JPWO2022049787A1 - - Google Patents

Info

Publication number
JPWO2022049787A1
JPWO2022049787A1 JP2022546870A JP2022546870A JPWO2022049787A1 JP WO2022049787 A1 JPWO2022049787 A1 JP WO2022049787A1 JP 2022546870 A JP2022546870 A JP 2022546870A JP 2022546870 A JP2022546870 A JP 2022546870A JP WO2022049787 A1 JPWO2022049787 A1 JP WO2022049787A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022546870A
Other versions
JP7427796B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022049787A1 publication Critical patent/JPWO2022049787A1/ja
Application granted granted Critical
Publication of JP7427796B2 publication Critical patent/JP7427796B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0004—Gripping heads and other end effectors with provision for adjusting the gripped object in the hand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
JP2022546870A 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット Active JP7427796B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148494 2020-09-03
JP2020148494 2020-09-03
PCT/JP2020/041030 WO2022049787A1 (ja) 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット

Publications (2)

Publication Number Publication Date
JPWO2022049787A1 true JPWO2022049787A1 (ja) 2022-03-10
JP7427796B2 JP7427796B2 (ja) 2024-02-05

Family

ID=80490961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546870A Active JP7427796B2 (ja) 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット

Country Status (6)

Country Link
US (1) US20230311339A1 (ja)
JP (1) JP7427796B2 (ja)
KR (1) KR20230048134A (ja)
CN (1) CN116325108A (ja)
TW (1) TWI779382B (ja)
WO (1) WO2022049787A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11165863A (ja) * 1997-12-02 1999-06-22 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH11312723A (ja) * 1998-04-30 1999-11-09 Dainippon Screen Mfg Co Ltd 基板搬送装置および方法
JP2003019687A (ja) * 2001-07-03 2003-01-21 Aitec:Kk ロボットハンドの駆動装置
JP2007283436A (ja) * 2006-04-17 2007-11-01 Nachi Fujikoshi Corp ロボット、ロボットシステム及びハンド装置の姿勢制御方法
JP2010067871A (ja) * 2008-09-12 2010-03-25 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを備えた基板処理装置
WO2017037976A1 (ja) * 2015-09-03 2017-03-09 川崎重工業株式会社 基板移載装置
JP2019519913A (ja) * 2016-05-05 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 亀裂が低減されたロボットサブアセンブリ、エンドエフェクタアセンブリ、及び方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203962A (ja) 2002-01-07 2003-07-18 Kondo Seisakusho:Kk ウエハ把持装置
JP5553065B2 (ja) 2011-09-22 2014-07-16 株式会社安川電機 基板搬送用ハンドおよび基板搬送ロボット
JP7137047B2 (ja) * 2018-03-15 2022-09-14 シンフォニアテクノロジー株式会社 Ｅｆｅｍ、及び、ｅｆｅｍにおけるガス置換方法
TWI805795B (zh) * 2018-07-20 2023-06-21 美商應用材料股份有限公司 基板定位設備與方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11165863A (ja) * 1997-12-02 1999-06-22 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH11312723A (ja) * 1998-04-30 1999-11-09 Dainippon Screen Mfg Co Ltd 基板搬送装置および方法
JP2003019687A (ja) * 2001-07-03 2003-01-21 Aitec:Kk ロボットハンドの駆動装置
JP2007283436A (ja) * 2006-04-17 2007-11-01 Nachi Fujikoshi Corp ロボット、ロボットシステム及びハンド装置の姿勢制御方法
JP2010067871A (ja) * 2008-09-12 2010-03-25 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを備えた基板処理装置
WO2017037976A1 (ja) * 2015-09-03 2017-03-09 川崎重工業株式会社 基板移載装置
JP2019519913A (ja) * 2016-05-05 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 亀裂が低減されたロボットサブアセンブリ、エンドエフェクタアセンブリ、及び方法

Also Published As

Publication number Publication date
CN116325108A (zh) 2023-06-23
JP7427796B2 (ja) 2024-02-05
US20230311339A1 (en) 2023-10-05
KR20230048134A (ko) 2023-04-10
TWI779382B (zh) 2022-10-01
WO2022049787A1 (ja) 2022-03-10
TW202211366A (zh) 2022-03-16

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112021014123A2 (ja)
BR112023012656A2 (ja)
BR112022024743A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018167A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)
BR102021016200A2 (ja)
BR102021015566A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230808

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230929

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231121

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240105

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240123

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240124

R150 Certificate of patent or registration of utility model

Ref document number: 7427796

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150