JPWO2022114136A1 - - Google Patents

Info

Publication number
JPWO2022114136A1
JPWO2022114136A1 JP2022565455A JP2022565455A JPWO2022114136A1 JP WO2022114136 A1 JPWO2022114136 A1 JP WO2022114136A1 JP 2022565455 A JP2022565455 A JP 2022565455A JP 2022565455 A JP2022565455 A JP 2022565455A JP WO2022114136 A1 JPWO2022114136 A1 JP WO2022114136A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022565455A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022114136A1 publication Critical patent/JPWO2022114136A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022565455A 2020-11-27 2021-11-26 Pending JPWO2022114136A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020197001 2020-11-27
PCT/JP2021/043417 WO2022114136A1 (ja) 2020-11-27 2021-11-26 ポリイミド前駆体組成物、ポリイミドフィルム、およびポリイミドフィルム／基材積層体

Publications (1)

Publication Number Publication Date
JPWO2022114136A1 true JPWO2022114136A1 (ko) 2022-06-02

Family

ID=81755659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565455A Pending JPWO2022114136A1 (ko) 2020-11-27 2021-11-26

Country Status (5)

Country Link
JP (1) JPWO2022114136A1 (ko)
KR (1) KR20230106702A (ko)
CN (1) CN116457211A (ko)
TW (1) TW202227535A (ko)
WO (1) WO2022114136A1 (ko)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04334088A (ja) * 1991-05-09 1992-11-20 Sumitomo Bakelite Co Ltd フレキシブル印刷回路板の製造方法
JPH05295115A (ja) * 1992-04-24 1993-11-09 Sumitomo Bakelite Co Ltd 低熱膨張性ポリイミド樹脂およびその製造方法
JP3167421B2 (ja) * 1992-06-12 2001-05-21 住友ベークライト株式会社 ポリアミック酸フィルム
JP2001144119A (ja) * 1999-11-10 2001-05-25 Sumitomo Bakelite Co Ltd 半導体装置の製造方法
JP4371234B2 (ja) * 2005-03-03 2009-11-25 信越化学工業株式会社 フレキシブル金属箔ポリイミド積層板
JP2010202729A (ja) 2009-03-02 2010-09-16 Hitachi Chemical Dupont Microsystems Ltd フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
KR102361736B1 (ko) 2010-07-22 2022-02-14 우베 고산 가부시키가이샤 폴리이미드 전구체, 폴리이미드 및 그 제조에 사용되는 재료
CN104508009B (zh) * 2012-05-28 2016-09-07 宇部兴产株式会社 聚酰亚胺前体和聚酰亚胺
US20150284513A1 (en) * 2012-09-10 2015-10-08 Ube Industries, Ltd. Polyimide precursor, polyimide, varnish, polyimide film, and substrate
WO2014046064A1 (ja) * 2012-09-18 2014-03-27 宇部興産株式会社 ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
WO2014067079A1 (zh) 2012-10-30 2014-05-08 Sun Lingfeng 搅拌刀
KR102190722B1 (ko) * 2013-06-27 2020-12-14 우베 고산 가부시키가이샤 폴리이미드 전구체, 및 폴리이미드
JPWO2015053312A1 (ja) * 2013-10-11 2017-03-09 宇部興産株式会社 ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
WO2015080158A1 (ja) * 2013-11-27 2015-06-04 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
WO2015080139A1 (ja) * 2013-11-27 2015-06-04 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6413434B2 (ja) * 2014-07-25 2018-10-31 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法
JP2017160360A (ja) * 2016-03-10 2017-09-14 Ｊｘｔｇエネルギー株式会社 レーザ剥離用樹脂フィルム、レーザ剥離用ワニス組成物、レーザ剥離用積層体及びレーザ剥離方法
JP6754607B2 (ja) * 2016-04-27 2020-09-16 株式会社カネカ アルコキシシラン変性ポリイミド前駆体溶液、積層体およびフレキシブルデバイスの製造方法
WO2018143314A1 (ja) * 2017-02-03 2018-08-09 東京応化工業株式会社 ポリイミド前駆体組成物
JP7039214B2 (ja) * 2017-02-03 2022-03-22 東京応化工業株式会社 ポリイミド前駆体組成物
US20200133048A1 (en) 2017-05-31 2020-04-30 Ube Industries, Ltd. Polyimide film
JP7203082B2 (ja) * 2018-02-21 2023-01-12 Ｅｎｅｏｓ株式会社 ポリイミド前駆体樹脂組成物
JP7222626B2 (ja) * 2018-07-30 2023-02-15 東京応化工業株式会社 組成物、硬化物、硬化物の製造方法、塩、並びにポリイミド膜形成用組成物の経時変化抑制及び成膜性向上剤
JP6503508B2 (ja) * 2018-08-03 2019-04-17 Ｊｘｔｇエネルギー株式会社 テトラカルボン酸二無水物、ポリイミド前駆体樹脂、ポリイミド、ポリイミド前駆体樹脂溶液、ポリイミド溶液及びポリイミドフィルム
JP2020125466A (ja) * 2019-01-31 2020-08-20 Ｊｘｔｇエネルギー株式会社 ポリイミドアロイ、ポリイミドアロイ前駆体樹脂組成物、ポリイミドアロイ前駆体樹脂溶液、及び、ポリイミドアロイの製造方法

Also Published As

Publication number Publication date
WO2022114136A1 (ja) 2022-06-02
TW202227535A (zh) 2022-07-16
CN116457211A (zh) 2023-07-18
KR20230106702A (ko) 2023-07-13

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