JPWO2022045120A1 - - Google Patents

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Publication number
JPWO2022045120A1
JPWO2022045120A1 JP2022544616A JP2022544616A JPWO2022045120A1 JP WO2022045120 A1 JPWO2022045120 A1 JP WO2022045120A1 JP 2022544616 A JP2022544616 A JP 2022544616A JP 2022544616 A JP2022544616 A JP 2022544616A JP WO2022045120 A1 JPWO2022045120 A1 JP WO2022045120A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022544616A
Other languages
Japanese (ja)
Other versions
JP7629930B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022045120A1 publication Critical patent/JPWO2022045120A1/ja
Priority to JP2024197497A priority Critical patent/JP2025020376A/ja
Application granted granted Critical
Publication of JP7629930B2 publication Critical patent/JP7629930B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP2022544616A 2020-08-28 2021-08-24 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス Active JP7629930B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024197497A JP2025020376A (ja) 2020-08-28 2024-11-12 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020143993 2020-08-28
JP2020143993 2020-08-28
PCT/JP2021/030958 WO2022045120A1 (ja) 2020-08-28 2021-08-24 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024197497A Division JP2025020376A (ja) 2020-08-28 2024-11-12 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2022045120A1 true JPWO2022045120A1 (enrdf_load_stackoverflow) 2022-03-03
JP7629930B2 JP7629930B2 (ja) 2025-02-14

Family

ID=80353283

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022544616A Active JP7629930B2 (ja) 2020-08-28 2021-08-24 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
JP2024197497A Pending JP2025020376A (ja) 2020-08-28 2024-11-12 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024197497A Pending JP2025020376A (ja) 2020-08-28 2024-11-12 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Country Status (3)

Country Link
JP (2) JP7629930B2 (enrdf_load_stackoverflow)
KR (1) KR102796438B1 (enrdf_load_stackoverflow)
WO (1) WO2022045120A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250018531A (ko) * 2022-06-02 2025-02-06 도쿄 오카 고교 가부시키가이샤 폴리이미드 수지 전구체
CN116731063A (zh) * 2022-06-14 2023-09-12 北京鼎材科技有限公司 一种硅烷偶联剂及其应用、包含其的光敏树脂组合物
CN116375591B (zh) * 2023-06-05 2023-10-03 中节能万润股份有限公司 一种含双键的聚酰亚胺二胺单体的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001092133A (ja) * 1999-09-24 2001-04-06 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、感光材料、レリーフパターンの製造法及びポリイミドパターンの製造法
JP2019053220A (ja) * 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5041134B2 (ja) 2006-01-30 2012-10-03 Ｊｓｒ株式会社 液晶の配向剤、配向膜および液晶表示素子
JP6245180B2 (ja) * 2012-12-21 2017-12-13 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体樹脂組成物
WO2017131037A1 (ja) * 2016-01-29 2017-08-03 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法、および半導体デバイス
TWI767436B (zh) * 2016-02-26 2022-06-11 日商富士軟片股份有限公司 積層體的製造方法、半導體元件的製造方法及再配線層的製造方法
JP2018180227A (ja) 2017-04-11 2018-11-15 Jnc株式会社 光配向法に用いる光配向用液晶配向剤、およびそれを用いた光配向膜、液晶表示素子
TWI742285B (zh) * 2017-06-06 2021-10-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001092133A (ja) * 1999-09-24 2001-04-06 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、感光材料、レリーフパターンの製造法及びポリイミドパターンの製造法
JP2019053220A (ja) * 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Also Published As

Publication number Publication date
WO2022045120A1 (ja) 2022-03-03
KR20230044484A (ko) 2023-04-04
JP2025020376A (ja) 2025-02-12
JP7629930B2 (ja) 2025-02-14
KR102796438B1 (ko) 2025-04-16
TW202219637A (zh) 2022-05-16

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