JPWO2022074893A1 - - Google Patents

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Publication number
JPWO2022074893A1
JPWO2022074893A1 JP2022555271A JP2022555271A JPWO2022074893A1 JP WO2022074893 A1 JPWO2022074893 A1 JP WO2022074893A1 JP 2022555271 A JP2022555271 A JP 2022555271A JP 2022555271 A JP2022555271 A JP 2022555271A JP WO2022074893 A1 JPWO2022074893 A1 JP WO2022074893A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022555271A
Other versions
JP7437525B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022074893A1 publication Critical patent/JPWO2022074893A1/ja
Application granted granted Critical
Publication of JP7437525B2 publication Critical patent/JP7437525B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2022555271A 2020-10-08 2021-07-15 回転式カソードユニット用の駆動ブロック Active JP7437525B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020170773 2020-10-08
JP2020170773 2020-10-08
PCT/JP2021/026577 WO2022074893A1 (ja) 2020-10-08 2021-07-15 回転式カソードユニット用の駆動ブロック

Publications (2)

Publication Number Publication Date
JPWO2022074893A1 true JPWO2022074893A1 (ja) 2022-04-14
JP7437525B2 JP7437525B2 (ja) 2024-02-22

Family

ID=81126420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555271A Active JP7437525B2 (ja) 2020-10-08 2021-07-15 回転式カソードユニット用の駆動ブロック

Country Status (5)

Country Link
JP (1) JP7437525B2 (ja)
KR (1) KR20230012046A (ja)
CN (1) CN116057199B (ja)
TW (1) TWI853183B (ja)
WO (1) WO2022074893A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007191756A (ja) * 2006-01-19 2007-08-02 Raiku:Kk 成膜装置及び成膜方法
JP2009513818A (ja) * 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
JP2010150579A (ja) * 2008-12-24 2010-07-08 Canon Anelva Corp スパッタリング装置
JP2015510039A (ja) * 2012-02-13 2015-04-02 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー オンライン調整可能マグネットバー
JP2017519899A (ja) * 2014-04-28 2017-07-20 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
JP2020007575A (ja) * 2018-07-02 2020-01-16 キヤノン株式会社 成膜装置およびそれを用いた成膜方法
JP2020019990A (ja) * 2018-07-31 2020-02-06 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016185714A (ja) 2015-03-27 2016-10-27 矢崎総業株式会社 ハーネス配索構造
CN107614743B (zh) * 2015-05-19 2019-10-22 株式会社爱发科 磁控溅射装置用的旋转阴极单元
KR20170076314A (ko) * 2015-12-24 2017-07-04 (주)에스엔텍 증착 장치용 캐소드 전극
WO2019087724A1 (ja) * 2017-11-01 2019-05-09 株式会社アルバック スパッタリング装置及び成膜方法
CN111386359B (zh) * 2018-10-17 2021-03-16 株式会社爱发科 接触式供电装置和接触单元

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009513818A (ja) * 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
JP2007191756A (ja) * 2006-01-19 2007-08-02 Raiku:Kk 成膜装置及び成膜方法
JP2010150579A (ja) * 2008-12-24 2010-07-08 Canon Anelva Corp スパッタリング装置
JP2015510039A (ja) * 2012-02-13 2015-04-02 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー オンライン調整可能マグネットバー
JP2017519899A (ja) * 2014-04-28 2017-07-20 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
JP2020007575A (ja) * 2018-07-02 2020-01-16 キヤノン株式会社 成膜装置およびそれを用いた成膜方法
JP2020019990A (ja) * 2018-07-31 2020-02-06 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法

Also Published As

Publication number Publication date
WO2022074893A1 (ja) 2022-04-14
KR20230012046A (ko) 2023-01-25
TW202231895A (zh) 2022-08-16
TWI853183B (zh) 2024-08-21
CN116057199B (zh) 2024-09-03
CN116057199A (zh) 2023-05-02
JP7437525B2 (ja) 2024-02-22

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