JPWO2022118971A1 - - Google Patents
Info
- Publication number
- JPWO2022118971A1 JPWO2022118971A1 JP2022567012A JP2022567012A JPWO2022118971A1 JP WO2022118971 A1 JPWO2022118971 A1 JP WO2022118971A1 JP 2022567012 A JP2022567012 A JP 2022567012A JP 2022567012 A JP2022567012 A JP 2022567012A JP WO2022118971 A1 JPWO2022118971 A1 JP WO2022118971A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/019—Manufacture or treatment using temporary auxiliary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
- H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2020/045336 | 2020-12-04 | ||
| JP2020045336 | 2020-12-04 | ||
| PCT/JP2021/044561 WO2022118971A1 (ja) | 2020-12-04 | 2021-12-03 | 半導体装置を製造する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022118971A1 true JPWO2022118971A1 (https=) | 2022-06-09 |
| JP7845191B2 JP7845191B2 (ja) | 2026-04-14 |
Family
ID=81853336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022567012A Active JP7845191B2 (ja) | 2020-12-04 | 2021-12-03 | 半導体装置を製造する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240006192A1 (https=) |
| JP (1) | JP7845191B2 (https=) |
| KR (1) | KR20230113759A (https=) |
| CN (1) | CN116547800A (https=) |
| WO (1) | WO2022118971A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11996384B2 (en) | 2020-12-15 | 2024-05-28 | Pulseforge, Inc. | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications |
| CN116888714A (zh) * | 2021-02-01 | 2023-10-13 | 长濑化成株式会社 | 电子部件安装基板的密封方法及热固化性片材 |
| WO2025061255A1 (de) * | 2023-09-18 | 2025-03-27 | Erich Thallner | Substratstapel, modifiziertes schichtsystem, verfahren zum handhaben des substratstapels und vorrichtung für ein solches verfahren |
| CN121816100A (zh) * | 2026-03-11 | 2026-04-07 | 北京升宇科技有限公司 | 微型高可靠封装结构及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029585A (ja) * | 2009-07-23 | 2011-02-10 | Samsung Electro-Mechanics Co Ltd | 半導体パッケージ及びこれの製造方法 |
| JP2016048729A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社東芝 | 仮接着用支持基板及び半導体デバイスの製造方法 |
| JP2018009138A (ja) * | 2016-07-05 | 2018-01-18 | 日立化成株式会社 | 仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3853247B2 (ja) | 2002-04-16 | 2006-12-06 | 日東電工株式会社 | 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品 |
| JP2006222164A (ja) * | 2005-02-08 | 2006-08-24 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2013074184A (ja) * | 2011-09-28 | 2013-04-22 | Nitto Denko Corp | 半導体装置の製造方法 |
| JP2016139754A (ja) * | 2015-01-29 | 2016-08-04 | 日立化成株式会社 | 半導体装置の製造方法 |
| JP7221046B2 (ja) * | 2018-12-26 | 2023-02-13 | 東京応化工業株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法 |
-
2021
- 2021-12-03 CN CN202180081462.9A patent/CN116547800A/zh active Pending
- 2021-12-03 JP JP2022567012A patent/JP7845191B2/ja active Active
- 2021-12-03 WO PCT/JP2021/044561 patent/WO2022118971A1/ja not_active Ceased
- 2021-12-03 KR KR1020237019189A patent/KR20230113759A/ko active Pending
- 2021-12-03 US US18/255,367 patent/US20240006192A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029585A (ja) * | 2009-07-23 | 2011-02-10 | Samsung Electro-Mechanics Co Ltd | 半導体パッケージ及びこれの製造方法 |
| JP2016048729A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社東芝 | 仮接着用支持基板及び半導体デバイスの製造方法 |
| JP2018009138A (ja) * | 2016-07-05 | 2018-01-18 | 日立化成株式会社 | 仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230113759A (ko) | 2023-08-01 |
| TW202230613A (zh) | 2022-08-01 |
| JP7845191B2 (ja) | 2026-04-14 |
| CN116547800A (zh) | 2023-08-04 |
| WO2022118971A1 (ja) | 2022-06-09 |
| US20240006192A1 (en) | 2024-01-04 |
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