JPWO2022102451A1 - - Google Patents
Info
- Publication number
- JPWO2022102451A1 JPWO2022102451A1 JP2022523343A JP2022523343A JPWO2022102451A1 JP WO2022102451 A1 JPWO2022102451 A1 JP WO2022102451A1 JP 2022523343 A JP2022523343 A JP 2022523343A JP 2022523343 A JP2022523343 A JP 2022523343A JP WO2022102451 A1 JPWO2022102451 A1 JP WO2022102451A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020187367 | 2020-11-10 | ||
PCT/JP2021/040230 WO2022102451A1 (ja) | 2020-11-10 | 2021-11-01 | ポリイミドフィルムおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022102451A1 true JPWO2022102451A1 (ko) | 2022-05-19 |
Family
ID=81602217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022523343A Pending JPWO2022102451A1 (ko) | 2020-11-10 | 2021-11-01 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022102451A1 (ko) |
KR (1) | KR20230098789A (ko) |
CN (1) | CN116137837A (ko) |
TW (1) | TW202222914A (ko) |
WO (1) | WO2022102451A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115058040B (zh) * | 2022-06-23 | 2023-10-03 | 华中科技大学 | 一种双层聚酰亚胺薄膜及其制备方法和应用 |
CN115141372B (zh) * | 2022-08-08 | 2024-01-26 | 波米科技有限公司 | 一种聚酰亚胺类物质及其应用 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3425854B2 (ja) | 1997-10-02 | 2003-07-14 | 日本電信電話株式会社 | 低屈折率透明ポリイミド共重合体、及びそれらの前駆体溶液、及びそれらの製造方法 |
JP2002146021A (ja) | 2000-11-10 | 2002-05-22 | Ube Ind Ltd | 可溶性、透明なポリイミドおよびその製造法 |
JP2002348374A (ja) | 2001-05-25 | 2002-12-04 | Hitachi Cable Ltd | ポリアミック酸又はポリイミド及び液晶配向剤 |
ES2392000T3 (es) | 2007-05-24 | 2012-12-03 | Mitsubishi Gas Chemical Company, Inc. | Procedimiento y aparato de producción de película de resina transparente incolora |
KR102014627B1 (ko) * | 2015-02-09 | 2019-08-26 | 코니카 미놀타 가부시키가이샤 | 투명 내열성 적층 필름의 제조 방법, 투명 내열성 적층 필름, 플렉시블 프린트 기판, 플렉시블 디스플레이용 기판, 플렉시블 디스플레이용 전방면판, led 조명 장치 및 유기 일렉트로루미네센스 표시 장치 |
KR102109787B1 (ko) * | 2016-12-27 | 2020-05-12 | 주식회사 엘지화학 | 플라스틱 적층 필름 |
JP6973476B2 (ja) * | 2017-04-06 | 2021-12-01 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
KR20220002628A (ko) * | 2019-06-27 | 2022-01-06 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 수지필름, 금속박적층체 및 그 제조방법 |
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2021
- 2021-11-01 KR KR1020237011998A patent/KR20230098789A/ko unknown
- 2021-11-01 CN CN202180057843.3A patent/CN116137837A/zh active Pending
- 2021-11-01 WO PCT/JP2021/040230 patent/WO2022102451A1/ja active Application Filing
- 2021-11-01 JP JP2022523343A patent/JPWO2022102451A1/ja active Pending
- 2021-11-03 TW TW110140901A patent/TW202222914A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230098789A (ko) | 2023-07-04 |
WO2022102451A1 (ja) | 2022-05-19 |
TW202222914A (zh) | 2022-06-16 |
CN116137837A (zh) | 2023-05-19 |