および洗浄装置

Publications (1)

Publication Number Publication Date
JPWO2022138662A1 true JPWO2022138662A1 (zh) 2022-06-30

Family

ID=82156958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022571515A Pending JPWO2022138662A1 (zh) 2020-12-23 2021-12-21

Country Status (4)

Country Link
JP (1) JPWO2022138662A1 (zh)
CN (1) CN116583935A (zh)
TW (1) TWI814188B (zh)
WO (1) WO2022138662A1 (zh)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092343A (ja) * 2001-09-17 2003-03-28 Dainippon Screen Mfg Co Ltd 基板保持機構、ならびにそれを用いた基板処理装置および基板処理方法
JP4565433B2 (ja) * 2001-11-27 2010-10-20 東京エレクトロン株式会社 液処理装置および液処理方法
JP2005285798A (ja) * 2004-03-26 2005-10-13 Dainippon Screen Mfg Co Ltd 基板保持機構、ならびにそれを用いた基板処理装置および基板処理方法
JP2007109732A (ja) * 2005-10-11 2007-04-26 Mitsubishi Electric Corp 素子基板の製造方法及び基板保持装置
JP6255650B2 (ja) * 2013-05-13 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US20200161167A1 (en) * 2017-07-28 2020-05-21 Kyocera Corporation Substrate holding member and semiconductor manufacturing device
JP7324043B2 (ja) * 2019-05-09 2023-08-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN114223053A (zh) * 2019-08-08 2022-03-22 京瓷株式会社 夹紧用夹具以及清洗装置

Also Published As

Publication number Publication date
TW202232655A (zh) 2022-08-16
TWI814188B (zh) 2023-09-01
CN116583935A (zh) 2023-08-11
WO2022138662A1 (ja) 2022-06-30

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230612